TWD167991S - 半導體晶圓研磨裝置用彈性膜 - Google Patents

半導體晶圓研磨裝置用彈性膜

Info

Publication number
TWD167991S
TWD167991S TW103306162F TW103306162F TWD167991S TW D167991 S TWD167991 S TW D167991S TW 103306162 F TW103306162 F TW 103306162F TW 103306162 F TW103306162 F TW 103306162F TW D167991 S TWD167991 S TW D167991S
Authority
TW
Taiwan
Prior art keywords
elastic membrane
semiconductor wafer
wafer polishing
article
view
Prior art date
Application number
TW103306162F
Other languages
English (en)
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Original Assignee
荏原製作所股份有限公司
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司, Ebara Corp filed Critical 荏原製作所股份有限公司
Publication of TWD167991S publication Critical patent/TWD167991S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體晶圓研磨裝置用彈性膜(Elastic membrane)，為一種應用於半導體等製造之晶圓研磨工程中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓。;【設計說明】;仰視圖與俯視圖相對稱，仰視圖省略。;左側視圖與右側視圖相對稱，左側視圖省略。
TW103306162F 2013-05-15 2013-11-14 半導體晶圓研磨裝置用彈性膜 TWD167991S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2013-10676F JP1495739S (zh) 2013-05-15 2013-05-15

Publications (1)

Publication Number Publication Date
TWD167991S true TWD167991S (zh) 2015-05-21

Family

ID=58472465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103306162F TWD167991S (zh) 2013-05-15 2013-11-14 半導體晶圓研磨裝置用彈性膜

Country Status (2)

Country Link
JP (1) JP1495739S (zh)
TW (1) TWD167991S (zh)

Also Published As

Publication number Publication date
JP1495739S (zh) 2017-04-10

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