USD731448S1 - Polishing pad for substrate polishing apparatus - Google Patents

Polishing pad for substrate polishing apparatus Download PDF

Info

Publication number
USD731448S1
USD731448S1 US29/489,180 US201429489180F USD731448S US D731448 S1 USD731448 S1 US D731448S1 US 201429489180 F US201429489180 F US 201429489180F US D731448 S USD731448 S US D731448S
Authority
US
United States
Prior art keywords
polishing
substrate
view
polishing pad
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/489,180
Inventor
Masaki Kinoshita
Toshifumi Kimba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMBA, TOSHIFUMI, KINOSHITA, MASAKI
Application granted granted Critical
Publication of USD731448S1 publication Critical patent/USD731448S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top plan view of a first embodiment of a polishing pad for substrate polishing apparatus, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front view thereof, the rear view being identical;
FIG. 4 is a right side view thereof, the left side view being identical;
FIG. 5 is an enlarged, top plan view thereof, taken along lines 5-5 of FIG. 1;
FIG. 6 is an enlarged, cross-sectional view thereof, taken along lines 6-6 of FIG. 5;
FIG. 7 is a top plan view of a second embodiment of a polishing pad for substrate polishing apparatus, showing our new design;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a front view thereof, the rear view being identical;
FIG. 10 is a right side view thereof, the left view being identical;
FIG. 11 is an enlarged, partial top plan view thereof, taken along lines 11-11 of FIG. 7; and,
FIG. 12 is an enlarged, cross-sectional view thereof, taken along lines 12-12 of FIG. 11.
The dashed-dot-dashed lines represent the boundary lines of the claimed design. The even dashed broken lines depict environment subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad for substrate polishing apparatus, as shown and described.
US29/489,180 2013-10-29 2014-04-28 Polishing pad for substrate polishing apparatus Active USD731448S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-025148 2013-10-29
JP2013025149 2013-10-29
JP2013-025149 2013-10-29
JP2013025148 2013-10-29

Publications (1)

Publication Number Publication Date
USD731448S1 true USD731448S1 (en) 2015-06-09

Family

ID=53268335

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/489,180 Active USD731448S1 (en) 2013-10-29 2014-04-28 Polishing pad for substrate polishing apparatus

Country Status (1)

Country Link
US (1) USD731448S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284659A (en) * 1990-03-30 1994-02-08 Cherukuri Subraman R Encapsulated flavor with bioadhesive character in pressed mints and confections
US5431918A (en) * 1992-10-30 1995-07-11 Soremartec S.A. Breath mint configuration
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US20050095963A1 (en) * 2003-10-29 2005-05-05 Texas Instruments Incorporated Chemical mechanical polishing system
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7109068B2 (en) * 2004-08-31 2006-09-19 Micron Technology, Inc. Through-substrate interconnect fabrication methods
USD560810S1 (en) * 2005-05-19 2008-01-29 Cosmopro, Inc. Massage stone
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
US7799618B2 (en) * 2005-03-30 2010-09-21 Seiko Epson Corporation Method of manufacturing semiconductor device, semiconductor device, display device, and electronic instrument
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US20120164917A1 (en) 2010-12-27 2012-06-28 Itsuki Kobata Polishing apparatus and polishing method
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD702655S1 (en) * 2012-10-15 2014-04-15 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284659A (en) * 1990-03-30 1994-02-08 Cherukuri Subraman R Encapsulated flavor with bioadhesive character in pressed mints and confections
US5431918A (en) * 1992-10-30 1995-07-11 Soremartec S.A. Breath mint configuration
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US20050095963A1 (en) * 2003-10-29 2005-05-05 Texas Instruments Incorporated Chemical mechanical polishing system
US7109068B2 (en) * 2004-08-31 2006-09-19 Micron Technology, Inc. Through-substrate interconnect fabrication methods
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7799618B2 (en) * 2005-03-30 2010-09-21 Seiko Epson Corporation Method of manufacturing semiconductor device, semiconductor device, display device, and electronic instrument
USD560810S1 (en) * 2005-05-19 2008-01-29 Cosmopro, Inc. Massage stone
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US20120164917A1 (en) 2010-12-27 2012-06-28 Itsuki Kobata Polishing apparatus and polishing method
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD702655S1 (en) * 2012-10-15 2014-04-15 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873108S1 (en) * 2014-06-06 2020-01-21 Husqvarna Ab Polishing pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
USD837015S1 (en) * 2014-06-06 2019-01-01 Husqvarna Construction Products North America, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
US11084140B2 (en) 2015-09-24 2021-08-10 Husqvarna Ab Method of using polishing or grinding pad assembly
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
USD933440S1 (en) * 2016-09-23 2021-10-19 Husqvarna Ab Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement

Similar Documents

Publication Publication Date Title
USD731448S1 (en) Polishing pad for substrate polishing apparatus
USD960294S1 (en) Showerhead nozzle pad
USD813180S1 (en) Elastic membrane for semiconductor wafer polishing apparatus
USD845446S1 (en) Vent
USD812588S1 (en) Ear-cover backing portion of headphone device
USD825551S1 (en) Electronic device
USD766448S1 (en) Dressing
USD753223S1 (en) Electronic handwriting pad
USD725655S1 (en) Electronic device
USD758761S1 (en) Mat
USD733691S1 (en) Mount for electronic devices
USD750344S1 (en) Swimsuit top
USD742860S1 (en) Earphone
USD733376S1 (en) Attachment for a cleaning apparatus
USD778262S1 (en) Digital mixer
USD790489S1 (en) Vacuum contact pad
USD775530S1 (en) Flask
USD782663S1 (en) Diaper
USD728904S1 (en) Sandal
USD751655S1 (en) Exercise tire
USD727762S1 (en) Chemical detection unit
USD782139S1 (en) Cleaning pad
USD709263S1 (en) Bucket
USD859763S1 (en) Polisher
USD710071S1 (en) Jersey-styled apron