USD927575S1 - Heater block for bonding apparatus - Google Patents
Heater block for bonding apparatus Download PDFInfo
- Publication number
- USD927575S1 USD927575S1 US35/355,090 US35509031F USD927575S US D927575 S1 USD927575 S1 US D927575S1 US 35509031 F US35509031 F US 35509031F US D927575 S USD927575 S US D927575S
- Authority
- US
- United States
- Prior art keywords
- bonding apparatus
- heater block
- line
- taken along
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Description
FIG. 1.1 is a front view of a heater block for bonding apparatus showing my new design;
FIG. 1.2 is a back view thereof;
FIG. 1.3 is a top view thereof;
FIG. 1.4 is a bottom view thereof;
FIG. 1.5 is a right view thereof;
FIG. 1.6 is a left view thereof;
FIG. 1.7 is a front perspective view thereof;
FIG. 1.8 is a back perspective view thereof;
FIG. 1.9 is a transverse sectional view taken along the line 1.9-1.9 in FIG. 1.1 ;
FIG. 1.10 is a transverse sectional view taken along the line 1.10-1.10 in FIG. 1.1 ;
FIG. 1.11 is a transverse sectional view taken along the line 1.11-1.11 in FIG. 1.1 ;
FIG. 1.12 is a transverse sectional view taken along the line 1.12-1.12 in FIG. 1.1 ;
FIG. 1.13 is a transverse sectional view taken along the line 1.13-1.13 in FIG. 1.1 ;
FIG. 1.14 is a longitudinal sectional view taken along the line 1.14-1 4 in FIG. 1.1 ;
FIG. 1.15 is a longitudinal sectional view taken along the line 1.15-1.15 in FIG. 1.1 ;
FIG. 1.16 is a longitudinal sectional view taken along the line 1.16-1.16 in FIG. 1.1 ;
FIG. 1.17 is a longitudinal sectional view taken along the line 1.17-1.17 in FIG. 1.1 ;
FIG. 1.18 is a transverse sectional view taken along the line 1.18-1.18 in FIG. 1.3 ; and,
FIG. 1.19 is a cross-sectional perspective view taken along the line 1.19-1.19 in FIG. 1.1 .
Claims (1)
- The ornamental design for a heater block for bonding apparatus, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/783,399 USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-000875 | 2019-01-18 | ||
JPD2019-876F JP1647811S (en) | 2019-01-18 | 2019-01-18 | |
JP2019000875F JP1647295S (en) | 2019-01-18 | 2019-01-18 | |
JP2019-000876 | 2019-01-18 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/783,399 Division USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
USD927575S1 true USD927575S1 (en) | 2021-08-10 |
Family
ID=77148067
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,090 Active USD927575S1 (en) | 2019-01-18 | 2019-07-18 | Heater block for bonding apparatus |
US29/783,399 Active USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/783,399 Active USD959525S1 (en) | 2019-01-18 | 2021-05-13 | Heater block for bonding apparatus |
Country Status (1)
Country | Link |
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US (2) | USD927575S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD959525S1 (en) * | 2019-01-18 | 2022-08-02 | Shinkawa Ltd. | Heater block for bonding apparatus |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5306664A (en) * | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
US5531835A (en) * | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
US5653375A (en) * | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
US5810933A (en) * | 1996-02-16 | 1998-09-22 | Novellus Systems, Inc. | Wafer cooling device |
US6394797B1 (en) * | 1997-04-02 | 2002-05-28 | Hitachi, Ltd. | Substrate temperature control system and method for controlling temperature of substrate |
US20020162630A1 (en) * | 2000-10-19 | 2002-11-07 | Kiyoshi Satoh | Semiconductor substrate-supporting apparatus |
US6634882B2 (en) * | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
US6709267B1 (en) * | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
US20050274708A1 (en) * | 2004-06-10 | 2005-12-15 | Asm Technology Singapore Pte Ltd | Heating apparatus and method for semiconductor devices |
US20060011298A1 (en) * | 2004-07-15 | 2006-01-19 | Ji-Eun Lim | Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates |
USD529057S1 (en) * | 2004-08-16 | 2006-09-26 | Williams Advanced Materials, Inc. | Sputtering target |
USD643055S1 (en) * | 2008-09-11 | 2011-08-09 | Asm Japan K.K. | Heater block for use in a semiconductor processing tool |
US7993462B2 (en) * | 2008-03-19 | 2011-08-09 | Asm Japan K.K. | Substrate-supporting device having continuous concavity |
US20120318853A1 (en) * | 2011-06-15 | 2012-12-20 | Freescale Semiconductor, Inc | Heater block for wire bonding system |
USD724196S1 (en) * | 2013-12-17 | 2015-03-10 | Stingray Group, Llc | Heater block for pressure digestion vessels |
USD725168S1 (en) * | 2014-02-04 | 2015-03-24 | Asm Ip Holding B.V. | Heater block |
USD726884S1 (en) * | 2014-02-04 | 2015-04-14 | Asm Ip Holding B.V. | Heater block |
US9607822B2 (en) * | 2014-04-21 | 2017-03-28 | Lam Research Corporation | Pretreatment method for photoresist wafer processing |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD807921S1 (en) * | 2015-03-05 | 2018-01-16 | Jaroslaw Grzesiak | Fuel heater block |
US10087525B2 (en) * | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD859484S1 (en) * | 2017-06-12 | 2019-09-10 | Asm Ip Holding B.V. | Heater block |
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4286564A (en) * | 1979-11-21 | 1981-09-01 | Richard Van Tuyl | System for preheating fuel |
US5281794A (en) * | 1990-05-25 | 1994-01-25 | Kabushiki Kaisha Shinkawa | Heater block for use in a bonder utilizing vacuum suction attachment means |
US9022064B2 (en) * | 2012-05-10 | 2015-05-05 | David Deng | Dual fuel control device with auxiliary backline pressure regulator |
USD927575S1 (en) * | 2019-01-18 | 2021-08-10 | Shinkawa Ltd. | Heater block for bonding apparatus |
-
2019
- 2019-07-18 US US35/355,090 patent/USD927575S1/en active Active
-
2021
- 2021-05-13 US US29/783,399 patent/USD959525S1/en active Active
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5306664A (en) * | 1991-05-16 | 1994-04-26 | Seiko Epson Corp. | Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
US5531835A (en) * | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
US5653375A (en) * | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
US5810933A (en) * | 1996-02-16 | 1998-09-22 | Novellus Systems, Inc. | Wafer cooling device |
US6394797B1 (en) * | 1997-04-02 | 2002-05-28 | Hitachi, Ltd. | Substrate temperature control system and method for controlling temperature of substrate |
US20020162630A1 (en) * | 2000-10-19 | 2002-11-07 | Kiyoshi Satoh | Semiconductor substrate-supporting apparatus |
US6634882B2 (en) * | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
US6709267B1 (en) * | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
US20050274708A1 (en) * | 2004-06-10 | 2005-12-15 | Asm Technology Singapore Pte Ltd | Heating apparatus and method for semiconductor devices |
US20060011298A1 (en) * | 2004-07-15 | 2006-01-19 | Ji-Eun Lim | Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates |
USD529057S1 (en) * | 2004-08-16 | 2006-09-26 | Williams Advanced Materials, Inc. | Sputtering target |
US7993462B2 (en) * | 2008-03-19 | 2011-08-09 | Asm Japan K.K. | Substrate-supporting device having continuous concavity |
USD643055S1 (en) * | 2008-09-11 | 2011-08-09 | Asm Japan K.K. | Heater block for use in a semiconductor processing tool |
US20120318853A1 (en) * | 2011-06-15 | 2012-12-20 | Freescale Semiconductor, Inc | Heater block for wire bonding system |
USD724196S1 (en) * | 2013-12-17 | 2015-03-10 | Stingray Group, Llc | Heater block for pressure digestion vessels |
USD725168S1 (en) * | 2014-02-04 | 2015-03-24 | Asm Ip Holding B.V. | Heater block |
USD726884S1 (en) * | 2014-02-04 | 2015-04-14 | Asm Ip Holding B.V. | Heater block |
US9607822B2 (en) * | 2014-04-21 | 2017-03-28 | Lam Research Corporation | Pretreatment method for photoresist wafer processing |
USD807921S1 (en) * | 2015-03-05 | 2018-01-16 | Jaroslaw Grzesiak | Fuel heater block |
US10087525B2 (en) * | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD859484S1 (en) * | 2017-06-12 | 2019-09-10 | Asm Ip Holding B.V. | Heater block |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD959525S1 (en) * | 2019-01-18 | 2022-08-02 | Shinkawa Ltd. | Heater block for bonding apparatus |
Also Published As
Publication number | Publication date |
---|---|
USD959525S1 (en) | 2022-08-02 |
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