USD873782S1 - Component carrier plate - Google Patents

Component carrier plate Download PDF

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Publication number
USD873782S1
USD873782S1 US29/564,998 US201629564998F USD873782S US D873782 S1 USD873782 S1 US D873782S1 US 201629564998 F US201629564998 F US 201629564998F US D873782 S USD873782 S US D873782S
Authority
US
United States
Prior art keywords
component carrier
carrier plate
view
design
dot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/564,998
Inventor
Douglas J. Garcia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
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Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Priority to US29/564,998 priority Critical patent/USD873782S1/en
Assigned to ELECTRO SCIENTIFIC INDUSTRIES, INC. reassignment ELECTRO SCIENTIFIC INDUSTRIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GARCIA, DOUGLAS J.
Priority to JPD2016-24170F priority patent/JP1577623S/ja
Priority to JPD2016-24171F priority patent/JP1577624S/ja
Priority to TW105306889F priority patent/TWD189276S/en
Publication of USD873782S1 publication Critical patent/USD873782S1/en
Application granted granted Critical
Assigned to BARCLAYS BANK PLC reassignment BARCLAYS BANK PLC PATENT SECURITY AGREEMENT (ABL) Assignors: ELECTRO SCIENTIFIC INDUSTRIES, INC., MKS INSTRUMENTS, INC., NEWPORT CORPORATION
Assigned to BARCLAYS BANK PLC reassignment BARCLAYS BANK PLC PATENT SECURITY AGREEMENT (TERM LOAN) Assignors: ELECTRO SCIENTIFIC INDUSTRIES, INC., MKS INSTRUMENTS, INC., NEWPORT CORPORATION
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ELECTRO SCIENTIFIC INDUSTRIES, INC., MKS INSTRUMENTS, INC., NEWPORT CORPORATION
Assigned to MKS INSTRUMENTS, INC., ELECTRO SCIENTIFIC INDUSTRIES, INC., NEWPORT CORPORATION reassignment MKS INSTRUMENTS, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BARCLAYS BANK PLC
Assigned to MKS INSTRUMENTS, INC., ELECTRO SCIENTIFIC INDUSTRIES, INC., NEWPORT CORPORATION reassignment MKS INSTRUMENTS, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BARCLAYS BANK PLC
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front perspective view of a component carrier plate, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof, the bottom plan view is identical;
FIG. 5 is an isolated partial front view thereof;
FIG. 6 is a cross-sectional view along the line 6-6 shown in FIG. 5; and,
FIG. 7 is a cross-sectional view of a portion of the first embodiment of the ornamental design, as viewed along the line 7-7 shown in FIG. 5.
The evenly broken lines in the drawings depict an unclaimed portion of the plate, and the dash-dot lines depict boundaries of the claim only. The broken lines form no part of the claimed design.
The dash-dot-dot broken line in the drawings depicts boundaries of the partial views only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a component carrier plate, as shown and described.
US29/564,998 2016-05-17 2016-05-17 Component carrier plate Active USD873782S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/564,998 USD873782S1 (en) 2016-05-17 2016-05-17 Component carrier plate
JPD2016-24170F JP1577623S (en) 2016-05-17 2016-11-07
JPD2016-24171F JP1577624S (en) 2016-05-17 2016-11-07
TW105306889F TWD189276S (en) 2016-05-17 2016-11-16 Component carrier plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/564,998 USD873782S1 (en) 2016-05-17 2016-05-17 Component carrier plate

Publications (1)

Publication Number Publication Date
USD873782S1 true USD873782S1 (en) 2020-01-28

Family

ID=58746227

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/564,998 Active USD873782S1 (en) 2016-05-17 2016-05-17 Component carrier plate

Country Status (3)

Country Link
US (1) USD873782S1 (en)
JP (2) JP1577623S (en)
TW (1) TWD189276S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD927575S1 (en) * 2019-01-18 2021-08-10 Shinkawa Ltd. Heater block for bonding apparatus
USD931915S1 (en) * 2019-09-27 2021-09-28 Saint-Gobain Abrasives, Inc. Core design for abrasive article
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber

Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4669416A (en) 1986-06-25 1987-06-02 Metoramic Sciences, Inc. Composite carrier plate
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
US5842579A (en) 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
USD436820S1 (en) * 1999-11-04 2001-01-30 Sankyo Diamond Industrial Co., Ltd. Diamond blade
USD453670S1 (en) * 2001-01-01 2002-02-19 Kulicke & Soffa Investments, Inc. Dicing blade
US6710611B2 (en) * 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
US20040075036A1 (en) * 2002-10-04 2004-04-22 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US6906508B1 (en) * 2003-12-11 2005-06-14 Ceramic Component Technologies, Inc. Component testing system vacuum ring and test plate construction
USD511081S1 (en) * 2003-05-12 2005-11-01 Tkx Corporation Disk for a rotary disk grinder
US7017731B2 (en) 2003-06-26 2006-03-28 Murata Manufacturing Co., Ltd. Electronic component conveying device
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
US7119299B2 (en) 2003-01-20 2006-10-10 Tokyo Weld Co., Ltd. Work inspection system
USD535863S1 (en) * 2005-06-03 2007-01-30 Mi Kyung Cho Cutting blade for a circular saw
USD543333S1 (en) * 2004-06-21 2007-05-22 Tokyo Weld Co., Ltd. Electronic part conveyor table
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559064S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD560457S1 (en) * 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
US7390158B2 (en) 2003-03-28 2008-06-24 Murata Manufacturing Co., Ltd. Handling device for electronic chip components and handling method for electronic chip components
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US7819235B2 (en) * 2007-01-29 2010-10-26 Electro Scientific Industries, Inc. Venturi vacuum generator on an electric component handler
US7888949B2 (en) * 2008-03-21 2011-02-15 Electro Scientific Industries, Inc. Electrical tester setup and calibration device
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
US8033382B2 (en) 2006-05-24 2011-10-11 Murata Manufacturing Co., Ltd. Workpiece transfer apparatus and electronic component transfer apparatus
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
US8051975B2 (en) * 2006-05-24 2011-11-08 Murata Manufacturing Co., Ltd. Workpiece transfer apparatus and electronic component transfer apparatus
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
US8231323B2 (en) * 2007-01-29 2012-07-31 Electro Scientific Industries, Inc. Electronic component handler having gap set device
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD679299S1 (en) * 2011-11-11 2013-04-02 Tyrolit-Schliefmittel Werke Swarovski K.G. Abrasive disc
USD694791S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD695325S1 (en) * 2010-09-27 2013-12-10 Putsch Gmbh & Co.Kg Milling tool
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD718796S1 (en) * 2012-07-06 2014-12-02 Georgi M. Popov Abrasive screen
USD724635S1 (en) * 2012-06-13 2015-03-17 Ppr Gmbh Front surface of a grinding disc
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD734376S1 (en) * 2014-01-20 2015-07-14 Orenda Automation Technologies Inc. Disc for disc mill assembly
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
USD741925S1 (en) * 2014-06-23 2015-10-27 Saf-Holland Canada Limited Cultivating cutting disc
USD743357S1 (en) * 2013-03-01 2015-11-17 Asm Ip Holding B.V. Susceptor
USD746344S1 (en) * 2013-05-20 2015-12-29 Cozzini Llc Emulsion plate
USD768743S1 (en) * 2014-09-16 2016-10-11 Ntn Corporation Cage of thrust roller bearing
USD784937S1 (en) * 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD809033S1 (en) * 2015-12-28 2018-01-30 Ntn Corporation Retainer for rolling bearing
USD825504S1 (en) * 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD860747S1 (en) * 2017-10-16 2019-09-24 William P. Russo Tapered segment diamond blade

Patent Citations (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4669416A (en) 1986-06-25 1987-06-02 Metoramic Sciences, Inc. Composite carrier plate
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
US5842579A (en) 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
USD436820S1 (en) * 1999-11-04 2001-01-30 Sankyo Diamond Industrial Co., Ltd. Diamond blade
USD453670S1 (en) * 2001-01-01 2002-02-19 Kulicke & Soffa Investments, Inc. Dicing blade
US6710611B2 (en) * 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
US20040075036A1 (en) * 2002-10-04 2004-04-22 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7119299B2 (en) 2003-01-20 2006-10-10 Tokyo Weld Co., Ltd. Work inspection system
US7390158B2 (en) 2003-03-28 2008-06-24 Murata Manufacturing Co., Ltd. Handling device for electronic chip components and handling method for electronic chip components
USD511081S1 (en) * 2003-05-12 2005-11-01 Tkx Corporation Disk for a rotary disk grinder
US7017731B2 (en) 2003-06-26 2006-03-28 Murata Manufacturing Co., Ltd. Electronic component conveying device
US6906508B1 (en) * 2003-12-11 2005-06-14 Ceramic Component Technologies, Inc. Component testing system vacuum ring and test plate construction
USD581237S1 (en) * 2004-03-17 2008-11-25 Jsr Corporation Polishing pad
USD559064S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD576855S1 (en) * 2004-03-17 2008-09-16 Jsr Corporation Polishing pad
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD543333S1 (en) * 2004-06-21 2007-05-22 Tokyo Weld Co., Ltd. Electronic part conveyor table
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
USD560457S1 (en) * 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD592029S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD600989S1 (en) * 2004-10-26 2009-09-29 Jsr Corporation Polishing pad
USD584591S1 (en) * 2004-10-26 2009-01-13 Jsr Corporation Polishing pad
USD535863S1 (en) * 2005-06-03 2007-01-30 Mi Kyung Cho Cutting blade for a circular saw
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US8033382B2 (en) 2006-05-24 2011-10-11 Murata Manufacturing Co., Ltd. Workpiece transfer apparatus and electronic component transfer apparatus
US8051975B2 (en) * 2006-05-24 2011-11-08 Murata Manufacturing Co., Ltd. Workpiece transfer apparatus and electronic component transfer apparatus
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
US8231323B2 (en) * 2007-01-29 2012-07-31 Electro Scientific Industries, Inc. Electronic component handler having gap set device
US7819235B2 (en) * 2007-01-29 2010-10-26 Electro Scientific Industries, Inc. Venturi vacuum generator on an electric component handler
US7888949B2 (en) * 2008-03-21 2011-02-15 Electro Scientific Industries, Inc. Electrical tester setup and calibration device
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD695325S1 (en) * 2010-09-27 2013-12-10 Putsch Gmbh & Co.Kg Milling tool
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694791S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD679299S1 (en) * 2011-11-11 2013-04-02 Tyrolit-Schliefmittel Werke Swarovski K.G. Abrasive disc
USD724635S1 (en) * 2012-06-13 2015-03-17 Ppr Gmbh Front surface of a grinding disc
USD718796S1 (en) * 2012-07-06 2014-12-02 Georgi M. Popov Abrasive screen
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD743357S1 (en) * 2013-03-01 2015-11-17 Asm Ip Holding B.V. Susceptor
USD746344S1 (en) * 2013-05-20 2015-12-29 Cozzini Llc Emulsion plate
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD734376S1 (en) * 2014-01-20 2015-07-14 Orenda Automation Technologies Inc. Disc for disc mill assembly
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
USD741925S1 (en) * 2014-06-23 2015-10-27 Saf-Holland Canada Limited Cultivating cutting disc
USD768743S1 (en) * 2014-09-16 2016-10-11 Ntn Corporation Cage of thrust roller bearing
USD784937S1 (en) * 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD825504S1 (en) * 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD809033S1 (en) * 2015-12-28 2018-01-30 Ntn Corporation Retainer for rolling bearing
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD860747S1 (en) * 2017-10-16 2019-09-24 William P. Russo Tapered segment diamond blade

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD927575S1 (en) * 2019-01-18 2021-08-10 Shinkawa Ltd. Heater block for bonding apparatus
USD959525S1 (en) 2019-01-18 2022-08-02 Shinkawa Ltd. Heater block for bonding apparatus
USD931915S1 (en) * 2019-09-27 2021-09-28 Saint-Gobain Abrasives, Inc. Core design for abrasive article
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber

Also Published As

Publication number Publication date
JP1577624S (en) 2017-05-29
JP1577623S (en) 2017-05-29
TWD189276S (en) 2018-03-21

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