JP1683319S - 半導体ウェハ研磨用弾性膜 - Google Patents
半導体ウェハ研磨用弾性膜Info
- Publication number
- JP1683319S JP1683319S JP2020019863F JP2020019863F JP1683319S JP 1683319 S JP1683319 S JP 1683319S JP 2020019863 F JP2020019863 F JP 2020019863F JP 2020019863 F JP2020019863 F JP 2020019863F JP 1683319 S JP1683319 S JP 1683319S
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- elastic film
- polishing semiconductor
- polishing
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 title 1
- 239000012528 membrane Substances 0.000 abstract 2
- -1 etc. Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Abstract
本物品は、メンブレンとも称し、半導体等の製造におけるウェハ研磨工程において、研磨装置の基板保持リング内側に装着し、装置側から本物品の背面側に空気などの気体を供給して膜面を正面側に膨らませ、正面側に配したウェハの片面を研磨パッドに押圧するために用いるものである。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020019863F JP1683319S (ja) | 2020-09-17 | 2020-09-17 | 半導体ウェハ研磨用弾性膜 |
| US29/774,336 USD989012S1 (en) | 2020-09-17 | 2021-03-16 | Elastic membrane |
| TW110301301F TWD215079S (zh) | 2020-09-17 | 2021-03-16 | 半導體晶圓研磨用彈性膜 |
| US29/874,375 USD1021832S1 (en) | 2020-09-17 | 2023-04-19 | Elastic membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020019863F JP1683319S (ja) | 2020-09-17 | 2020-09-17 | 半導体ウェハ研磨用弾性膜 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1683319S true JP1683319S (ja) | 2021-04-12 |
Family
ID=81344541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020019863F Active JP1683319S (ja) | 2020-09-17 | 2020-09-17 | 半導体ウェハ研磨用弾性膜 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1683319S (ja) |
| TW (1) | TWD215079S (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1692349S (ja) | 2020-12-18 | 2021-08-10 |
-
2020
- 2020-09-17 JP JP2020019863F patent/JP1683319S/ja active Active
-
2021
- 2021-03-16 TW TW110301301F patent/TWD215079S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD215079S (zh) | 2021-11-01 |
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