TWD167113S - 半導體晶圓硏磨裝置用彈性膜 - Google Patents

半導體晶圓硏磨裝置用彈性膜

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Publication number
TWD167113S
TWD167113S TW102307327D02F TW102307327D02F TWD167113S TW D167113 S TWD167113 S TW D167113S TW 102307327D02 F TW102307327D02 F TW 102307327D02F TW 102307327D02 F TW102307327D02 F TW 102307327D02F TW D167113 S TWD167113 S TW D167113S
Authority
TW
Taiwan
Prior art keywords
design
view
elastic membrane
article
wafer polishing
Prior art date
Application number
TW102307327D02F
Other languages
English (en)
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TWD167113S publication Critical patent/TWD167113S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體晶圓研磨裝置用彈性膜(Elastic membrane)，為一種應用於半導體等製造之晶圓研磨工程中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓。;【設計說明】;本衍生設計與原設計之外觀差異：由「A部分X-X放大剖面圖」及「B部放大圖」即可清楚看出兩者之細部不同，因此本案與原設計案之差異些微，不影響原設計與衍生設計之近似。;仰視圖與俯視圖相對稱，仰視圖省略。;左側視圖與右側視圖相對稱，左側視圖省略。
TW102307327D02F 2013-05-15 2013-11-14 半導體晶圓硏磨裝置用彈性膜 TWD167113S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2013-10674F JP1495081S (zh) 2013-05-15 2013-05-15

Publications (1)

Publication Number Publication Date
TWD167113S true TWD167113S (zh) 2015-04-11

Family

ID=58418594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102307327D02F TWD167113S (zh) 2013-05-15 2013-11-14 半導體晶圓硏磨裝置用彈性膜

Country Status (2)

Country Link
JP (1) JP1495081S (zh)
TW (1) TWD167113S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD897974S1 (en) 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD897974S1 (en) 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

Also Published As

Publication number Publication date
JP1495081S (zh) 2017-04-03

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