USD405062S - Processing tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Processing tube for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD405062S
USD405062S US29/083,422 US8342298F USD405062S US D405062 S USD405062 S US D405062S US 8342298 F US8342298 F US 8342298F US D405062 S USD405062 S US D405062S
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US
United States
Prior art keywords
semiconductor wafer
wafer heat
processing apparatus
tube
heat processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/083,422
Inventor
Tomohisa Shimazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, TOMOHISA
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Publication of USD405062S publication Critical patent/USD405062S/en
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Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof;
FIG. 5 a rear elevational view thereof;
FIG. 6 a left side view thereof;
FIG. 7 a right side view thereof;
FIG. 8 a cross-sectional view taken along line VIII-VIII in FIG. 3;
FIG. 9 a cross-sectional view taken along line IX-IX in FIG. 2; and,
FIG. 10 a cross-sectional view taken along line X-X in FIG. 3.

Claims (1)

  1. I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/083,422 1997-08-20 1998-02-05 Processing tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD405062S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-65092 1997-08-20
JP6509297 1997-08-20

Publications (1)

Publication Number Publication Date
USD405062S true USD405062S (en) 1999-02-02

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US29/083,422 Expired - Lifetime USD405062S (en) 1997-08-20 1998-02-05 Processing tube for use in a semiconductor wafer heat processing apparatus

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD778458S1 (en) * 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD919583S1 (en) 2020-08-26 2021-05-18 Mahdi Al-Husseini Mortarboard with electronic tube display
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) * 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5320218A (en) * 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5518360A (en) * 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) * 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5518360A (en) * 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5320218A (en) * 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD778458S1 (en) * 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD919583S1 (en) 2020-08-26 2021-05-18 Mahdi Al-Husseini Mortarboard with electronic tube display

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