USD404371S - Wafer boat for use in a semiconductor wafer heat processing apparatus - Google Patents
Wafer boat for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD404371S USD404371S US29/083,425 US8342598F USD404371S US D404371 S USD404371 S US D404371S US 8342598 F US8342598 F US 8342598F US D404371 S USD404371 S US D404371S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- heat processing
- semiconductor wafer
- wafer
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2;
FIG. 5 a top plan view thereof;
FIG. 6 a right side view thereof;
FIG. 7 a rear elevational view thereof; and,
FIG. 8 a bottom plan view thereof.
Claims (1)
- I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6509997 | 1997-08-20 | ||
JP9-65099 | 1997-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD404371S true USD404371S (en) | 1999-01-19 |
Family
ID=71729423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/083,425 Expired - Lifetime USD404371S (en) | 1997-08-20 | 1998-02-05 | Wafer boat for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
Country | Link |
---|---|
US (1) | USD404371S (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6196211B1 (en) | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
US20060216942A1 (en) * | 2005-03-23 | 2006-09-28 | Samsung Electronics Co., Ltd. | Wafer carrier for minimizing contacting area with wafers |
US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD763807S1 (en) * | 2014-05-22 | 2016-08-16 | Hzo, Inc. | Boat for a deposition apparatus |
USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
US20190287832A1 (en) * | 2018-03-13 | 2019-09-19 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
-
1998
- 1998-02-05 US US29/083,425 patent/USD404371S/en not_active Expired - Lifetime
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6196211B1 (en) | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
US6357432B2 (en) | 1999-04-15 | 2002-03-19 | Integrated Materials, Inc. | Silicon support members for wafer processing fixtures |
US6617540B2 (en) | 1999-04-15 | 2003-09-09 | Integrated Materials, Inc. | Wafer support fixture composed of silicon |
US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
US6617225B2 (en) | 2000-06-30 | 2003-09-09 | Integrated Materials, Inc. | Method of machining silicon |
US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
US7137546B2 (en) * | 2001-05-18 | 2006-11-21 | Integrated Materials, Inc. | Silicon tube formed of bonded staves |
US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
US20070020885A1 (en) * | 2001-05-18 | 2007-01-25 | Integrated Materials, Inc. | Tube Formed of Bonded Silicon Staves |
US7854974B2 (en) | 2001-05-18 | 2010-12-21 | Integrated Materials, Inc. | Tube formed of bonded silicon staves |
US20060216942A1 (en) * | 2005-03-23 | 2006-09-28 | Samsung Electronics Co., Ltd. | Wafer carrier for minimizing contacting area with wafers |
USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
USD763807S1 (en) * | 2014-05-22 | 2016-08-16 | Hzo, Inc. | Boat for a deposition apparatus |
USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
US10861727B2 (en) * | 2018-03-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
US20190287832A1 (en) * | 2018-03-13 | 2019-09-19 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
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