TWD212772S - 基板處理裝置用吸頂式加熱器的保持板 - Google Patents

基板處理裝置用吸頂式加熱器的保持板 Download PDF

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Publication number
TWD212772S
TWD212772S TW109305076F TW109305076F TWD212772S TW D212772 S TWD212772 S TW D212772S TW 109305076 F TW109305076 F TW 109305076F TW 109305076 F TW109305076 F TW 109305076F TW D212772 S TWD212772 S TW D212772S
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TW
Taiwan
Prior art keywords
processing device
substrate processing
holding plate
ceiling heater
ceiling
Prior art date
Application number
TW109305076F
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English (en)
Inventor
杉浦忍
小杉哲也
山口天和
Original Assignee
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD212772S publication Critical patent/TWD212772S/zh

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Abstract

【物品用途】;本設計的物品是基板處理裝置用吸頂式加熱器的保持板，如「使用狀態參考圖」所示，安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線，以使加熱線之間互相絕緣。;【設計說明】;(無)

Description

基板處理裝置用吸頂式加熱器的保持板
本設計的物品是基板處理裝置用吸頂式加熱器的保持板，如「使用狀態參考圖」所示，安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線，以使加熱線之間互相絕緣。
(無)
TW109305076F 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板 TWD212772S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-015588 2019-01-31
JPD2019-15588F JP1651619S (zh) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
TWD212772S true TWD212772S (zh) 2021-07-21

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TW109305076F TWD212772S (zh) 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板

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US (1) USD962184S1 (zh)
JP (1) JP1651619S (zh)
TW (1) TWD212772S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD227462S (zh) 2022-06-22 2023-09-11 日商芝浦機械電子股份有限公司 基板保持具

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US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
KR102229556B1 (ko) * 2013-01-11 2021-03-18 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 장치 및 방법
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
JP1541874S (zh) * 2015-03-16 2016-01-18
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JP1556433S (zh) * 2015-10-06 2016-08-15
JP1560719S (zh) * 2015-12-01 2016-10-11
JP1581406S (zh) * 2016-10-14 2017-07-18
KR102384004B1 (ko) * 2016-12-01 2022-04-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 천장 히터 및 반도체 장치의 제조 방법
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (ko) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
JP1651623S (zh) * 2019-07-18 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD227462S (zh) 2022-06-22 2023-09-11 日商芝浦機械電子股份有限公司 基板保持具

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Publication number Publication date
USD962184S1 (en) 2022-08-30
JP1651619S (zh) 2020-01-27

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