TWD167109S - 基板保持環 - Google Patents

基板保持環

Info

Publication number
TWD167109S
TWD167109S TW102307326F TW102307326F TWD167109S TW D167109 S TWD167109 S TW D167109S TW 102307326 F TW102307326 F TW 102307326F TW 102307326 F TW102307326 F TW 102307326F TW D167109 S TWD167109 S TW D167109S
Authority
TW
Taiwan
Prior art keywords
retaining ring
view
substrate
substrate retaining
usage
Prior art date
Application number
TW102307326F
Other languages
English (en)
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TWD167109S publication Critical patent/TWD167109S/zh

Links

Abstract

【物品用途】;本設計的物品是基板保持環，如「使用狀態參考圖」所示，應用於半導體等製造時的基板研磨工程中，將晶圓等基板保持在環內，用以研磨基板的單面。;【設計說明】;後視圖、右側視圖及左側視圖均與前視圖相同，皆予省略。
TW102307326F 2013-05-15 2013-11-14 基板保持環 TWD167109S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2013-10671F JP1494712S (zh) 2013-05-15 2013-05-15

Publications (1)

Publication Number Publication Date
TWD167109S true TWD167109S (zh) 2015-04-11

Family

ID=58418545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102307326F TWD167109S (zh) 2013-05-15 2013-11-14 基板保持環

Country Status (2)

Country Link
JP (1) JP1494712S (zh)
TW (1) TWD167109S (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11049760B2 (en) 2016-03-04 2021-06-29 Applied Materials, Inc. Universal process kit
USD931241S1 (en) 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
TWD239857S (zh) 2024-03-29 2025-08-11 日商東京威力科創股份有限公司 (日本) 覆蓋環
TWD240965S (zh) 2024-07-10 2025-10-11 日商東京威力科創股份有限公司 (日本) 覆蓋環

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD981459S1 (en) 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD1063595S1 (en) 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1103949S1 (en) 2023-07-17 2025-12-02 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
JP1760874S (ja) 2023-07-17 2024-01-09 半導体ウェハ研磨用リテーナリング

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11049760B2 (en) 2016-03-04 2021-06-29 Applied Materials, Inc. Universal process kit
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD931241S1 (en) 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD971167S1 (en) 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
TWD239857S (zh) 2024-03-29 2025-08-11 日商東京威力科創股份有限公司 (日本) 覆蓋環
TWD240965S (zh) 2024-07-10 2025-10-11 日商東京威力科創股份有限公司 (日本) 覆蓋環

Also Published As

Publication number Publication date
JP1494712S (zh) 2017-04-03

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