USD559063S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559063S1
USD559063S1 US29/213,405 US21340504F USD559063S US D559063 S1 USD559063 S1 US D559063S1 US 21340504 F US21340504 F US 21340504F US D559063 S USD559063 S US D559063S
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US
United States
Prior art keywords
polishing pad
view
sectional
cross
taken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/213,405
Inventor
Takahiro Okamoto
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMOTO, TAKAHIRO, SHIHO, HIROSHI
Priority to US29/296,712 priority Critical patent/USD581237S1/en
Application granted granted Critical
Publication of USD559063S1 publication Critical patent/USD559063S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is a top plan view of the polishing pad;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof, the left side elevational view, the right side elevational view, and the rear elevational view being a mirror image of the front view shown;
FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;
FIG. 5 is a greatly enlarged, partial view thereof taken at coordinates 55 in FIG. 1;
FIG. 6 is a cross-sectional view thereof taken along line 66 in FIG. 5;
FIG. 7 is a further enlargement of the cross-sectional view of part 7 shown in FIG. 6;
FIG. 8 is a greatly enlarged, partial view taken at coordinates 85 in FIG. 1;
FIG. 9 is a cross-sectional view taken along line 99 in FIG. 8;
FIG. 10 is a further enlargement of the cross-sectional view of part 10 of FIG. 9;
FIG. 11 is a further enlargement of the cross-sectional view of part 11 in FIG. 10; and,
FIG. 12 is a further enlargement of the cross-sectional view of part 12 in FIG. 11.

Claims (1)

  1. The ornamental design for a polishing pad, as shown and described.
US29/213,405 2004-03-17 2004-09-17 Polishing pad Expired - Lifetime USD559063S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/296,712 USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004008159 2004-03-17
JP2004008160 2004-03-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/296,712 Division USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

Publications (1)

Publication Number Publication Date
USD559063S1 true USD559063S1 (en) 2008-01-08

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Family Applications (2)

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US29/213,405 Expired - Lifetime USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad
US29/296,712 Expired - Lifetime USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/296,712 Expired - Lifetime USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

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US (2) USD559063S1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
USD738177S1 (en) * 2012-10-31 2015-09-08 Kwh Mirka Ltd Backing pad
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
USD738177S1 (en) * 2012-10-31 2015-09-08 Kwh Mirka Ltd Backing pad
USD740637S1 (en) * 2012-10-31 2015-10-13 Kwh Mirka Ltd Backing pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
USD873108S1 (en) * 2014-06-06 2020-01-21 Husqvarna Ab Polishing pad
USD837015S1 (en) * 2014-06-06 2019-01-01 Husqvarna Construction Products North America, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US11084140B2 (en) 2015-09-24 2021-08-10 Husqvarna Ab Method of using polishing or grinding pad assembly
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
USD933440S1 (en) * 2016-09-23 2021-10-19 Husqvarna Ab Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

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Publication number Publication date
USD581237S1 (en) 2008-11-25

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