TWD197827S - 半導體晶圓研磨用彈性膜 - Google Patents

半導體晶圓研磨用彈性膜

Info

Publication number
TWD197827S
TWD197827S TW107303453F TW107303453F TWD197827S TW D197827 S TWD197827 S TW D197827S TW 107303453 F TW107303453 F TW 107303453F TW 107303453 F TW107303453 F TW 107303453F TW D197827 S TWD197827 S TW D197827S
Authority
TW
Taiwan
Prior art keywords
view
article
elastic film
semiconductor wafer
wafer
Prior art date
Application number
TW107303453F
Other languages
English (en)
Inventor
Shingo Togashi
Makoto Fukushima
Keisuke Namiki
Osamu Nabeya
Satoru Yamaki
Tomoko Owada
Yoshikazu Kato
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TWD197827S publication Critical patent/TWD197827S/zh

Links

Abstract

【物品用途】;本部分設計的物品是半導體晶圓研磨用彈性膜(亦稱為隔膜(membrane))，為一種應用於半導體等的製造上之晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓的其中一面朝研磨墊按壓，並且，通過小孔進行真空吸引來保持晶圓。;【設計說明】;仰視圖與俯視圖相對稱，仰視圖省略。左側視圖與右側視圖相對稱，左側視圖省略。
TW107303453F 2017-12-19 2018-06-15 半導體晶圓研磨用彈性膜 TWD197827S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017028235 2017-12-19

Publications (1)

Publication Number Publication Date
TWD197827S true TWD197827S (zh) 2019-06-01

Family

ID=89032828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107303453F TWD197827S (zh) 2017-12-19 2018-06-15 半導體晶圓研磨用彈性膜

Country Status (1)

Country Link
TW (1) TWD197827S (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD979524S1 (en) 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD981969S1 (en) 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD979524S1 (en) 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1051867S1 (en) 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD981969S1 (en) 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber

Similar Documents

Publication Publication Date Title
TWD197827S (zh) 半導體晶圓研磨用彈性膜
TWD138225S1 (zh) 半導體晶圓研磨裝置用彈性膜
TWD146490S (zh) 半導體晶圓研磨用彈性膜
TWD189312S (zh) Sealing material for semiconductor manufacturing equipment
TWD175852S (zh) 電漿處理裝置用上腔室
TWD179672S (zh) 基板保持環之部分
TWD186397S (zh) 電漿處理裝置用放電腔室
MY186300A (en) Electrostatic chuck
TWD191199S (zh) Part of the vacuum suction pad
TWD187175S (zh) 圖案化石英晶圓
TWD183002S (zh) 圖案化石英晶圓
TWD194953S (zh) Elastic film for semiconductor wafer polishing
TWD194954S (zh) Elastic film for semiconductor wafer polishing
TWD193203S (zh) Elastic film for semiconductor wafer polishing
TWD197826S (zh) 半導體晶圓研磨用彈性膜之部分
JP1683319S (ja) 半導体ウェハ研磨用弾性膜
TWD197464S (zh) 半導體晶圓研磨用彈性膜之部分
TWD146491S (zh) 半導體晶圓研磨用彈性膜
TWD167111S (zh) 半導體晶圓硏磨裝置用彈性膜
TWD188484S (zh) Part of the elastic film for semiconductor wafer polishing
TWD194194S (zh) Part of the elastic film for semiconductor wafer polishing
TWD167113S (zh) 半導體晶圓硏磨裝置用彈性膜
TWD139857S (zh) 半導體晶圓研磨裝置用彈性膜
TWD168373S (zh) 半導體晶圓硏磨裝置用彈性膜之部分
TWD170399S (zh) 晶舟用填縫構件