JP1731673S - - Google Patents

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Publication number
JP1731673S
JP1731673S JP2022011409F JP2022011409F JP1731673S JP 1731673 S JP1731673 S JP 1731673S JP 2022011409 F JP2022011409 F JP 2022011409F JP 2022011409 F JP2022011409 F JP 2022011409F JP 1731673 S JP1731673 S JP 1731673S
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JP
Japan
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Application number
JP2022011409F
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Publication date
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Priority to JP2022011409F priority Critical patent/JP1731673S/ja
Priority to TW111305738F priority patent/TWD232581S/zh
Priority to US29/861,167 priority patent/USD1019581S1/en
Application granted granted Critical
Publication of JP1731673S publication Critical patent/JP1731673S/ja
Active legal-status Critical Current
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JP2022011409F 2022-05-30 2022-05-30 Active JP1731673S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022011409F JP1731673S (ja) 2022-05-30 2022-05-30
TW111305738F TWD232581S (zh) 2022-05-30 2022-11-18 半導體製造裝置用反應管的內管
US29/861,167 USD1019581S1 (en) 2022-05-30 2022-11-28 Inner tube of reaction tube for semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022011409F JP1731673S (ja) 2022-05-30 2022-05-30

Publications (1)

Publication Number Publication Date
JP1731673S true JP1731673S (ja) 2022-12-08

Family

ID=84322290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022011409F Active JP1731673S (ja) 2022-05-30 2022-05-30

Country Status (3)

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US (1) USD1019581S1 (ja)
JP (1) JP1731673S (ja)
TW (1) TWD232581S (ja)

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
JP4331768B2 (ja) * 2007-02-28 2009-09-16 東京エレクトロン株式会社 熱処理炉及び縦型熱処理装置
US8023806B2 (en) * 2007-03-20 2011-09-20 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
TWD143034S1 (zh) * 2008-03-28 2011-10-01 東京威力科創股份有限公司 半導體製造用處理管
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
US8398773B2 (en) * 2011-01-21 2013-03-19 Asm International N.V. Thermal processing furnace and liner for the same
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
TWD167986S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD167987S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD168774S (zh) * 2013-06-28 2015-07-01 日立國際電氣股份有限公司 反應管之部分
TWD167985S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1535455S (ja) * 2015-02-25 2015-10-19
JP1546345S (ja) * 2015-09-04 2016-03-22
JP1546512S (ja) * 2015-09-04 2016-03-22
JP1563649S (ja) * 2016-02-12 2016-11-21
JP1563524S (ja) * 2016-03-30 2016-11-21
JP1605460S (ja) * 2017-08-09 2021-05-31
JP1605461S (ja) * 2017-08-10 2021-05-31
JP1605462S (ja) * 2017-08-10 2021-05-31
JP1605982S (ja) * 2017-12-27 2021-05-31
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP6856576B2 (ja) * 2018-05-25 2021-04-07 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
JP1638282S (ja) * 2018-09-20 2019-08-05
JP1640260S (ja) * 2018-11-19 2019-09-02
JP1644260S (ja) 2019-03-20 2019-10-28
JP1658652S (ja) * 2019-08-07 2020-04-27
JP1665228S (ja) * 2019-11-28 2020-08-03
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
JP1678273S (ja) * 2020-03-10 2021-02-01 反応管
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1682719S (ja) 2020-06-15 2021-04-05
JP7461490B2 (ja) * 2020-09-28 2024-04-03 株式会社Kokusai Electric 温度制御方法、半導体装置の製造方法、プログラム及び基板処理装置
JP1700777S (ja) * 2021-03-15 2021-11-29

Also Published As

Publication number Publication date
USD1019581S1 (en) 2024-03-26
TWD232581S (zh) 2024-08-01

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