USD1022933S1 - Wafer support of semiconductor manufacturing apparatus - Google Patents

Description

FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 ; and,

FIG. 9 is an enlarged view taken from encircled portion labeled, “9,” in FIG. 8 .

The broken lines in FIGS. 8 and 9 define the boundary of the enlarged portion view of FIG. 9 and form no part of the claimed design.

Claims (1)

CLAIM
1. The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.

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