TWD182750S - 用於半導體處理腔室之噴淋頭(三) - Google Patents
用於半導體處理腔室之噴淋頭(三)Info
- Publication number
- TWD182750S TWD182750S TW105305434F TW105305434F TWD182750S TW D182750 S TWD182750 S TW D182750S TW 105305434 F TW105305434 F TW 105305434F TW 105305434 F TW105305434 F TW 105305434F TW D182750 S TWD182750 S TW D182750S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor processing
- showerhead
- processing chamber
- view
- design
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
Abstract
【物品用途】;本設計所請求為用於半導體處理腔室之噴淋頭。;【設計說明】;後視圖與前視圖呈左右鏡射因而省略;左側視圖與右側視圖呈左右鏡射因而省略。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/560,680 USD790039S1 (en) | 2016-04-08 | 2016-04-08 | Showerhead for a semiconductor processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD182750S true TWD182750S (zh) | 2017-05-01 |
Family
ID=59033933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105305434F TWD182750S (zh) | 2016-04-08 | 2016-09-13 | 用於半導體處理腔室之噴淋頭(三) |
Country Status (2)
Country | Link |
---|---|
US (1) | USD790039S1 (zh) |
TW (1) | TWD182750S (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD823985S1 (en) * | 2016-12-16 | 2018-07-24 | Kohler Co. | Showerhead with non-uniform arrangement of spray nozzles of varying sizes |
JP1598996S (zh) * | 2017-08-31 | 2018-03-05 | ||
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11577260B2 (en) | 2018-08-22 | 2023-02-14 | Kohler Co. | Showerhead |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD968563S1 (en) | 2019-08-29 | 2022-11-01 | Kohler Co. | Showerhead |
USD975239S1 (en) | 2019-10-30 | 2023-01-10 | Kohler Co. | Showerhead |
US11551960B2 (en) | 2020-01-30 | 2023-01-10 | Applied Materials, Inc. | Helical plug for reduction or prevention of arcing in a substrate support |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD969980S1 (en) | 2020-10-20 | 2022-11-15 | Applied Materials, Inc. | Deposition chamber showerhead |
USD967351S1 (en) | 2020-10-20 | 2022-10-18 | Applied Materials, Inc. | Showerhead reflector |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6086677A (en) | 1998-06-16 | 2000-07-11 | Applied Materials, Inc. | Dual gas faceplate for a showerhead in a semiconductor wafer processing system |
US6793733B2 (en) | 2002-01-25 | 2004-09-21 | Applied Materials Inc. | Gas distribution showerhead |
US20050103265A1 (en) | 2003-11-19 | 2005-05-19 | Applied Materials, Inc., A Delaware Corporation | Gas distribution showerhead featuring exhaust apertures |
US6983892B2 (en) | 2004-02-05 | 2006-01-10 | Applied Materials, Inc. | Gas distribution showerhead for semiconductor processing |
US20060021703A1 (en) | 2004-07-29 | 2006-02-02 | Applied Materials, Inc. | Dual gas faceplate for a showerhead in a semiconductor wafer processing system |
CN100451163C (zh) * | 2006-10-18 | 2009-01-14 | 中微半导体设备(上海)有限公司 | 用于半导体工艺件处理反应器的气体分布装置及其反应器 |
USD566228S1 (en) * | 2007-03-09 | 2008-04-08 | Speakman Company | Shower |
US8876024B2 (en) | 2008-01-10 | 2014-11-04 | Applied Materials, Inc. | Heated showerhead assembly |
USD587339S1 (en) * | 2008-01-31 | 2009-02-24 | Hansgrohe Ag | Showerhead |
USD639385S1 (en) * | 2010-04-08 | 2011-06-07 | Grohe Ag | Shower head |
USD641829S1 (en) * | 2010-10-29 | 2011-07-19 | Novellus Systems, Inc. | Plasma reactor showerhead face plate having concentric ridge pattern |
USD694359S1 (en) * | 2012-07-11 | 2013-11-26 | Hansgrohe Se | Overhead shower |
TWD161516S (zh) * | 2013-02-07 | 2014-07-01 | 漢斯葛洛公司 | 蓮蓬頭 |
US9353439B2 (en) * | 2013-04-05 | 2016-05-31 | Lam Research Corporation | Cascade design showerhead for transient uniformity |
US9464353B2 (en) * | 2013-11-21 | 2016-10-11 | Wonik Ips Co., Ltd. | Substrate processing apparatus |
US9343307B2 (en) | 2013-12-24 | 2016-05-17 | Ultratech, Inc. | Laser spike annealing using fiber lasers |
US9484190B2 (en) * | 2014-01-25 | 2016-11-01 | Yuri Glukhoy | Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area |
USD733257S1 (en) * | 2014-02-14 | 2015-06-30 | Hansgrohe Se | Overhead shower |
USD736348S1 (en) * | 2014-07-07 | 2015-08-11 | Jiangmen Triumph Rain Showers Co., LTD | Spray head for a shower |
USD751176S1 (en) * | 2014-08-07 | 2016-03-08 | Hansgrohe Se | Overhead shower |
USD757893S1 (en) * | 2014-11-04 | 2016-05-31 | Custom Molded Products, Inc. | Jet nozzle insert |
USD752708S1 (en) * | 2014-12-01 | 2016-03-29 | Shong I Copper Co., Ltd. | Showerhead |
-
2016
- 2016-04-08 US US29/560,680 patent/USD790039S1/en active Active
- 2016-09-13 TW TW105305434F patent/TWD182750S/zh unknown
Also Published As
Publication number | Publication date |
---|---|
USD790039S1 (en) | 2017-06-20 |
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