USD891636S1 - Ring for a plasma processing apparatus - Google Patents
Ring for a plasma processing apparatus Download PDFInfo
- Publication number
- USD891636S1 USD891636S1 US29/688,724 US201929688724F USD891636S US D891636 S1 USD891636 S1 US D891636S1 US 201929688724 F US201929688724 F US 201929688724F US D891636 S USD891636 S US D891636S
- Authority
- US
- United States
- Prior art keywords
- ring
- processing apparatus
- plasma processing
- view
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The box labelled as 9 in FIG. 8 is shown in broken lines and forms no part of the claimed design.
Claims (1)
- The ornamental design for a ring for a plasma processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-23399F JP1640255S (en) | 2018-10-25 | 2018-10-25 | |
JP2018-023399 | 2018-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD891636S1 true USD891636S1 (en) | 2020-07-28 |
Family
ID=67769555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/688,724 Active USD891636S1 (en) | 2018-10-25 | 2019-04-24 | Ring for a plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD891636S1 (en) |
JP (1) | JP1640255S (en) |
TW (1) | TWD204229S (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD958401S1 (en) * | 2020-05-27 | 2022-07-19 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing device |
USD1005245S1 (en) * | 2021-04-19 | 2023-11-21 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
USD1008986S1 (en) * | 2021-04-26 | 2023-12-26 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing apparatus |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD694790S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD694791S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD697038S1 (en) | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
US8703249B2 (en) * | 2002-04-17 | 2014-04-22 | Lam Research Corporation | Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system |
US9123661B2 (en) * | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US9165812B2 (en) * | 2014-01-31 | 2015-10-20 | Applied Materials, Inc. | Cooled tape frame lift and low contact shadow ring for plasma heat isolation |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD836573S1 (en) * | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
US10170283B2 (en) * | 2014-02-25 | 2019-01-01 | Coorstek Kk | Focus ring for plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
USD871608S1 (en) * | 2017-07-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Gas ring for a plasma processing apparatus |
-
2018
- 2018-10-25 JP JPD2018-23399F patent/JP1640255S/ja active Active
-
2019
- 2019-04-24 US US29/688,724 patent/USD891636S1/en active Active
- 2019-04-24 TW TW108302365F patent/TWD204229S/en unknown
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8703249B2 (en) * | 2002-04-17 | 2014-04-22 | Lam Research Corporation | Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system |
USD694790S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD694791S1 (en) | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD697038S1 (en) | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
US9123661B2 (en) * | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US9165812B2 (en) * | 2014-01-31 | 2015-10-20 | Applied Materials, Inc. | Cooled tape frame lift and low contact shadow ring for plasma heat isolation |
US10170283B2 (en) * | 2014-02-25 | 2019-01-01 | Coorstek Kk | Focus ring for plasma processing apparatus |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD836573S1 (en) * | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD871608S1 (en) * | 2017-07-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Gas ring for a plasma processing apparatus |
USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD986190S1 (en) | 2020-03-19 | 2023-05-16 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD958401S1 (en) * | 2020-05-27 | 2022-07-19 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing device |
USD1005245S1 (en) * | 2021-04-19 | 2023-11-21 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
USD1008986S1 (en) * | 2021-04-26 | 2023-12-26 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1640255S (en) | 2019-09-02 |
TWD204229S (en) | 2020-04-21 |
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Legal Events
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FEPP | Fee payment procedure |
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