TWD189312S - Sealing material for semiconductor manufacturing equipment - Google Patents

Sealing material for semiconductor manufacturing equipment

Info

Publication number
TWD189312S
TWD189312S TW106301911F TW106301911F TWD189312S TW D189312 S TWD189312 S TW D189312S TW 106301911 F TW106301911 F TW 106301911F TW 106301911 F TW106301911 F TW 106301911F TW D189312 S TWD189312 S TW D189312S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
sealing material
manufacturing equipment
article
design
Prior art date
Application number
TW106301911F
Other languages
English (en)
Inventor
村田慧
森田慎也
鈴木正志
Original Assignee
日立國際電氣股份有限公司
東邦化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司, 東邦化成股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD189312S publication Critical patent/TWD189312S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置用密封材，為一種用來密封半導體製造裝置之基板處理空間內的環境氣體的密封材；使曲率半徑小的前端側接觸到既定構件而使兩構件間得到密封性能。;【設計說明】;(無)

Description

半導體製造裝置用密封材
本設計的物品是半導體製造裝置用密封材，為一種用來密封半導體製造裝置之基板處理空間內的環境氣體的密封材；使曲率半徑小的前端側接觸到既定構件而使兩構件間得到密封性能。
TW106301911F 2016-10-25 2017-04-13 Sealing material for semiconductor manufacturing equipment TWD189312S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-23182F JP1581911S (zh) 2016-10-25 2016-10-25
JP2016-023182 2016-10-25

Publications (1)

Publication Number Publication Date
TWD189312S true TWD189312S (zh) 2018-03-21

Family

ID=59351533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106301911F TWD189312S (zh) 2016-10-25 2017-04-13 Sealing material for semiconductor manufacturing equipment

Country Status (3)

Country Link
US (1) USD862404S1 (zh)
JP (1) JP1581911S (zh)
TW (1) TWD189312S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193792S (zh) 2018-02-01 2018-11-01 億川鐵工所股份有限公司 Seal ring

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USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1646505S (zh) * 2018-12-07 2019-11-25
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD971900S1 (en) * 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD1031951S1 (en) * 2020-07-30 2024-06-18 Valqua, Ltd. Composite seal
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

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US135712A (en) * 1873-02-11 Improvement in key-rings
US4225162A (en) * 1978-09-20 1980-09-30 Amp Incorporated Liquid tight connector
US4447749A (en) * 1981-07-29 1984-05-08 Black & Decker Inc. Cordless electric device having contact increasing means
US5302980A (en) * 1989-04-14 1994-04-12 Barrett Graham D Lens useful as a keratoscope
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
TWM270879U (en) 2005-01-28 2005-07-21 Ching-Wen Hung Push/pull constant force enhancing vise with two needle rollers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US8242586B2 (en) * 2008-09-09 2012-08-14 Mediatek Inc. Integrated circuit chip with seal ring structure
JP1546800S (zh) * 2015-06-12 2016-03-28
JP1545407S (zh) * 2015-06-16 2016-03-14
JP1545406S (zh) * 2015-06-16 2016-03-14
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
JP1584906S (zh) * 2017-01-31 2017-08-28
JP1584241S (zh) * 2017-01-31 2017-08-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193792S (zh) 2018-02-01 2018-11-01 億川鐵工所股份有限公司 Seal ring

Also Published As

Publication number Publication date
USD862404S1 (en) 2019-10-08
JP1581911S (zh) 2017-07-24

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