USD404371S - Wafer boat for use in a semiconductor wafer heat processing apparatus - Google Patents

Wafer boat for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD404371S
USD404371S US29/083,425 US8342598F USD404371S US D404371 S USD404371 S US D404371S US 8342598 F US8342598 F US 8342598F US D404371 S USD404371 S US D404371S
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United States
Prior art keywords
processing apparatus
heat processing
semiconductor wafer
wafer
boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/083,425
Inventor
Tomohisa Shimazu
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, TOMOSHISA
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Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2;
FIG. 5 a top plan view thereof;
FIG. 6 a right side view thereof;
FIG. 7 a rear elevational view thereof; and,
FIG. 8 a bottom plan view thereof.

Claims (1)

  1. I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/083,425 1997-08-20 1998-02-05 Wafer boat for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD404371S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6509997 1997-08-20
JP9-65099 1997-08-20

Publications (1)

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USD404371S true USD404371S (en) 1999-01-19

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US29/083,425 Expired - Lifetime USD404371S (en) 1997-08-20 1998-02-05 Wafer boat for use in a semiconductor wafer heat processing apparatus

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6196211B1 (en) 1999-04-15 2001-03-06 Integrated Materials, Inc. Support members for wafer processing fixtures
US6205993B1 (en) 1999-04-15 2001-03-27 Integrated Materials, Inc. Method and apparatus for fabricating elongate crystalline members
US6225594B1 (en) 1999-04-15 2001-05-01 Integrated Materials, Inc. Method and apparatus for securing components of wafer processing fixtures
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
US6455395B1 (en) 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US20040129203A1 (en) * 2001-05-18 2004-07-08 Raanan Zehavi Silicon tube formed of bonded staves
US20060216942A1 (en) * 2005-03-23 2006-09-28 Samsung Electronics Co., Ltd. Wafer carrier for minimizing contacting area with wafers
US20070006799A1 (en) * 2001-05-18 2007-01-11 Zehavi Ranaan Y Silicon wafer support fixture with roughended surface
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6196211B1 (en) 1999-04-15 2001-03-06 Integrated Materials, Inc. Support members for wafer processing fixtures
US6205993B1 (en) 1999-04-15 2001-03-27 Integrated Materials, Inc. Method and apparatus for fabricating elongate crystalline members
US6225594B1 (en) 1999-04-15 2001-05-01 Integrated Materials, Inc. Method and apparatus for securing components of wafer processing fixtures
US6357432B2 (en) 1999-04-15 2002-03-19 Integrated Materials, Inc. Silicon support members for wafer processing fixtures
US6617540B2 (en) 1999-04-15 2003-09-09 Integrated Materials, Inc. Wafer support fixture composed of silicon
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
US6455395B1 (en) 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US6617225B2 (en) 2000-06-30 2003-09-09 Integrated Materials, Inc. Method of machining silicon
US20040129203A1 (en) * 2001-05-18 2004-07-08 Raanan Zehavi Silicon tube formed of bonded staves
US7137546B2 (en) * 2001-05-18 2006-11-21 Integrated Materials, Inc. Silicon tube formed of bonded staves
US20070006799A1 (en) * 2001-05-18 2007-01-11 Zehavi Ranaan Y Silicon wafer support fixture with roughended surface
US20070020885A1 (en) * 2001-05-18 2007-01-25 Integrated Materials, Inc. Tube Formed of Bonded Silicon Staves
US7854974B2 (en) 2001-05-18 2010-12-21 Integrated Materials, Inc. Tube formed of bonded silicon staves
US20060216942A1 (en) * 2005-03-23 2006-09-28 Samsung Electronics Co., Ltd. Wafer carrier for minimizing contacting area with wafers
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
US10861727B2 (en) * 2018-03-13 2020-12-08 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus

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