TWD202463S - 基板處理裝置用晶舟之部分 - Google Patents

基板處理裝置用晶舟之部分 Download PDF

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Publication number
TWD202463S
TWD202463S TW108302587F TW108302587F TWD202463S TW D202463 S TWD202463 S TW D202463S TW 108302587 F TW108302587 F TW 108302587F TW 108302587 F TW108302587 F TW 108302587F TW D202463 S TWD202463 S TW D202463S
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TW
Taiwan
Prior art keywords
design
wafer boat
case
processing device
substrate processing
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TW108302587F
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English (en)
Inventor
三部誠
津里誠
藤井悟史
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日商國際電氣股份有限公司
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Publication of TWD202463S publication Critical patent/TWD202463S/zh

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Abstract

【物品用途】;本設計的物品是基板處理裝置用晶舟，為一種在半導體晶圓上進行成膜時，在反應室內將半導體晶圓保持水平的晶舟。;【設計說明】;圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。;如「主張設計部分之放大立體圖」所示，在中央部形成有凹下部的梳子狀的保持部係用以載置半導體晶圓。

Description

基板處理裝置用晶舟之部分
本設計的物品是基板處理裝置用晶舟，為一種在半導體晶圓上進行成膜時，在反應室內將半導體晶圓保持水平的晶舟。
圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。
如「主張設計部分之放大立體圖」所示，在中央部形成有凹下部的梳子狀的保持部係用以載置半導體晶圓。
TW108302587F 2018-11-19 2019-05-07 基板處理裝置用晶舟之部分 TWD202463S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-025160 2018-11-19
JPD2018-25160F JP1640260S (zh) 2018-11-19 2018-11-19

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TWD202463S true TWD202463S (zh) 2020-02-01

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JP (1) JP1640260S (zh)
TW (1) TWD202463S (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1678278S (ja) 2020-03-19 2021-02-01 基板処理装置用ボート
JP1731675S (zh) * 2022-05-30 2022-12-08
JP1731674S (zh) * 2022-05-30 2022-12-08
JP1731673S (zh) * 2022-05-30 2022-12-08

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559904B (en) 2001-07-12 2003-11-01 Saint Gobain Ceramics A single cast vertical wafer boat with a Y shaped column rack
TW200509191A (en) 2003-07-16 2005-03-01 Shinetsu Handotai Kk Vertical boat for heat treatment, and method of producing the same
TW201543604A (zh) 2014-03-24 2015-11-16 Tera Semicon Corp 晶舟

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USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
CN105406223B (zh) * 2015-11-23 2018-12-04 美科科技（北京）有限公司 磁性连接式的电子模块和模块化电子构建系统
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
JP1565481S (zh) * 2016-05-25 2016-12-19
JP1585831S (zh) * 2017-01-05 2017-09-11
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
JP1597807S (zh) * 2017-08-21 2018-02-19
JP1605982S (zh) * 2017-12-27 2021-05-31
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
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JP1633578S (zh) * 2018-11-07 2019-06-10
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559904B (en) 2001-07-12 2003-11-01 Saint Gobain Ceramics A single cast vertical wafer boat with a Y shaped column rack
TW200509191A (en) 2003-07-16 2005-03-01 Shinetsu Handotai Kk Vertical boat for heat treatment, and method of producing the same
TWI348725B (zh) 2003-07-16 2011-09-11 Shinetsu Handotai Kk
TW201543604A (zh) 2014-03-24 2015-11-16 Tera Semicon Corp 晶舟

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USD940669S1 (en) 2022-01-11
JP1640260S (zh) 2019-09-02

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