USD600989S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD600989S1
USD600989S1 US29/295,290 US29529007F USD600989S US D600989 S1 USD600989 S1 US D600989S1 US 29529007 F US29529007 F US 29529007F US D600989 S USD600989 S US D600989S
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US
United States
Prior art keywords
polishing pad
view
partial
enlarged sectional
enlarged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/295,290
Inventor
Hiroyuki Tano
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to US29/295,290 priority Critical patent/USD600989S1/en
Application granted granted Critical
Publication of USD600989S1 publication Critical patent/USD600989S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partial, enlarged view of portion 44 in FIG. 1;
FIG. 5 is a partial, enlarged sectional view taken along line 55 in FIG. 4
FIG. 6 is a partial, enlarged sectional view taken along line 66 in FIG. 4;
FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,
FIG. 8 is a partial, enlarged view of portion 88 in FIG. 1.

Claims (1)

  1. The ornamental design for a polishing pad, as shown and described.
US29/295,290 2004-10-26 2007-09-25 Polishing pad Expired - Lifetime USD600989S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/295,290 USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2004032516 2004-10-26
JP2004032513 2004-10-26
JP2004032512 2004-10-26
JP2004032515 2004-10-26
JP2004032514 2004-10-26
US29/228,555 USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,290 USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/228,555 Division USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad

Publications (1)

Publication Number Publication Date
USD600989S1 true USD600989S1 (en) 2009-09-29

Family

ID=38893603

Family Applications (5)

Application Number Title Priority Date Filing Date
US29/228,555 Expired - Lifetime USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,292 Expired - Lifetime USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,290 Expired - Lifetime USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/228,555 Expired - Lifetime USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,292 Expired - Lifetime USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad

Country Status (1)

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US (5) USD559066S1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD958626S1 (en) 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
USD852601S1 (en) * 2017-04-24 2019-07-02 Ehwa Diamond Ind. Co., Ltd. Polishing pad
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
USD837015S1 (en) * 2014-06-06 2019-01-01 Husqvarna Construction Products North America, Inc. Polishing pad
USD873108S1 (en) * 2014-06-06 2020-01-21 Husqvarna Ab Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US11084140B2 (en) 2015-09-24 2021-08-10 Husqvarna Ab Method of using polishing or grinding pad assembly
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
USD933440S1 (en) 2016-09-23 2021-10-19 Husqvarna Ab Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD958626S1 (en) 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
USD592029S1 (en) 2009-05-12
USD592030S1 (en) 2009-05-12
USD584591S1 (en) 2009-01-13
USD559066S1 (en) 2008-01-08

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