KR20180084589A - 반도체 패키지 제조용 트레이 - Google Patents

반도체 패키지 제조용 트레이 Download PDF

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Publication number
KR20180084589A
KR20180084589A KR1020170053561A KR20170053561A KR20180084589A KR 20180084589 A KR20180084589 A KR 20180084589A KR 1020170053561 A KR1020170053561 A KR 1020170053561A KR 20170053561 A KR20170053561 A KR 20170053561A KR 20180084589 A KR20180084589 A KR 20180084589A
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South Korea
Prior art keywords
semiconductor package
tray
manufacturing semiconductor
manufacturing
wafers
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KR1020170053561A
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English (en)
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KR101984929B1 (ko
Inventor
김남철
여용운
권용태
이영석
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주식회사 네패스
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Application filed by 주식회사 네패스 filed Critical 주식회사 네패스
Priority to PCT/KR2017/004829 priority Critical patent/WO2018135707A1/ko
Publication of KR20180084589A publication Critical patent/KR20180084589A/ko
Application granted granted Critical
Publication of KR101984929B1 publication Critical patent/KR101984929B1/ko
Priority to US16/505,970 priority patent/US10804146B2/en

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Stackable Containers (AREA)

Abstract

본 발명의 기술적 사상은 반도체 패키지 공정에 이용되는 반도체 패키지 제조용 트레이에 있어서, 복수개의 웨이퍼들이 배치될 수 있도록 복수개의 캐비티들이 형성된 반도체 패키지 제조용 트레이를 제공한다.
KR1020170053561A 2017-01-17 2017-04-26 반도체 패키지 제조용 트레이 KR101984929B1 (ko)

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PCT/KR2017/004829 WO2018135707A1 (ko) 2017-01-17 2017-05-10 반도체 패키지 제조용 트레이
US16/505,970 US10804146B2 (en) 2017-01-17 2019-07-09 Method for producing semiconductor package

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KR20170008190 2017-01-17
KR1020170008190 2017-01-17

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KR20180084589A true KR20180084589A (ko) 2018-07-25
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KR1020170053562A KR101901987B1 (ko) 2017-01-17 2017-04-26 반도체 패키지의 제조 방법
KR1020170053561A KR101984929B1 (ko) 2017-01-17 2017-04-26 반도체 패키지 제조용 트레이
KR1020170053560A KR101901988B1 (ko) 2017-01-17 2017-04-26 반도체 패키지의 제조 방법

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JP7215206B2 (ja) * 2019-02-19 2023-01-31 富士電機株式会社 半導体装置の製造方法
KR102216738B1 (ko) * 2019-04-17 2021-02-18 제엠제코(주) 반도체 패키지용 클립구조체
CN110867386A (zh) * 2019-10-23 2020-03-06 广东芯华微电子技术有限公司 板级晶圆扇入封装方法
CN113064333A (zh) * 2021-03-19 2021-07-02 北京智创芯源科技有限公司 一种微小晶片的光刻方法、晶片载片及光刻工装
CN113793827B (zh) * 2021-09-08 2022-08-16 合肥御微半导体技术有限公司 一种晶圆承载结构及半导体检测设备
CN113891200A (zh) * 2021-09-24 2022-01-04 青岛歌尔智能传感器有限公司 一种麦克风的封装结构

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US10804146B2 (en) 2020-10-13
KR101984929B1 (ko) 2019-06-03
CN110178209B (zh) 2023-07-11
KR101901988B1 (ko) 2018-09-27
KR20180084588A (ko) 2018-07-25
CN110178209A (zh) 2019-08-27
KR101901989B1 (ko) 2018-09-27
KR20180084590A (ko) 2018-07-25
KR20180084587A (ko) 2018-07-25
US20190333809A1 (en) 2019-10-31
KR101901987B1 (ko) 2018-09-27

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