TWD168827S - 半導體製造裝置用晶舟 - Google Patents

半導體製造裝置用晶舟

Info

Publication number
TWD168827S
TWD168827S TW103300468D01F TW103300468D01F TWD168827S TW D168827 S TWD168827 S TW D168827S TW 103300468D01 F TW103300468D01 F TW 103300468D01F TW 103300468D01 F TW103300468D01 F TW 103300468D01F TW D168827 S TWD168827 S TW D168827S
Authority
TW
Taiwan
Prior art keywords
design
view
manufacturing equipment
derivative
semiconductor wafer
Prior art date
Application number
TW103300468D01F
Other languages
English (en)
Inventor
Hidenari Yoshida
Tomoshi Taniyama
Original Assignee
日立國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD168827S publication Critical patent/TWD168827S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置用晶舟，為一種半導體晶圓施行成膜時，用以將半導體晶圓水平地保持在反應室內的晶舟。;【設計說明】;如B-B放大剖面圖所示，將半導體晶圓載置在前方左右形成梳子狀的爪部、和形成在後方左右之支柱部的梳子狀段差部。本物品是由石英製成。;本衍生設計與原設計之外觀差異在於：如立體圖及前視圖、左、右側視圖所示，本衍生案的爪部具有一條細長狀的貫穿槽，原設計案並無此貫穿槽設計，故本案與原設計案之差異些微，不影響原設計與衍生設計之近似。
TW103300468D01F 2013-07-29 2014-01-24 半導體製造裝置用晶舟 TWD168827S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013017234 2013-07-29

Publications (1)

Publication Number Publication Date
TWD168827S true TWD168827S (zh) 2015-07-01

Family

ID=55026800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103300468D01F TWD168827S (zh) 2013-07-29 2014-01-24 半導體製造裝置用晶舟

Country Status (2)

Country Link
US (1) USD747279S1 (zh)
TW (1) TWD168827S (zh)

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JP1537313S (zh) * 2014-11-20 2015-11-09
JP1563649S (zh) * 2016-02-12 2016-11-21
CN206961808U (zh) * 2017-07-14 2018-02-02 君泰创新（北京）科技有限公司 硅片清洗工装
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USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1638282S (zh) * 2018-09-20 2019-08-05
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP1658652S (zh) * 2019-08-07 2020-04-27
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1731674S (zh) * 2022-05-30 2022-12-08
JP1731675S (zh) * 2022-05-30 2022-12-08
JP1731673S (zh) * 2022-05-30 2022-12-08

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Also Published As

Publication number Publication date
USD747279S1 (en) 2016-01-12

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