JP1651619S - - Google Patents

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Publication number
JP1651619S
JP1651619S JPD2019-15588F JP2019015588F JP1651619S JP 1651619 S JP1651619 S JP 1651619S JP 2019015588 F JP2019015588 F JP 2019015588F JP 1651619 S JP1651619 S JP 1651619S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-15588F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-15588F priority Critical patent/JP1651619S/ja
Priority to TW109305076F priority patent/TWD212772S/zh
Priority to US29/718,678 priority patent/USD962184S1/en
Application granted granted Critical
Publication of JP1651619S publication Critical patent/JP1651619S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-15588F 2019-07-11 2019-07-11 Active JP1651619S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-15588F JP1651619S (zh) 2019-07-11 2019-07-11
TW109305076F TWD212772S (zh) 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板
US29/718,678 USD962184S1 (en) 2019-07-11 2019-12-27 Retainer plate of top heater for wafer processing furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-15588F JP1651619S (zh) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
JP1651619S true JP1651619S (zh) 2020-01-27

Family

ID=69183082

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-15588F Active JP1651619S (zh) 2019-07-11 2019-07-11

Country Status (3)

Country Link
US (1) USD962184S1 (zh)
JP (1) JP1651619S (zh)
TW (1) TWD212772S (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1732202S (ja) 2022-06-22 2022-12-14 基板保持具

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US20140199840A1 (en) * 2013-01-11 2014-07-17 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
JP1541874S (zh) * 2015-03-16 2016-01-18
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1556433S (zh) * 2015-10-06 2016-08-15
JP1560719S (zh) * 2015-12-01 2016-10-11
JP1581406S (zh) * 2016-10-14 2017-07-18
WO2018100850A1 (ja) * 2016-12-01 2018-06-07 株式会社日立国際電気 基板処理装置、天井ヒータおよび半導体装置の製造方法
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (ko) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
JP1651623S (zh) * 2019-07-18 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

Also Published As

Publication number Publication date
TWD212772S (zh) 2021-07-21
USD962184S1 (en) 2022-08-30

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