USD891636S1 - Ring for a plasma processing apparatus - Google Patents

Ring for a plasma processing apparatus Download PDF

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Publication number
USD891636S1
USD891636S1 US29/688,724 US201929688724F USD891636S US D891636 S1 USD891636 S1 US D891636S1 US 201929688724 F US201929688724 F US 201929688724F US D891636 S USD891636 S US D891636S
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United States
Prior art keywords
ring
processing apparatus
plasma processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/688,724
Inventor
Masakazu Isozaki
Masahito Mori
Kenetsu Yokogawa
Takao Arase
Taku Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARASE, TAKAO, ISOZAKI, MASAKAZU, IWASE, TAKU, MORI, MASAHITO, YOKOGAWA, KENETSU
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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Publication of USD891636S1 publication Critical patent/USD891636S1/en
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Description

FIG. 1 is a front, bottom and right side perspective view of a ring for a plasma processing apparatus according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2; and,
FIG. 9 is an enlarged view of the portion shown in BOX 9 in FIG. 8.
The box labelled as 9 in FIG. 8 is shown in broken lines and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a ring for a plasma processing apparatus, as shown and described.
US29/688,724 2018-10-25 2019-04-24 Ring for a plasma processing apparatus Active USD891636S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2018-23399F JP1640255S (en) 2018-10-25 2018-10-25
JP2018-023399 2018-10-25

Publications (1)

Publication Number Publication Date
USD891636S1 true USD891636S1 (en) 2020-07-28

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ID=67769555

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/688,724 Active USD891636S1 (en) 2018-10-25 2019-04-24 Ring for a plasma processing apparatus

Country Status (3)

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US (1) USD891636S1 (en)
JP (1) JP1640255S (en)
TW (1) TWD204229S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD954986S1 (en) * 2019-10-18 2022-06-14 Hitachi High-Tech Corporation Electrode cover for a plasma processing device
USD958401S1 (en) * 2020-05-27 2022-07-19 Hitachi High-Tech Corporation Ion shield plate for plasma processing device
USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1008986S1 (en) * 2021-04-26 2023-12-26 Hitachi High-Tech Corporation Ion shield plate for plasma processing apparatus

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD694790S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694791S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
US8703249B2 (en) * 2002-04-17 2014-04-22 Lam Research Corporation Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
US9123661B2 (en) * 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9165812B2 (en) * 2014-01-31 2015-10-20 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
US10170283B2 (en) * 2014-02-25 2019-01-01 Coorstek Kk Focus ring for plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703249B2 (en) * 2002-04-17 2014-04-22 Lam Research Corporation Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
USD694790S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694791S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
US9123661B2 (en) * 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9165812B2 (en) * 2014-01-31 2015-10-20 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
US10170283B2 (en) * 2014-02-25 2019-01-01 Coorstek Kk Focus ring for plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954986S1 (en) * 2019-10-18 2022-06-14 Hitachi High-Tech Corporation Electrode cover for a plasma processing device
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD958401S1 (en) * 2020-05-27 2022-07-19 Hitachi High-Tech Corporation Ion shield plate for plasma processing device
USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1008986S1 (en) * 2021-04-26 2023-12-26 Hitachi High-Tech Corporation Ion shield plate for plasma processing apparatus

Also Published As

Publication number Publication date
JP1640255S (en) 2019-09-02
TWD204229S (en) 2020-04-21

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