TWD167111S - 半導體晶圓硏磨裝置用彈性膜 - Google Patents
半導體晶圓硏磨裝置用彈性膜Info
- Publication number
- TWD167111S TWD167111S TW102307327F TW102307327F TWD167111S TW D167111 S TWD167111 S TW D167111S TW 102307327 F TW102307327 F TW 102307327F TW 102307327 F TW102307327 F TW 102307327F TW D167111 S TWD167111 S TW D167111S
- Authority
- TW
- Taiwan
- Prior art keywords
- elastic membrane
- semiconductor wafer
- wafer polishing
- article
- view
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 239000012528 membrane Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是半導體晶圓研磨裝置用彈性膜(Elastic membrane)，為一種應用於半導體等製造之晶圓研磨工程中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓。;【設計說明】;仰視圖與俯視圖相對稱，仰視圖省略。;左側視圖與右側視圖相對稱，左側視圖省略。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-10672F JP1494713S (zh) | 2013-05-15 | 2013-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD167111S true TWD167111S (zh) | 2015-04-11 |
Family
ID=58418543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102307327F TWD167111S (zh) | 2013-05-15 | 2013-11-14 | 半導體晶圓硏磨裝置用彈性膜 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1494713S (zh) |
| TW (1) | TWD167111S (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981969S1 (en) | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
-
2013
- 2013-05-15 JP JPD2013-10672F patent/JP1494713S/ja active Active
- 2013-11-14 TW TW102307327F patent/TWD167111S/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981969S1 (en) | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1494713S (zh) | 2017-04-03 |
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