TWD188484S - Part of the elastic film for semiconductor wafer polishing - Google Patents
Part of the elastic film for semiconductor wafer polishingInfo
- Publication number
- TWD188484S TWD188484S TW106303211F TW106303211F TWD188484S TW D188484 S TWD188484 S TW D188484S TW 106303211 F TW106303211 F TW 106303211F TW 106303211 F TW106303211 F TW 106303211F TW D188484 S TWD188484 S TW D188484S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- article
- case
- design
- wafer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract description 7
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 239000012528 membrane Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007517 polishing process Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 1
Abstract
【物品用途】;本部分設計的物品是半導體晶圓研磨用彈性膜(亦稱為隔模(membrane))，為一種應用於半導體等的製造上之晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓，並且，通過小孔進行真空吸引來保持晶圓。;【設計說明】;仰視圖與俯視圖相對稱，仰視圖省略。;左側視圖與右側視圖相對稱，左側視圖省略。;圖式所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。
Description
本部分設計的物品是半導體晶圓研磨用彈性膜(亦稱為隔模(membrane))，為一種應用於半導體等的製造上之晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使膜面朝正面側膨脹，用以將配置在正面側的晶圓單面朝研磨墊按壓，並且，通過小孔進行真空吸引來保持晶圓。
仰視圖與俯視圖相對稱，仰視圖省略。
左側視圖與右側視圖相對稱，左側視圖省略。
圖式所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-026915 | 2016-02-16 | ||
| JPD2016-26915F JP1582995S (zh) | 2016-12-12 | 2016-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD188484S true TWD188484S (zh) | 2018-02-11 |
Family
ID=62976771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106303211F TWD188484S (zh) | 2016-12-12 | 2017-06-12 | Part of the elastic film for semiconductor wafer polishing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1582995S (zh) |
| TW (1) | TWD188484S (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD363464S (en) | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| USD411516S (en) | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
| USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
-
2016
- 2016-12-12 JP JPD2016-26915F patent/JP1582995S/ja active Active
-
2017
- 2017-06-12 TW TW106303211F patent/TWD188484S/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD363464S (en) | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| USD411516S (en) | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1582995S (zh) | 2018-07-30 |
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