TWD193203S - Elastic film for semiconductor wafer polishing - Google Patents
Elastic film for semiconductor wafer polishingInfo
- Publication number
- TWD193203S TWD193203S TW106303209F TW106303209F TWD193203S TW D193203 S TWD193203 S TW D193203S TW 106303209 F TW106303209 F TW 106303209F TW 106303209 F TW106303209 F TW 106303209F TW D193203 S TWD193203 S TW D193203S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- article
- wafer
- polishing
- elastic film
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract description 7
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 239000012528 membrane Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007517 polishing process Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是半導體晶圓研磨用彈性膜(亦稱為隔模(membrane))，為一種應用於半導體等的製造上之晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓，並且，通過小孔進行真空吸引來保持晶圓。;【設計說明】;仰視圖與俯視圖相對稱，仰視圖省略。;左側視圖與右側視圖相對稱，左側視圖省略。
Description
本設計的物品是半導體晶圓研磨用彈性膜(亦稱為隔模(membrane))，為一種應用於半導體等的製造上之晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓，並且，通過小孔進行真空吸引來保持晶圓。
仰視圖與俯視圖相對稱，仰視圖省略。
左側視圖與右側視圖相對稱，左側視圖省略。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-26913F JP1582993S (zh) | 2016-12-12 | 2016-12-12 | |
| JP2016-026913 | 2016-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD193203S true TWD193203S (zh) | 2018-10-01 |
Family
ID=62976775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106303209F TWD193203S (zh) | 2016-12-12 | 2017-06-12 | Elastic film for semiconductor wafer polishing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1582993S (zh) |
| TW (1) | TWD193203S (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD211589S (zh) | 2019-07-30 | 2021-05-11 | 美商應用材料股份有限公司 | 基板支撐底座 |
-
2016
- 2016-12-12 JP JPD2016-26913F patent/JP1582993S/ja active Active
-
2017
- 2017-06-12 TW TW106303209F patent/TWD193203S/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD211589S (zh) | 2019-07-30 | 2021-05-11 | 美商應用材料股份有限公司 | 基板支撐底座 |
| USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1582993S (zh) | 2018-07-30 |
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