USD986190S1 - Confinement plate for a substrate processing chamber - Google Patents
Confinement plate for a substrate processing chamber Download PDFInfo
- Publication number
- USD986190S1 USD986190S1 US29/824,387 US202229824387F USD986190S US D986190 S1 USD986190 S1 US D986190S1 US 202229824387 F US202229824387 F US 202229824387F US D986190 S USD986190 S US D986190S
- Authority
- US
- United States
- Prior art keywords
- processing chamber
- substrate processing
- confinement plate
- confinement
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dashed lines in FIGS. 1-8 represent unclaimed environment forming no part of the claimed design.
Claims (1)
- The ornamental design for a confinement plate for a substrate processing chamber, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/824,387 USD986190S1 (en) | 2020-03-19 | 2022-01-24 | Confinement plate for a substrate processing chamber |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,616 USD943539S1 (en) | 2020-03-19 | 2020-03-19 | Confinement plate for a substrate processing chamber |
US29/824,387 USD986190S1 (en) | 2020-03-19 | 2022-01-24 | Confinement plate for a substrate processing chamber |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,616 Division USD943539S1 (en) | 2020-03-19 | 2020-03-19 | Confinement plate for a substrate processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
USD986190S1 true USD986190S1 (en) | 2023-05-16 |
Family
ID=76084096
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,616 Active USD943539S1 (en) | 2020-03-19 | 2020-03-19 | Confinement plate for a substrate processing chamber |
US29/824,387 Active USD986190S1 (en) | 2020-03-19 | 2022-01-24 | Confinement plate for a substrate processing chamber |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,616 Active USD943539S1 (en) | 2020-03-19 | 2020-03-19 | Confinement plate for a substrate processing chamber |
Country Status (3)
Country | Link |
---|---|
US (2) | USD943539S1 (en) |
JP (2) | JP1686348S (en) |
TW (2) | TWD216905S (en) |
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USD883035S1 (en) * | 2018-08-07 | 2020-05-05 | Frontline Advance Llc | Eating dish with a removable handle |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1012873S1 (en) * | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
JP1684468S (en) * | 2020-09-24 | 2021-05-10 | ||
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
Citations (71)
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US20140113453A1 (en) | 2012-10-24 | 2014-04-24 | Lam Research Corporation | Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
US20140116338A1 (en) | 2012-10-29 | 2014-05-01 | Advanced Micro-Fabrication Equipment Inc, Shanghai | Coating for performance enhancement of semiconductor apparatus |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709537S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
US8826855B2 (en) * | 2010-06-30 | 2014-09-09 | Lam Research Corporation | C-shaped confinement ring for a plasma processing chamber |
USD713363S1 (en) | 2013-12-31 | 2014-09-16 | Celadon Systems, Inc. | Support for a probe test core |
US8893702B2 (en) | 2013-02-20 | 2014-11-25 | Lam Research Corporation | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses |
USD729730S1 (en) | 2013-06-06 | 2015-05-19 | Jon Simon Gillespie-Brown | Power charging ring |
US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
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US20150329955A1 (en) | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
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USD766849S1 (en) | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
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CN106898534A (en) | 2015-12-21 | 2017-06-27 | 中微半导体设备(上海)有限公司 | Plasma confinement ring, plasma processing apparatus and processing method for substrate |
USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
US9779916B2 (en) | 2009-08-31 | 2017-10-03 | Lam Research Corporation | Radio frequency (RF) ground return arrangements |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
US20180061618A1 (en) | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Plasma screen for plasma processing chamber |
USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
TWD195951S (en) | 2018-05-29 | 2019-02-11 | 中國探針股份有限公司 | Probe test head |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
KR102040281B1 (en) | 2018-04-26 | 2019-11-04 | 주식회사 건테크 | Limited ring for semiconductor plasma etching process using CVD-SiC material |
USD871609S1 (en) | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
USD873782S1 (en) | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD876504S1 (en) | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
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USD891636S1 (en) | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
USD891382S1 (en) | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD895777S1 (en) | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD947914S1 (en) * | 2020-11-23 | 2022-04-05 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
-
2020
- 2020-03-19 US US29/728,616 patent/USD943539S1/en active Active
- 2020-09-16 TW TW109305190F patent/TWD216905S/en unknown
- 2020-09-16 TW TW110303814F patent/TWD220838S/en unknown
- 2020-09-19 JP JPD2020-20096F patent/JP1686348S/ja active Active
- 2020-09-19 JP JPD2021-5070F patent/JP1698489S/ja active Active
-
2022
- 2022-01-24 US US29/824,387 patent/USD986190S1/en active Active
Patent Citations (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6156151A (en) | 1996-07-19 | 2000-12-05 | Tokyo Electron Limited | Plasma processing apparatus |
US6129808A (en) | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
US6464843B1 (en) | 1998-03-31 | 2002-10-15 | Lam Research Corporation | Contamination controlling method and apparatus for a plasma processing chamber |
US6506685B2 (en) | 1998-12-28 | 2003-01-14 | Lam Research Corporation | Perforated plasma confinement ring in plasma reactors |
US6224472B1 (en) | 1999-06-24 | 2001-05-01 | Samsung Austin Semiconductor, L.P. | Retaining ring for chemical mechanical polishing |
US6506254B1 (en) | 2000-06-30 | 2003-01-14 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US7802539B2 (en) | 2000-06-30 | 2010-09-28 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US20030092278A1 (en) | 2001-11-13 | 2003-05-15 | Fink Steven T. | Plasma baffle assembly |
US20040075036A1 (en) | 2002-10-04 | 2004-04-22 | Ceramic Component Technologies, Inc. | Test plate for ceramic surface mount devices and other electronic components |
USD494551S1 (en) | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
WO2004059716A1 (en) | 2002-12-20 | 2004-07-15 | Lam Research Corporation | A system and method for controlling plasma with an adjustable coupling to ground circuit |
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US20080023029A1 (en) | 2003-11-14 | 2008-01-31 | Lam Research Corporation | Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
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US20060162657A1 (en) | 2005-01-27 | 2006-07-27 | Lam Research Corporation | Confinement ring drive |
US20060283551A1 (en) | 2005-06-17 | 2006-12-21 | Sung-Ku Son | Confinement ring assembly of plasma processing apparatus |
US7837826B2 (en) | 2006-07-18 | 2010-11-23 | Lam Research Corporation | Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof |
US20080110567A1 (en) | 2006-11-15 | 2008-05-15 | Miller Matthew L | Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
US8622021B2 (en) | 2007-10-31 | 2014-01-07 | Lam Research Corporation | High lifetime consumable silicon nitride-silicon dioxide plasma processing components |
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US20090188625A1 (en) | 2008-01-28 | 2009-07-30 | Carducci James D | Etching chamber having flow equalizer and lower liner |
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US20110100553A1 (en) | 2009-08-31 | 2011-05-05 | Rajinder Dhindsa | multi-peripheral ring arrangement for performing plasma confinement |
US10720314B2 (en) | 2009-08-31 | 2020-07-21 | Lam Research Corporation | Confinement ring for use in a plasma processing system |
US9779916B2 (en) | 2009-08-31 | 2017-10-03 | Lam Research Corporation | Radio frequency (RF) ground return arrangements |
US8517803B2 (en) | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
US8298046B2 (en) | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
US20110226739A1 (en) | 2010-03-19 | 2011-09-22 | Varian Semiconductor Equipment Associates, Inc. | Process chamber liner with apertures for particle containment |
US8826855B2 (en) * | 2010-06-30 | 2014-09-09 | Lam Research Corporation | C-shaped confinement ring for a plasma processing chamber |
US8485128B2 (en) | 2010-06-30 | 2013-07-16 | Lam Research Corporation | Movable ground ring for a plasma processing chamber |
US20120273130A1 (en) | 2011-04-28 | 2012-11-01 | Lam Research Corporation | Internal Faraday Shield Having Distributed Chevron Patterns and Correlated Positioning Relative to External Inner and Outer TCP Coil |
USD697038S1 (en) | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
USD694791S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD694790S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD709537S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD699200S1 (en) | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
US9508530B2 (en) | 2011-11-21 | 2016-11-29 | Lam Research Corporation | Plasma processing chamber with flexible symmetric RF return strap |
US20140113453A1 (en) | 2012-10-24 | 2014-04-24 | Lam Research Corporation | Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
US20140116338A1 (en) | 2012-10-29 | 2014-05-01 | Advanced Micro-Fabrication Equipment Inc, Shanghai | Coating for performance enhancement of semiconductor apparatus |
US8893702B2 (en) | 2013-02-20 | 2014-11-25 | Lam Research Corporation | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
USD793976S1 (en) | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD766849S1 (en) | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD729730S1 (en) | 2013-06-06 | 2015-05-19 | Jon Simon Gillespie-Brown | Power charging ring |
US20160158910A1 (en) | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US20150364322A1 (en) | 2013-08-07 | 2015-12-17 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US9330927B2 (en) | 2013-08-28 | 2016-05-03 | Lam Research Corporation | System, method and apparatus for generating pressure pulses in small volume confined process reactor |
US9184029B2 (en) | 2013-09-03 | 2015-11-10 | Lam Research Corporation | System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor |
USD713363S1 (en) | 2013-12-31 | 2014-09-16 | Celadon Systems, Inc. | Support for a probe test core |
US20150329955A1 (en) | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
CN106898534A (en) | 2015-12-21 | 2017-06-27 | 中微半导体设备(上海)有限公司 | Plasma confinement ring, plasma processing apparatus and processing method for substrate |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
USD873782S1 (en) | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
US20180061618A1 (en) | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Plasma screen for plasma processing chamber |
US10672629B2 (en) | 2016-09-28 | 2020-06-02 | Samsung Electronics Co., Ltd. | Ring assembly and chuck assembly having the same |
USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD876504S1 (en) | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
USD871609S1 (en) | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
USD895777S1 (en) | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
KR102040281B1 (en) | 2018-04-26 | 2019-11-04 | 주식회사 건테크 | Limited ring for semiconductor plasma etching process using CVD-SiC material |
TWD195951S (en) | 2018-05-29 | 2019-02-11 | 中國探針股份有限公司 | Probe test head |
USD891636S1 (en) | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
USD891382S1 (en) | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD947914S1 (en) * | 2020-11-23 | 2022-04-05 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
Non-Patent Citations (2)
Title |
---|
International Search Report for PCT/US2021/021986, dated Jun. 28, 2021. |
Search Report for Taiwan Design Application No. 110303814, dated Oct. 29, 2021. |
Also Published As
Publication number | Publication date |
---|---|
TWD220838S (en) | 2022-09-01 |
JP1698489S (en) | 2021-11-01 |
USD943539S1 (en) | 2022-02-15 |
JP1686348S (en) | 2021-05-31 |
TWD216905S (en) | 2022-02-01 |
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