USD405427S - Heat retaining tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Heat retaining tube for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD405427S
USD405427S US29/074,278 US7427897F USD405427S US D405427 S USD405427 S US D405427S US 7427897 F US7427897 F US 7427897F US D405427 S USD405427 S US D405427S
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US
United States
Prior art keywords
processing apparatus
semiconductor wafer
retaining tube
heat
heat processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/074,278
Inventor
Katsutoshi Ishii
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHII, KATSUTOSHI
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Description

FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof, the rear elevational view is identical with the front view;
FIG. 4: a right side view thereof, the left side view being a mirror image of the right view;
FIG. 5: a bottom plan view thereof; and,
FIG. 6: a cross sectional view thereof taken along line VI--VI in FIG. 3.

Claims (1)

  1. I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/074,278 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD405427S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-2649 1997-01-31
JP264997 1997-01-31

Publications (1)

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USD405427S true USD405427S (en) 1999-02-09

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US29/074,278 Expired - Lifetime USD405427S (en) 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD907592S1 (en) * 2017-05-03 2021-01-12 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus

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