TWD179672S - 基板保持環之部分 - Google Patents
基板保持環之部分Info
- Publication number
- TWD179672S TWD179672S TW105301716F TW105301716F TWD179672S TW D179672 S TWD179672 S TW D179672S TW 105301716 F TW105301716 F TW 105301716F TW 105301716 F TW105301716 F TW 105301716F TW D179672 S TWD179672 S TW D179672S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- case
- substrate
- retaining ring
- substrate retaining
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000010586 diagram Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板保持環,如「使用狀態參考圖」所示,應用於半導體等製造時的基板研磨工程中,將晶圓等基板保持在環內,以便於對基板的單面進行研磨。;【設計說明】;圖式所揭露之實線部分,為本案主張設計之部分,虛線部分為本案不主張設計之部分。;圖式所揭露之一點鏈線,係界定本案所欲主張之範圍,該一點鏈線本身為本案不主張設計之部分。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-21985F JP1556433S (zh) | 2015-10-06 | 2015-10-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD179672S true TWD179672S (zh) | 2016-11-21 |
Family
ID=56612403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105301716F TWD179672S (zh) | 2015-10-06 | 2016-03-31 | 基板保持環之部分 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD794585S1 (zh) |
JP (1) | JP1556433S (zh) |
TW (1) | TWD179672S (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD931241S1 (en) | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1544543S (zh) * | 2015-05-14 | 2019-02-18 | ||
JP1584784S (zh) * | 2017-01-31 | 2017-08-28 | ||
JP1651619S (zh) * | 2019-07-11 | 2020-01-27 | ||
JP1651618S (zh) * | 2019-07-11 | 2020-01-27 | ||
JP1651623S (zh) * | 2019-07-18 | 2020-01-27 | ||
USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
JP1671171S (zh) * | 2020-05-22 | 2020-10-26 | ||
USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5944593A (en) * | 1997-09-01 | 1999-08-31 | United Microelectronics Corp. | Retainer ring for polishing head of chemical-mechanical polish machines |
US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
US6224472B1 (en) * | 1999-06-24 | 2001-05-01 | Samsung Austin Semiconductor, L.P. | Retaining ring for chemical mechanical polishing |
US6186880B1 (en) * | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
US6869335B2 (en) * | 2002-07-08 | 2005-03-22 | Micron Technology, Inc. | Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
JP5296985B2 (ja) * | 2003-11-13 | 2013-09-25 | アプライド マテリアルズ インコーポレイテッド | 整形面をもつリテーニングリング |
US7029386B2 (en) * | 2004-06-10 | 2006-04-18 | R & B Plastics, Inc. | Retaining ring assembly for use in chemical mechanical polishing |
US7029375B2 (en) * | 2004-08-31 | 2006-04-18 | Tech Semiconductor Pte. Ltd. | Retaining ring structure for edge control during chemical-mechanical polishing |
USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
JP2008229790A (ja) * | 2007-03-22 | 2008-10-02 | Nec Electronics Corp | リテーナリングおよび研磨装置 |
US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
JP1438745S (zh) * | 2011-09-20 | 2015-04-06 | ||
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD734377S1 (en) * | 2013-03-28 | 2015-07-14 | Hirata Corporation | Top cover of a load lock chamber |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD729730S1 (en) * | 2013-06-06 | 2015-05-19 | Jon Simon Gillespie-Brown | Power charging ring |
-
2015
- 2015-10-06 JP JPD2015-21985F patent/JP1556433S/ja active Active
-
2016
- 2016-03-31 TW TW105301716F patent/TWD179672S/zh unknown
- 2016-04-05 US US29/560,291 patent/USD794585S1/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD931241S1 (en) | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD971167S1 (en) | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
Also Published As
Publication number | Publication date |
---|---|
JP1556433S (zh) | 2016-08-15 |
USD794585S1 (en) | 2017-08-15 |
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