USD559064S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559064S1
USD559064S1 US29/213,407 US21340704F USD559064S US D559064 S1 USD559064 S1 US D559064S1 US 21340704 F US21340704 F US 21340704F US D559064 S USD559064 S US D559064S
Authority
US
United States
Prior art keywords
polishing pad
view
sectional
cross
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/213,407
Inventor
Takahiro Okamoto
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMOTO, TAKAHIRO, SHIHO, HIROSHI
Priority to US29/295,220 priority Critical patent/USD576855S1/en
Application granted granted Critical
Publication of USD559064S1 publication Critical patent/USD559064S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of the polishing pad;
FIG. 2 is a front elevational view thereof, the left side elevational view, right side elevational view, and rear elevational view each being a mirror image of the front view shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;
FIG. 5 is a cross-sectional view thereof taken along line 55 in FIG. 4;
FIG. 6 is a further enlargement of the cross-sectional view of part 6 of FIG. 5; and,
FIG. 7 is a further enlargement of the cross-sectional view of part 7 of FIG. 6.

Claims (1)

  1. The ornamental design for a polishing pad, as shown and described.
US29/213,407 2004-03-17 2004-09-17 Polishing pad Expired - Lifetime USD559064S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/295,220 USD576855S1 (en) 2004-03-17 2007-09-24 Polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004008161 2004-03-17
JP2004008162 2004-03-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/295,220 Division USD576855S1 (en) 2004-03-17 2007-09-24 Polishing pad

Publications (1)

Publication Number Publication Date
USD559064S1 true USD559064S1 (en) 2008-01-08

Family

ID=38893601

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/213,407 Expired - Lifetime USD559064S1 (en) 2004-03-17 2004-09-17 Polishing pad
US29/295,220 Expired - Lifetime USD576855S1 (en) 2004-03-17 2007-09-24 Polishing pad

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/295,220 Expired - Lifetime USD576855S1 (en) 2004-03-17 2007-09-24 Polishing pad

Country Status (1)

Country Link
US (2) USD559064S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD767840S1 (en) 2014-05-20 2016-09-27 Maruishi Sanyo Co., Ltd Polishing pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US9580916B2 (en) 2014-09-18 2017-02-28 Diamond Tool Supply, Inc. Method for finishing a composite surface and a grounting pan for finishing a composite surface
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
BR112018005933B1 (en) 2015-09-24 2022-04-05 Husqvarna Ab Polishing or sanding pad set, and method of using a polishing or sanding pad set
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
AU201810919S (en) 2017-08-30 2018-04-13 Husqvarna Construction Products North America Polishing or grinding pad assembly with abrasive discs reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD767840S1 (en) 2014-05-20 2016-09-27 Maruishi Sanyo Co., Ltd Polishing pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

Also Published As

Publication number Publication date
USD576855S1 (en) 2008-09-16

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