USD491963S1 - Inner wall shield for a process chamber for manufacturing semiconductors - Google Patents
Inner wall shield for a process chamber for manufacturing semiconductors Download PDFInfo
- Publication number
- USD491963S1 USD491963S1 US29/182,142 US18214203F USD491963S US D491963 S1 USD491963 S1 US D491963S1 US 18214203 F US18214203 F US 18214203F US D491963 S USD491963 S US D491963S
- Authority
- US
- United States
- Prior art keywords
- process chamber
- manufacturing semiconductors
- wall shield
- view
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 atop/left-side/rear perspective view of a first embodiment of an inner wall shield for a process chamber for manufacturing semiconductors;
FIG. 2 a front elevational view thereof;
FIG. 3 a rear elevational view thereof;
FIG. 4 a right side elevational view thereof;
FIG. 5 a left side elevational view thereof;
FIG. 6 a top plan view thereof;
FIG. 7 a bottom plan view thereof;
FIG. 8 a cross-sectional view thereof taken along line 8—8 in FIG. 2;
FIG. 9 a cross-sectional view there taken along line 9—9 in FIG. 4
FIG. 10 an enlarged view of a right-end portion of FIG. 9.
FIG. 11 a top/left-side/rear perspective view of a second embodiment of an inner wall shield for a process chamber for manufacturing semiconductors;
FIG. 12 a front elevational vie thereof;
FIG. 13 a rear elevational view thereof;
FIG. 14 a right side elevational view thereof;
FIG. 15 a left side elevational view thereof;
FIG. 16 a top plan view thereof;
FIG. 17 a bottom plan view thereof;
FIG. 18 a cross-sectional view taken alone line 8—8 in FIG. 2;
FIG. 19 a cross-sectional view taken along 9—9 in FIG. 4; and,
FIG. 20 an enlarged view taken along line 10—10 in FIG. 9.
The inner wall shield for a process chamber for manufacturing semiconductors is typically attached along the inner wall of the process chamber of an etching device. When sufficient high frequency power is connected to upper and lower electrodes of the process chamber, plasma is generated between the electrodes and the inner wall shield prevents the plasma from damaging the inner wall of the process chamber. One or more of the five small circles in one or more of the cross patterns shown in FIGS. 1, 3, 3 and 4 (two patterns), for example, are through holes that are disclaimed in other embodiments (not shown). The outer diameters of the embodiments are preferably about 670 mm, the height of the first embodiment is preferably about 110 mm and the height of the second embodiment is preferably about 150 mm.
Claims (1)
- I claim the ornamental design for inner wall shield for a process chamber for manufacturing semiconductors, as shown and described.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-032005 | 2002-11-20 | ||
JP2002-031987 | 2002-11-20 | ||
JP2002031987 | 2002-11-20 | ||
JP2002032005 | 2002-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD491963S1 true USD491963S1 (en) | 2004-06-22 |
Family
ID=32472466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/182,142 Expired - Lifetime USD491963S1 (en) | 2002-11-20 | 2003-05-20 | Inner wall shield for a process chamber for manufacturing semiconductors |
Country Status (1)
Country | Link |
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US (1) | USD491963S1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120018402A1 (en) * | 2010-07-21 | 2012-01-26 | Applied Materials, Inc. | Plasma processing apparatus and liner assembly for tuning electrical skews |
USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
US20140053984A1 (en) * | 2012-08-27 | 2014-02-27 | Hyun Ho Doh | Symmetric return liner for modulating azimuthal non-uniformity in a plasma processing system |
USD736261S1 (en) * | 2012-11-29 | 2015-08-11 | Cummins Inc. | Shroud |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD805107S1 (en) * | 2016-12-02 | 2017-12-12 | U.S. Farathane Corporation | Engine fan shroud |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
-
2003
- 2003-05-20 US US29/182,142 patent/USD491963S1/en not_active Expired - Lifetime
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10242847B2 (en) | 2010-07-21 | 2019-03-26 | Applied Materials, Inc. | Plasma processing apparatus and liner assembly for tuning electrical skews |
US20120018402A1 (en) * | 2010-07-21 | 2012-01-26 | Applied Materials, Inc. | Plasma processing apparatus and liner assembly for tuning electrical skews |
USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
US20140053984A1 (en) * | 2012-08-27 | 2014-02-27 | Hyun Ho Doh | Symmetric return liner for modulating azimuthal non-uniformity in a plasma processing system |
USD736261S1 (en) * | 2012-11-29 | 2015-08-11 | Cummins Inc. | Shroud |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD805107S1 (en) * | 2016-12-02 | 2017-12-12 | U.S. Farathane Corporation | Engine fan shroud |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
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