TWD175852S - 電漿處理裝置用上腔室 - Google Patents

電漿處理裝置用上腔室

Info

Publication number
TWD175852S
TWD175852S TW104305548F TW104305548F TWD175852S TW D175852 S TWD175852 S TW D175852S TW 104305548 F TW104305548 F TW 104305548F TW 104305548 F TW104305548 F TW 104305548F TW D175852 S TWD175852 S TW D175852S
Authority
TW
Taiwan
Prior art keywords
upper chamber
treatment device
plasma treatment
processing device
plasma processing
Prior art date
Application number
TW104305548F
Other languages
English (en)
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TWD175852S publication Critical patent/TWD175852S/zh

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用上腔室，為一種在半導體製造時所使用的電漿處理裝置中，在進行半導體晶圓等之表面處理時，構成真空空間的上腔室。;【設計說明】;立體圖中，未表現在其他六面圖的細線，皆為用來呈現立體表面的形狀。
TW104305548F 2015-06-12 2015-10-06 電漿處理裝置用上腔室 TWD175852S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13035F JP1546799S (zh) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
TWD175852S true TWD175852S (zh) 2016-05-21

Family

ID=55539623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305548F TWD175852S (zh) 2015-06-12 2015-10-06 電漿處理裝置用上腔室

Country Status (3)

Country Link
US (1) USD804436S1 (zh)
JP (1) JP1546799S (zh)
TW (1) TWD175852S (zh)

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USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
JP1546799S (zh) 2016-03-28
USD804436S1 (en) 2017-12-05

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