USD797690S1 - Heater for semiconductor manufacturing apparatus - Google Patents
Heater for semiconductor manufacturing apparatus Download PDFInfo
- Publication number
- USD797690S1 USD797690S1 US29/539,509 US201529539509F USD797690S US D797690 S1 USD797690 S1 US D797690S1 US 201529539509 F US201529539509 F US 201529539509F US D797690 S USD797690 S US D797690S
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- US
- United States
- Prior art keywords
- heater
- manufacturing apparatus
- semiconductor manufacturing
- view
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a heater for semiconductor manufacturing apparatus, as illustrated and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-005626 | 2015-03-16 | ||
JPD2015-5626F JP1541874S (en) | 2015-03-16 | 2015-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD797690S1 true USD797690S1 (en) | 2017-09-19 |
Family
ID=55133697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/539,509 Active USD797690S1 (en) | 2015-03-16 | 2015-09-15 | Heater for semiconductor manufacturing apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | USD797690S1 (en) |
JP (1) | JP1541874S (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD826185S1 (en) * | 2016-10-14 | 2018-08-21 | Hitachi Kokusai Electric Inc. | Ceiling heater for substrate processing apparatus |
USD839223S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD839222S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD839221S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD841605S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
USD841606S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
USD842260S1 (en) * | 2017-05-30 | 2019-03-05 | TinyPCB, Inc. | Modular circuit board |
USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
USD875057S1 (en) * | 2017-05-26 | 2020-02-11 | Tiny PCB, Inc. | Modular circuit board |
USD887358S1 (en) * | 2018-12-06 | 2020-06-16 | Lofelt Gmbh | Motor membrane |
USD913230S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD913229S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD936187S1 (en) * | 2020-02-12 | 2021-11-16 | Applied Materials, Inc. | Gas distribution assembly lid |
USD959393S1 (en) * | 2020-09-24 | 2022-08-02 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1258760A (en) * | 1915-07-19 | 1918-03-12 | Thomas Bates | Stove-lid. |
USD313072S (en) * | 1988-02-10 | 1990-12-18 | Redring Electric Limited | Electric heater element for use in a radiant heater for a glass ceramic hob |
US5043559A (en) * | 1989-11-04 | 1991-08-27 | Ceramaspeed Limited | Radiant electric heaters |
US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
US6080970A (en) * | 1997-12-26 | 2000-06-27 | Kyocera Corporation | Wafer heating apparatus |
US6207935B1 (en) * | 1996-09-21 | 2001-03-27 | Diehl Ako Stiftung & Co. Kg | Radiant heating element with a metal foil heat conductor |
US20020088111A1 (en) * | 2000-04-07 | 2002-07-11 | Theodore Von Arx | Molded assembly with heating element captured therein |
US20020190051A1 (en) * | 2001-06-15 | 2002-12-19 | Applied Materials, Inc. | Low profile thick film heaters in multi-slot bake chamber |
US20030121898A1 (en) * | 2001-11-26 | 2003-07-03 | Tom Kane | Heated vacuum support apparatus |
US6753507B2 (en) * | 2001-04-27 | 2004-06-22 | Kyocera Corporation | Wafer heating apparatus |
US6806443B2 (en) * | 2002-04-24 | 2004-10-19 | Sumitomo Electric Industries, Ltd. | Ceramic susceptor |
US20060130763A1 (en) * | 2004-11-15 | 2006-06-22 | Emerson David T | Restricted radiated heating assembly for high temperature processing |
US20070221657A1 (en) * | 2006-03-24 | 2007-09-27 | Nuflare Technology, Inc. | Semiconductor manufacturing equipment and heater |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US7777160B2 (en) * | 2007-12-17 | 2010-08-17 | Momentive Performance Materials Inc. | Electrode tuning method and apparatus for a layered heater structure |
US20110039399A1 (en) * | 2009-08-12 | 2011-02-17 | Kunihiko Suzuki | Manufacturing apparatus and method for semiconductor device |
US20130068164A1 (en) * | 2011-09-20 | 2013-03-21 | Naohisa Ikeya | Heating unit and film-forming apparatus |
US8610034B2 (en) * | 2008-08-26 | 2013-12-17 | Nuflare Technology, Inc. | Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device |
USD716774S1 (en) * | 2014-04-04 | 2014-11-04 | Avery Dennison Corporation | RFID inlay |
US20160270150A1 (en) * | 2015-03-09 | 2016-09-15 | Nuflare Technology, Inc. | Heater and apparatus for manufacturing semiconductor device using heater |
-
2015
- 2015-03-16 JP JPD2015-5626F patent/JP1541874S/ja active Active
- 2015-09-15 US US29/539,509 patent/USD797690S1/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1258760A (en) * | 1915-07-19 | 1918-03-12 | Thomas Bates | Stove-lid. |
USD313072S (en) * | 1988-02-10 | 1990-12-18 | Redring Electric Limited | Electric heater element for use in a radiant heater for a glass ceramic hob |
US5043559A (en) * | 1989-11-04 | 1991-08-27 | Ceramaspeed Limited | Radiant electric heaters |
US6207935B1 (en) * | 1996-09-21 | 2001-03-27 | Diehl Ako Stiftung & Co. Kg | Radiant heating element with a metal foil heat conductor |
US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
US6080970A (en) * | 1997-12-26 | 2000-06-27 | Kyocera Corporation | Wafer heating apparatus |
US20020088111A1 (en) * | 2000-04-07 | 2002-07-11 | Theodore Von Arx | Molded assembly with heating element captured therein |
US6753507B2 (en) * | 2001-04-27 | 2004-06-22 | Kyocera Corporation | Wafer heating apparatus |
US20020190051A1 (en) * | 2001-06-15 | 2002-12-19 | Applied Materials, Inc. | Low profile thick film heaters in multi-slot bake chamber |
US20030121898A1 (en) * | 2001-11-26 | 2003-07-03 | Tom Kane | Heated vacuum support apparatus |
US6806443B2 (en) * | 2002-04-24 | 2004-10-19 | Sumitomo Electric Industries, Ltd. | Ceramic susceptor |
US20060130763A1 (en) * | 2004-11-15 | 2006-06-22 | Emerson David T | Restricted radiated heating assembly for high temperature processing |
US20070221657A1 (en) * | 2006-03-24 | 2007-09-27 | Nuflare Technology, Inc. | Semiconductor manufacturing equipment and heater |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
US7777160B2 (en) * | 2007-12-17 | 2010-08-17 | Momentive Performance Materials Inc. | Electrode tuning method and apparatus for a layered heater structure |
US8610034B2 (en) * | 2008-08-26 | 2013-12-17 | Nuflare Technology, Inc. | Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device |
USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US20110039399A1 (en) * | 2009-08-12 | 2011-02-17 | Kunihiko Suzuki | Manufacturing apparatus and method for semiconductor device |
US20130068164A1 (en) * | 2011-09-20 | 2013-03-21 | Naohisa Ikeya | Heating unit and film-forming apparatus |
USD716774S1 (en) * | 2014-04-04 | 2014-11-04 | Avery Dennison Corporation | RFID inlay |
US20160270150A1 (en) * | 2015-03-09 | 2016-09-15 | Nuflare Technology, Inc. | Heater and apparatus for manufacturing semiconductor device using heater |
Non-Patent Citations (1)
Title |
---|
Cast Aluminum Solutions, dated Aug. 23, 2011, [online], [site visited Apr. 27, 2017]. Available from Internet, <URL: http://www.castaluminumsolutions.com/capabilities.htm>. * |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
USD826185S1 (en) * | 2016-10-14 | 2018-08-21 | Hitachi Kokusai Electric Inc. | Ceiling heater for substrate processing apparatus |
USD875057S1 (en) * | 2017-05-26 | 2020-02-11 | Tiny PCB, Inc. | Modular circuit board |
USD841605S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
USD839221S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD841606S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
USD842260S1 (en) * | 2017-05-30 | 2019-03-05 | TinyPCB, Inc. | Modular circuit board |
USD839222S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD839223S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
USD887358S1 (en) * | 2018-12-06 | 2020-06-16 | Lofelt Gmbh | Motor membrane |
USD913230S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD913229S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD936187S1 (en) * | 2020-02-12 | 2021-11-16 | Applied Materials, Inc. | Gas distribution assembly lid |
USD959393S1 (en) * | 2020-09-24 | 2022-08-02 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1541874S (en) | 2016-01-18 |
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