TWD166332S - 基板處理裝置用晶舟之部分 - Google Patents

基板處理裝置用晶舟之部分

Info

Publication number
TWD166332S
TWD166332S TW102306236F TW102306236F TWD166332S TW D166332 S TWD166332 S TW D166332S TW 102306236 F TW102306236 F TW 102306236F TW 102306236 F TW102306236 F TW 102306236F TW D166332 S TWD166332 S TW D166332S
Authority
TW
Taiwan
Prior art keywords
substrate processing
processing equipment
design
wafer boat
recommended
Prior art date
Application number
TW102306236F
Other languages
English (en)
Inventor
Kosuke Takagi
Kiyohiko Maeda
Yuji Urano
Naoki Matsumoto
Yasuaki Komae
Original Assignee
日立國際電氣股份有限公司
Hitachi Int Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司, Hitachi Int Electric Inc filed Critical 日立國際電氣股份有限公司
Publication of TWD166332S publication Critical patent/TWD166332S/zh

Links

Abstract

【物品用途】;本設計的物品是基板處理裝置用晶舟，用於半導體基板處理裝置的反應室內使複數個晶圓水平保持，其左右及後方柱體上形成有銷狀突起以載置晶圓。;【設計說明】;實線部分為本物品主張設計之部分，虛線及一點鎖線部分為本物品不主張設計之部分。
TW102306236F 2013-03-22 2013-09-18 基板處理裝置用晶舟之部分 TWD166332S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013006364 2013-03-22

Publications (1)

Publication Number Publication Date
TWD166332S true TWD166332S (zh) 2015-03-01

Family

ID=54253060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102306236F TWD166332S (zh) 2013-03-22 2013-09-18 基板處理裝置用晶舟之部分

Country Status (2)

Country Link
US (1) USD740769S1 (zh)
TW (1) TWD166332S (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1537312S (zh) * 2014-11-20 2015-11-09
JP1537630S (zh) * 2014-11-20 2015-11-09
JP1537313S (zh) * 2014-11-20 2015-11-09
JP1537629S (zh) * 2014-11-20 2015-11-09
JP1563649S (zh) * 2016-02-12 2016-11-21
USD847105S1 (en) 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1638282S (zh) * 2018-09-20 2019-08-05
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
TWD202895S (zh) * 2019-03-27 2020-02-21 家登精密工業股份有限公司 光罩盒組裝件
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP1658652S (zh) * 2019-08-07 2020-04-27
JP1665228S (zh) * 2019-11-28 2020-08-03
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1700777S (zh) * 2021-03-15 2021-11-29
JP1731673S (zh) * 2022-05-30 2022-12-08
JP1731675S (zh) * 2022-05-30 2022-12-08
JP1731674S (zh) * 2022-05-30 2022-12-08

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
JP3218164B2 (ja) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 被処理体の支持ボート、熱処理装置及び熱処理方法
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
KR19990077350A (ko) * 1996-02-29 1999-10-25 히가시 데쓰로 반도체웨이퍼의 열처리용 보트
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
KR20000002833A (ko) * 1998-06-23 2000-01-15 윤종용 반도체 웨이퍼 보트
JP3487497B2 (ja) * 1998-06-24 2004-01-19 岩手東芝エレクトロニクス株式会社 被処理体収容治具及びこれを用いた熱処理装置
US6099054A (en) * 1998-10-28 2000-08-08 Custom Metalcraft, Inc. Latch dog assembly
US6099645A (en) * 1999-07-09 2000-08-08 Union Oil Company Of California Vertical semiconductor wafer carrier with slats
USD433931S (en) * 2000-03-06 2000-11-21 Poplin Richard L Doorstop
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
KR100410982B1 (ko) * 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US20050145584A1 (en) * 2004-01-06 2005-07-07 Buckley Richard F. Wafer boat with interference fit wafer supports
USD534056S1 (en) * 2005-05-02 2006-12-26 Newfrey Llc Automobile vehicle striker assembly
US7730580B2 (en) * 2005-05-02 2010-06-08 Newfrey Llc Automobile vehicle striker assembly
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
JP4930438B2 (ja) * 2008-04-03 2012-05-16 東京エレクトロン株式会社 反応管及び熱処理装置
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus

Also Published As

Publication number Publication date
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