TWD197467S - 基板處理裝置用氣體導入管 - Google Patents
基板處理裝置用氣體導入管Info
- Publication number
- TWD197467S TWD197467S TW107306664F TW107306664F TWD197467S TW D197467 S TWD197467 S TW D197467S TW 107306664 F TW107306664 F TW 107306664F TW 107306664 F TW107306664 F TW 107306664F TW D197467 S TWD197467 S TW D197467S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- processing equipment
- gas introduction
- introduction tube
- processing device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板處理裝置用氣體導入管，為一種應用在處理晶圓的基板處理裝置的氣體導入管；本物品是連接於配置在基板處理裝置的處理室內的氣體供給噴嘴，用於將氣體導入到氣體供給噴嘴。;【設計說明】;(無)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-15808F JP1624352S (zh) | 2018-07-19 | 2018-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD197467S true TWD197467S (zh) | 2019-05-11 |
Family
ID=65269374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107306664F TWD197467S (zh) | 2018-07-19 | 2018-11-12 | 基板處理裝置用氣體導入管 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD924953S1 (zh) |
| JP (1) | JP1624352S (zh) |
| TW (1) | TWD197467S (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1651622S (zh) * | 2019-07-17 | 2020-01-27 | ||
| JP1685215S (ja) | 2020-08-18 | 2024-05-10 | 基板処理装置用ガス導入管 | |
| JP1700780S (zh) | 2021-03-22 | 2021-11-29 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| US20030159653A1 (en) * | 2002-02-28 | 2003-08-28 | Dando Ross S. | Manifold assembly for feeding reactive precursors to substrate processing chambers |
| JP5137366B2 (ja) * | 2006-01-24 | 2013-02-06 | 株式会社日立国際電気 | 基板処理システム及び液体材料供給装置 |
| US7700054B2 (en) * | 2006-12-12 | 2010-04-20 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus having gas side flow via gas inlet |
| US20130220221A1 (en) * | 2012-02-23 | 2013-08-29 | Applied Materials, Inc. | Method and apparatus for precursor delivery |
| US20130276707A1 (en) * | 2012-04-23 | 2013-10-24 | Asm Ip Holding B.V. | Vertical furnace with circumferentially distributed gas inlet system |
| TWI473903B (zh) * | 2013-02-23 | 2015-02-21 | Hermes Epitek Corp | 應用於半導體設備的噴射器與上蓋板總成 |
| US10683571B2 (en) * | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
| JP6578243B2 (ja) * | 2015-07-17 | 2019-09-18 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | ガス供給ノズル、基板処理装置、半導体装置の製造方法およびプログラム |
| KR101710944B1 (ko) * | 2015-09-11 | 2017-02-28 | 주식회사 유진테크 | 기판처리장치 |
| KR102483924B1 (ko) * | 2016-02-18 | 2023-01-02 | 삼성전자주식회사 | 기화기 및 이를 구비하는 박막 증착 장치 |
| TWI677593B (zh) * | 2016-04-01 | 2019-11-21 | 美商應用材料股份有限公司 | 用於提供均勻流動的氣體的設備及方法 |
| JP6710134B2 (ja) * | 2016-09-27 | 2020-06-17 | 東京エレクトロン株式会社 | ガス導入機構及び処理装置 |
| JP1624354S (zh) * | 2018-07-19 | 2019-02-12 | ||
| JP1648531S (zh) * | 2019-01-28 | 2019-12-23 |
-
2018
- 2018-07-19 JP JPD2018-15808F patent/JP1624352S/ja active Active
- 2018-11-12 TW TW107306664F patent/TWD197467S/zh unknown
- 2018-12-04 US US29/672,229 patent/USD924953S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1624352S (zh) | 2019-02-12 |
| USD924953S1 (en) | 2021-07-13 |
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