USD959525S1 - Heater block for bonding apparatus - Google Patents
Heater block for bonding apparatus Download PDFInfo
- Publication number
- USD959525S1 USD959525S1 US29/783,399 US202129783399F USD959525S US D959525 S1 USD959525 S1 US D959525S1 US 202129783399 F US202129783399 F US 202129783399F US D959525 S USD959525 S US D959525S
- Authority
- US
- United States
- Prior art keywords
- bonding apparatus
- heater block
- line
- taken along
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
Description
The dash-dash broken line portions of the night light in FIGS. 1-18 represent unclaimed portions of the claimed design and form no part thereof. The alternating long and short dash broken line shown in FIGS. 1, 3, 4, 7, 8, and 18 represent the boundary of the claimed design and form no part thereof.
Claims (1)
- The ornamental design for a heater block for bonding apparatus, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/783,399 USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-000876 | 2019-01-18 | ||
JP2019-000875 | 2019-01-18 | ||
JP2019000875F JP1647295S (en) | 2019-01-18 | 2019-01-18 | |
JPD2019-876F JP1647811S (en) | 2019-01-18 | 2019-01-18 | |
XHDM206889 | 2019-07-18 | ||
WODM/206889 | 2019-07-18 | ||
US35/355,090 USD927575S1 (en) | 2019-01-18 | 2019-07-18 | Heater block for bonding apparatus |
US29/783,399 USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,090 Division USD927575S1 (en) | 2019-01-18 | 2019-07-18 | Heater block for bonding apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
USD959525S1 true USD959525S1 (en) | 2022-08-02 |
Family
ID=77148067
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,090 Active USD927575S1 (en) | 2019-01-18 | 2019-07-18 | Heater block for bonding apparatus |
US29/783,399 Active USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,090 Active USD927575S1 (en) | 2019-01-18 | 2019-07-18 | Heater block for bonding apparatus |
Country Status (1)
Country | Link |
---|---|
US (2) | USD927575S1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD927575S1 (en) * | 2019-01-18 | 2021-08-10 | Shinkawa Ltd. | Heater block for bonding apparatus |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4286564A (en) * | 1979-11-21 | 1981-09-01 | Richard Van Tuyl | System for preheating fuel |
US5281794A (en) * | 1990-05-25 | 1994-01-25 | Kabushiki Kaisha Shinkawa | Heater block for use in a bonder utilizing vacuum suction attachment means |
US5306664A (en) | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
US5531835A (en) | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
US5653375A (en) | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
US5810933A (en) | 1996-02-16 | 1998-09-22 | Novellus Systems, Inc. | Wafer cooling device |
US6394797B1 (en) | 1997-04-02 | 2002-05-28 | Hitachi, Ltd. | Substrate temperature control system and method for controlling temperature of substrate |
US20020162630A1 (en) | 2000-10-19 | 2002-11-07 | Kiyoshi Satoh | Semiconductor substrate-supporting apparatus |
US6634882B2 (en) | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
US6709267B1 (en) | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
US20050274708A1 (en) | 2004-06-10 | 2005-12-15 | Asm Technology Singapore Pte Ltd | Heating apparatus and method for semiconductor devices |
US20060011298A1 (en) | 2004-07-15 | 2006-01-19 | Ji-Eun Lim | Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates |
USD529057S1 (en) | 2004-08-16 | 2006-09-26 | Williams Advanced Materials, Inc. | Sputtering target |
USD643055S1 (en) | 2008-09-11 | 2011-08-09 | Asm Japan K.K. | Heater block for use in a semiconductor processing tool |
US7993462B2 (en) | 2008-03-19 | 2011-08-09 | Asm Japan K.K. | Substrate-supporting device having continuous concavity |
US20120318853A1 (en) | 2011-06-15 | 2012-12-20 | Freescale Semiconductor, Inc | Heater block for wire bonding system |
USD724196S1 (en) * | 2013-12-17 | 2015-03-10 | Stingray Group, Llc | Heater block for pressure digestion vessels |
USD725168S1 (en) | 2014-02-04 | 2015-03-24 | Asm Ip Holding B.V. | Heater block |
USD726884S1 (en) | 2014-02-04 | 2015-04-14 | Asm Ip Holding B.V. | Heater block |
US9022064B2 (en) * | 2012-05-10 | 2015-05-05 | David Deng | Dual fuel control device with auxiliary backline pressure regulator |
US9607822B2 (en) | 2014-04-21 | 2017-03-28 | Lam Research Corporation | Pretreatment method for photoresist wafer processing |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD807921S1 (en) * | 2015-03-05 | 2018-01-16 | Jaroslaw Grzesiak | Fuel heater block |
US10087525B2 (en) | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD859484S1 (en) * | 2017-06-12 | 2019-09-10 | Asm Ip Holding B.V. | Heater block |
USD873782S1 (en) | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD927575S1 (en) * | 2019-01-18 | 2021-08-10 | Shinkawa Ltd. | Heater block for bonding apparatus |
-
2019
- 2019-07-18 US US35/355,090 patent/USD927575S1/en active Active
-
2021
- 2021-05-13 US US29/783,399 patent/USD959525S1/en active Active
Patent Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4286564A (en) * | 1979-11-21 | 1981-09-01 | Richard Van Tuyl | System for preheating fuel |
US5281794A (en) * | 1990-05-25 | 1994-01-25 | Kabushiki Kaisha Shinkawa | Heater block for use in a bonder utilizing vacuum suction attachment means |
US5306664A (en) | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
US5531835A (en) | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
US5653375A (en) | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
US5810933A (en) | 1996-02-16 | 1998-09-22 | Novellus Systems, Inc. | Wafer cooling device |
US6394797B1 (en) | 1997-04-02 | 2002-05-28 | Hitachi, Ltd. | Substrate temperature control system and method for controlling temperature of substrate |
US20020162630A1 (en) | 2000-10-19 | 2002-11-07 | Kiyoshi Satoh | Semiconductor substrate-supporting apparatus |
US6634882B2 (en) | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
US6709267B1 (en) | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
US20050274708A1 (en) | 2004-06-10 | 2005-12-15 | Asm Technology Singapore Pte Ltd | Heating apparatus and method for semiconductor devices |
US20060011298A1 (en) | 2004-07-15 | 2006-01-19 | Ji-Eun Lim | Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates |
USD529057S1 (en) | 2004-08-16 | 2006-09-26 | Williams Advanced Materials, Inc. | Sputtering target |
US7993462B2 (en) | 2008-03-19 | 2011-08-09 | Asm Japan K.K. | Substrate-supporting device having continuous concavity |
USD643055S1 (en) | 2008-09-11 | 2011-08-09 | Asm Japan K.K. | Heater block for use in a semiconductor processing tool |
US20120318853A1 (en) | 2011-06-15 | 2012-12-20 | Freescale Semiconductor, Inc | Heater block for wire bonding system |
US9022064B2 (en) * | 2012-05-10 | 2015-05-05 | David Deng | Dual fuel control device with auxiliary backline pressure regulator |
USD724196S1 (en) * | 2013-12-17 | 2015-03-10 | Stingray Group, Llc | Heater block for pressure digestion vessels |
USD725168S1 (en) | 2014-02-04 | 2015-03-24 | Asm Ip Holding B.V. | Heater block |
USD726884S1 (en) | 2014-02-04 | 2015-04-14 | Asm Ip Holding B.V. | Heater block |
US9607822B2 (en) | 2014-04-21 | 2017-03-28 | Lam Research Corporation | Pretreatment method for photoresist wafer processing |
USD807921S1 (en) * | 2015-03-05 | 2018-01-16 | Jaroslaw Grzesiak | Fuel heater block |
US10087525B2 (en) | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
USD873782S1 (en) | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD859484S1 (en) * | 2017-06-12 | 2019-09-10 | Asm Ip Holding B.V. | Heater block |
USD927575S1 (en) * | 2019-01-18 | 2021-08-10 | Shinkawa Ltd. | Heater block for bonding apparatus |
Also Published As
Publication number | Publication date |
---|---|
USD927575S1 (en) | 2021-08-10 |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |