USD411176S - Wafer boat for use in a semiconductor wafer heat processing apparatus - Google Patents
Wafer boat for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD411176S USD411176S US29/083,421 US8342198F USD411176S US D411176 S USD411176 S US D411176S US 8342198 F US8342198 F US 8342198F US D411176 S USD411176 S US D411176S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- heat processing
- semiconductor wafer
- wafer
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof.
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2.
FIG. 5 a rear elevational view thereof.
FIG. 6 a right side view thereof.
FIG. 7 a top plan view thereof; and,
FIG. 8 a bottom plan view thereof.
Claims (1)
- I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509897 | 1997-08-20 | ||
| JP9-65098 | 1997-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD411176S true USD411176S (en) | 1999-06-22 |
Family
ID=71734945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/083,421 Expired - Lifetime USD411176S (en) | 1997-08-20 | 1998-02-05 | Wafer boat for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD411176S (en) |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6196211B1 (en) * | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
| US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
| US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
| US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
| US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
| US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
| US7498062B2 (en) | 2004-05-26 | 2009-03-03 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
| US8267831B1 (en) | 2009-05-19 | 2012-09-18 | Western Digital Technologies, Inc. | Method and apparatus for washing, etching, rinsing, and plating substrates |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
| USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
| USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
| USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
| USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
| USD1022933S1 (en) * | 2021-08-27 | 2024-04-16 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
-
1998
- 1998-02-05 US US29/083,421 patent/USD411176S/en not_active Expired - Lifetime
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6196211B1 (en) * | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
| US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
| US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
| US6357432B2 (en) | 1999-04-15 | 2002-03-19 | Integrated Materials, Inc. | Silicon support members for wafer processing fixtures |
| US6617540B2 (en) | 1999-04-15 | 2003-09-09 | Integrated Materials, Inc. | Wafer support fixture composed of silicon |
| US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
| US6617225B2 (en) | 2000-06-30 | 2003-09-09 | Integrated Materials, Inc. | Method of machining silicon |
| US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
| US7137546B2 (en) * | 2001-05-18 | 2006-11-21 | Integrated Materials, Inc. | Silicon tube formed of bonded staves |
| US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
| US20070020885A1 (en) * | 2001-05-18 | 2007-01-25 | Integrated Materials, Inc. | Tube Formed of Bonded Silicon Staves |
| US7854974B2 (en) | 2001-05-18 | 2010-12-21 | Integrated Materials, Inc. | Tube formed of bonded silicon staves |
| US7498062B2 (en) | 2004-05-26 | 2009-03-03 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
| US7758732B1 (en) | 2004-05-26 | 2010-07-20 | Wd Media, Inc. | Method and apparatus for applying a voltage to a substrate during plating |
| US8267831B1 (en) | 2009-05-19 | 2012-09-18 | Western Digital Technologies, Inc. | Method and apparatus for washing, etching, rinsing, and plating substrates |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
| USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
| USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
| USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
| USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
| USD1022933S1 (en) * | 2021-08-27 | 2024-04-16 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
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