TWD202895S - 光罩盒組裝件 - Google Patents

光罩盒組裝件 Download PDF

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Publication number
TWD202895S
TWD202895S TW108301726F TW108301726F TWD202895S TW D202895 S TWD202895 S TW D202895S TW 108301726 F TW108301726 F TW 108301726F TW 108301726 F TW108301726 F TW 108301726F TW D202895 S TWD202895 S TW D202895S
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TW
Taiwan
Prior art keywords
design
reference picture
mask box
size mask
usage status
Prior art date
Application number
TW108301726F
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English (en)
Inventor
邱銘乾
潘詠晉
羅孝嘉
Original Assignee
家登精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 家登精密工業股份有限公司 filed Critical 家登精密工業股份有限公司
Priority to TW108301726F priority Critical patent/TWD202895S/zh
Priority to US29/696,000 priority patent/USD962182S1/en
Publication of TWD202895S publication Critical patent/TWD202895S/zh

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Abstract

【物品用途】;一種用於將大尺寸光罩盒之單一上蓋或下蓋組裝為獨立物品的組裝件。所述大尺寸光罩盒可以但不限於承載薄膜電晶體液晶顯示器(TFT-LCD)製程上所使用的光罩。;【設計說明】;本設計之螺絲孔標示為虛線,而虛線的部份為本案不主張設計的部份。使用狀態參考圖一及使用狀態參考圖二為本設計實際應用於大尺寸光罩盒上的情況,其中使用狀態參考圖二的型態係本設計已被嵌合於大尺寸光罩盒之中。

Description

光罩盒組裝件
一種用於將大尺寸光罩盒之單一上蓋或下蓋組裝為獨立物品的組裝件。所述大尺寸光罩盒可以但不限於承載薄膜電晶體液晶顯示器(TFT-LCD)製程上所使用的光罩。
本設計之螺絲孔標示為虛線,而虛線的部份為本案不主張設計的部份。使用狀態參考圖一及使用狀態參考圖二為本設計實際應用於大尺寸光罩盒上的情況,其中使用狀態參考圖二的型態係本設計已被嵌合於大尺寸光罩盒之中。
TW108301726F 2019-03-27 2019-03-27 光罩盒組裝件 TWD202895S (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW108301726F TWD202895S (zh) 2019-03-27 2019-03-27 光罩盒組裝件
US29/696,000 USD962182S1 (en) 2019-03-27 2019-06-24 Reticle pod connecting frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108301726F TWD202895S (zh) 2019-03-27 2019-03-27 光罩盒組裝件

Publications (1)

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TWD202895S true TWD202895S (zh) 2020-02-21

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ID=82943790

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TW108301726F TWD202895S (zh) 2019-03-27 2019-03-27 光罩盒組裝件

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US (1) USD962182S1 (zh)
TW (1) TWD202895S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211779S (zh) 2020-09-22 2021-05-21 家登精密工業股份有限公司 光罩盒連接件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM409239U (en) 2011-02-09 2011-08-11 Chung King Entpr Co Ltd Shock absorption structure for optical mask box

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JP2000323216A (ja) * 1999-05-07 2000-11-24 Kyoshin Kogyo Co Ltd 接続用端子及びテーピング接続用端子
DE10212495B4 (de) * 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
CN204104208U (zh) * 2011-12-02 2015-01-14 株式会社村田制作所 高频信号线路及电子设备
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
CN205752476U (zh) * 2014-06-16 2016-11-30 株式会社村田制作所 传输线路构件
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
DE102016224653B4 (de) * 2016-12-12 2022-07-21 Vitesco Technologies Germany Gmbh Leiterplattenverbund und Verfahren zu dessen Herstellung
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD886073S1 (en) * 2018-01-29 2020-06-02 Gigalane Co., Ltd. Flexible printed circuit board
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1641098S (zh) * 2018-06-26 2019-09-09
JP1638282S (zh) * 2018-09-20 2019-08-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM409239U (en) 2011-02-09 2011-08-11 Chung King Entpr Co Ltd Shock absorption structure for optical mask box

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211779S (zh) 2020-09-22 2021-05-21 家登精密工業股份有限公司 光罩盒連接件

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USD962182S1 (en) 2022-08-30

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