JP1605460S - - Google Patents

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Publication number
JP1605460S
JP1605460S JPD2017-17179F JP2017017179F JP1605460S JP 1605460 S JP1605460 S JP 1605460S JP 2017017179 F JP2017017179 F JP 2017017179F JP 1605460 S JP1605460 S JP 1605460S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-17179F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-17179F priority Critical patent/JP1605460S/ja
Priority to TW106306924F priority patent/TWD191630S/zh
Priority to US29/635,300 priority patent/USD842824S1/en
Application granted granted Critical
Publication of JP1605460S publication Critical patent/JP1605460S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-17179F 2017-08-09 2017-08-09 Active JP1605460S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2017-17179F JP1605460S (ja) 2017-08-09 2017-08-09
TW106306924F TWD191630S (zh) 2017-08-09 2017-11-27 Reaction tube
US29/635,300 USD842824S1 (en) 2017-08-09 2018-01-30 Reaction tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-17179F JP1605460S (ja) 2017-08-09 2017-08-09

Publications (1)

Publication Number Publication Date
JP1605460S true JP1605460S (ja) 2021-05-31

Family

ID=62238986

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-17179F Active JP1605460S (ja) 2017-08-09 2017-08-09

Country Status (3)

Country Link
US (1) USD842824S1 (ja)
JP (1) JP1605460S (ja)
TW (1) TWD191630S (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4340007A1 (en) * 2022-09-15 2024-03-20 Kokusai Electric Corp. Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1644260S (ja) * 2019-03-20 2019-10-28
USD931823S1 (en) 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
TWD217227S (zh) 2020-01-30 2022-02-21 日商國際電氣股份有限公司 反應管
JP1678273S (ja) * 2020-03-10 2021-02-01 反応管
JP1731675S (ja) * 2022-05-30 2022-12-08
JP1731674S (ja) * 2022-05-30 2022-12-08
JP1731673S (ja) * 2022-05-30 2022-12-08

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JP3024449B2 (ja) * 1993-07-24 2000-03-21 ヤマハ株式会社 縦型熱処理炉及び熱処理方法
JPH08264521A (ja) * 1995-03-20 1996-10-11 Kokusai Electric Co Ltd 半導体製造用反応炉
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD417438S (en) * 1997-01-31 1999-12-07 Tokyo Electron Limited Quartz outer tube
USD405429S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) * 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
US5948300A (en) * 1997-09-12 1999-09-07 Kokusai Bti Corporation Process tube with in-situ gas preheating
JP2000243747A (ja) * 1999-02-18 2000-09-08 Kokusai Electric Co Ltd 基板処理装置
KR100360401B1 (ko) * 2000-03-17 2002-11-13 삼성전자 주식회사 슬릿형 공정가스 인입부와 다공구조의 폐가스 배출부를포함하는 공정튜브 및 반도체 소자 제조장치
JP3985899B2 (ja) * 2002-03-28 2007-10-03 株式会社日立国際電気 基板処理装置
JP4523225B2 (ja) * 2002-09-24 2010-08-11 東京エレクトロン株式会社 熱処理装置
USD521464S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
USD521465S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
WO2007041254A2 (en) * 2005-10-03 2007-04-12 Tubemaster, Inc Device for loading chemical reactor tubes
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USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
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JP5096182B2 (ja) * 2008-01-31 2012-12-12 東京エレクトロン株式会社 熱処理炉
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
JP4930438B2 (ja) * 2008-04-03 2012-05-16 東京エレクトロン株式会社 反応管及び熱処理装置
USD618638S1 (en) * 2008-05-09 2010-06-29 Hitachi Kokusai Electric, Inc. Reaction tube
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
TWD167987S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD168774S (zh) * 2013-06-28 2015-07-01 日立國際電氣股份有限公司 反應管之部分
TWD167986S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
JP1534829S (ja) 2015-02-23 2015-10-13
JP1535455S (ja) * 2015-02-25 2015-10-19
JP1546512S (ja) * 2015-09-04 2016-03-22
JP1546345S (ja) * 2015-09-04 2016-03-22
JP1563524S (ja) * 2016-03-30 2016-11-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4340007A1 (en) * 2022-09-15 2024-03-20 Kokusai Electric Corp. Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
TWD191630S (zh) 2018-07-11
USD842824S1 (en) 2019-03-12

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