USD927575S1 - Heater block for bonding apparatus - Google Patents

Heater block for bonding apparatus Download PDF

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Publication number
USD927575S1
USD927575S1 US35/355,090 US35509031F USD927575S US D927575 S1 USD927575 S1 US D927575S1 US 35509031 F US35509031 F US 35509031F US D927575 S USD927575 S US D927575S
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United States
Prior art keywords
bonding apparatus
heater block
line
taken along
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,090
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Inventor
Kazuaki Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2019-876F external-priority patent/JP1647811S/ja
Priority claimed from JP2019000875F external-priority patent/JP1647295S/ja
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Assigned to SHINKAWA LTD. reassignment SHINKAWA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAGANO, KAZUAKI
Priority to US29/783,399 priority Critical patent/USD959525S1/en
Application granted granted Critical
Publication of USD927575S1 publication Critical patent/USD927575S1/en
Active legal-status Critical Current
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Description

FIG. 1.1 is a front view of a heater block for bonding apparatus showing my new design;
FIG. 1.2 is a back view thereof;
FIG. 1.3 is a top view thereof;
FIG. 1.4 is a bottom view thereof;
FIG. 1.5 is a right view thereof;
FIG. 1.6 is a left view thereof;
FIG. 1.7 is a front perspective view thereof;
FIG. 1.8 is a back perspective view thereof;
FIG. 1.9 is a transverse sectional view taken along the line 1.9-1.9 in FIG. 1.1;
FIG. 1.10 is a transverse sectional view taken along the line 1.10-1.10 in FIG. 1.1;
FIG. 1.11 is a transverse sectional view taken along the line 1.11-1.11 in FIG. 1.1;
FIG. 1.12 is a transverse sectional view taken along the line 1.12-1.12 in FIG. 1.1;
FIG. 1.13 is a transverse sectional view taken along the line 1.13-1.13 in FIG. 1.1;
FIG. 1.14 is a longitudinal sectional view taken along the line 1.14-1 4 in FIG. 1.1;
FIG. 1.15 is a longitudinal sectional view taken along the line 1.15-1.15 in FIG. 1.1;
FIG. 1.16 is a longitudinal sectional view taken along the line 1.16-1.16 in FIG. 1.1;
FIG. 1.17 is a longitudinal sectional view taken along the line 1.17-1.17 in FIG. 1.1;
FIG. 1.18 is a transverse sectional view taken along the line 1.18-1.18 in FIG. 1.3; and,
FIG. 1.19 is a cross-sectional perspective view taken along the line 1.19-1.19 in FIG. 1.1.

Claims (1)

    CLAIM
  1. The ornamental design for a heater block for bonding apparatus, as shown and described.
US35/355,090 2019-01-18 2019-07-18 Heater block for bonding apparatus Active USD927575S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/783,399 USD959525S1 (en) 2019-01-18 2021-05-13 Heater block for bonding apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-000875 2019-01-18
JPD2019-876F JP1647811S (en) 2019-01-18 2019-01-18
JP2019000875F JP1647295S (en) 2019-01-18 2019-01-18
JP2019-000876 2019-01-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/783,399 Division USD959525S1 (en) 2019-01-18 2021-05-13 Heater block for bonding apparatus

Publications (1)

Publication Number Publication Date
USD927575S1 true USD927575S1 (en) 2021-08-10

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
US35/355,090 Active USD927575S1 (en) 2019-01-18 2019-07-18 Heater block for bonding apparatus
US29/783,399 Active USD959525S1 (en) 2019-01-18 2021-05-13 Heater block for bonding apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/783,399 Active USD959525S1 (en) 2019-01-18 2021-05-13 Heater block for bonding apparatus

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD959525S1 (en) * 2019-01-18 2022-08-02 Shinkawa Ltd. Heater block for bonding apparatus

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
US5531835A (en) * 1994-05-18 1996-07-02 Applied Materials, Inc. Patterned susceptor to reduce electrostatic force in a CVD chamber
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US6394797B1 (en) * 1997-04-02 2002-05-28 Hitachi, Ltd. Substrate temperature control system and method for controlling temperature of substrate
US20020162630A1 (en) * 2000-10-19 2002-11-07 Kiyoshi Satoh Semiconductor substrate-supporting apparatus
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US6709267B1 (en) * 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US20050274708A1 (en) * 2004-06-10 2005-12-15 Asm Technology Singapore Pte Ltd Heating apparatus and method for semiconductor devices
US20060011298A1 (en) * 2004-07-15 2006-01-19 Ji-Eun Lim Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
USD643055S1 (en) * 2008-09-11 2011-08-09 Asm Japan K.K. Heater block for use in a semiconductor processing tool
US7993462B2 (en) * 2008-03-19 2011-08-09 Asm Japan K.K. Substrate-supporting device having continuous concavity
US20120318853A1 (en) * 2011-06-15 2012-12-20 Freescale Semiconductor, Inc Heater block for wire bonding system
USD724196S1 (en) * 2013-12-17 2015-03-10 Stingray Group, Llc Heater block for pressure digestion vessels
USD725168S1 (en) * 2014-02-04 2015-03-24 Asm Ip Holding B.V. Heater block
USD726884S1 (en) * 2014-02-04 2015-04-14 Asm Ip Holding B.V. Heater block
US9607822B2 (en) * 2014-04-21 2017-03-28 Lam Research Corporation Pretreatment method for photoresist wafer processing
USD799646S1 (en) * 2016-08-30 2017-10-10 Asm Ip Holding B.V. Heater block
USD807921S1 (en) * 2015-03-05 2018-01-16 Jaroslaw Grzesiak Fuel heater block
US10087525B2 (en) * 2015-08-04 2018-10-02 Asm Ip Holding B.V. Variable gap hard stop design
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286564A (en) * 1979-11-21 1981-09-01 Richard Van Tuyl System for preheating fuel
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means
US9022064B2 (en) * 2012-05-10 2015-05-05 David Deng Dual fuel control device with auxiliary backline pressure regulator
USD927575S1 (en) * 2019-01-18 2021-08-10 Shinkawa Ltd. Heater block for bonding apparatus

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
US5531835A (en) * 1994-05-18 1996-07-02 Applied Materials, Inc. Patterned susceptor to reduce electrostatic force in a CVD chamber
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US6394797B1 (en) * 1997-04-02 2002-05-28 Hitachi, Ltd. Substrate temperature control system and method for controlling temperature of substrate
US20020162630A1 (en) * 2000-10-19 2002-11-07 Kiyoshi Satoh Semiconductor substrate-supporting apparatus
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US6709267B1 (en) * 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US20050274708A1 (en) * 2004-06-10 2005-12-15 Asm Technology Singapore Pte Ltd Heating apparatus and method for semiconductor devices
US20060011298A1 (en) * 2004-07-15 2006-01-19 Ji-Eun Lim Showerhead with branched gas receiving channel and apparatus including the same for use in manufacturing semiconductor substrates
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
US7993462B2 (en) * 2008-03-19 2011-08-09 Asm Japan K.K. Substrate-supporting device having continuous concavity
USD643055S1 (en) * 2008-09-11 2011-08-09 Asm Japan K.K. Heater block for use in a semiconductor processing tool
US20120318853A1 (en) * 2011-06-15 2012-12-20 Freescale Semiconductor, Inc Heater block for wire bonding system
USD724196S1 (en) * 2013-12-17 2015-03-10 Stingray Group, Llc Heater block for pressure digestion vessels
USD725168S1 (en) * 2014-02-04 2015-03-24 Asm Ip Holding B.V. Heater block
USD726884S1 (en) * 2014-02-04 2015-04-14 Asm Ip Holding B.V. Heater block
US9607822B2 (en) * 2014-04-21 2017-03-28 Lam Research Corporation Pretreatment method for photoresist wafer processing
USD807921S1 (en) * 2015-03-05 2018-01-16 Jaroslaw Grzesiak Fuel heater block
US10087525B2 (en) * 2015-08-04 2018-10-02 Asm Ip Holding B.V. Variable gap hard stop design
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD799646S1 (en) * 2016-08-30 2017-10-10 Asm Ip Holding B.V. Heater block
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD959525S1 (en) * 2019-01-18 2022-08-02 Shinkawa Ltd. Heater block for bonding apparatus

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