TWI585517B - Dustproof film module containers for microfilm for incorporating dustproof film modules - Google Patents
Dustproof film module containers for microfilm for incorporating dustproof film modules Download PDFInfo
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- TWI585517B TWI585517B TW104141613A TW104141613A TWI585517B TW I585517 B TWI585517 B TW I585517B TW 104141613 A TW104141613 A TW 104141613A TW 104141613 A TW104141613 A TW 104141613A TW I585517 B TWI585517 B TW I585517B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Packaging Frangible Articles (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明是有關於收納在大型積體電路(large scale
integration,LSI)、超LSI等的半導體裝置、液晶顯示板等的製造時作為微影用遮罩的防塵器使用的防塵薄膜組件的微影用防塵薄膜組件容器。
一般,在LSI、超LSI等的半導體製造或者液晶顯示板的製造中,要對半導體晶圓或者液晶用原板進行光照射來進行圖案的製作,在該場合,如果灰塵在微影用遮罩(以下,稱遮罩)以及中間遮罩(以下,統稱曝光原版)附著,該灰塵會吸收光,使光彎曲,由此會使轉印的圖案會形變,尖銳處會不清楚,基底發黑,尺寸、品質、外觀等受損。
因此,這些半導體製造或者液晶顯示板的製造作業通常在無塵室中進行,但是即使如此,也不能總是保持曝光原版的清潔,由此,一般採用在曝光原版表面上貼附作為防塵器的防塵薄膜組件後再進行曝光的方法。然後,在該曝光的場合,灰塵等的異物就不在曝光原版的表面上直接附著,而是在防塵薄膜組件上附著,由此在微影時,只要是焦點對準曝光原版的圖案,防塵薄
膜組件上的異物就與轉印沒有關係了。
該防塵薄膜組件的基本構成如圖1或者圖3所示的那樣,在防塵薄膜組件框架3上將透明的防塵膜2繃緊貼附的同時,在下端面製成將防塵薄膜組件貼附於遮罩或者曝光原版上的黏著劑層4。
再者,防塵膜2的材質為使曝光中使用的光,例如水銀燈那樣的g線(436nm)、i線(365nm)、KrF準分子雷射(248nm),ArF準分子雷射(193nm)等良好的透過的硝酸纖維素、醋酸纖維素、氟系聚合物等,在防塵薄膜組件框架3的上端面塗布良溶媒,貼附防塵膜2,風乾接著,或者用丙烯酸系樹脂、環氧樹脂、氟樹脂等的接著劑進行接著。在防塵薄膜組件框架3的下端面,為了在曝光原版上進行貼附,設置由聚丁烯樹脂、聚醋酸乙烯酯樹脂、丙烯酸系樹脂、矽酮樹脂等構成的黏著劑層4,進一步,根據需要,可以貼附以保護黏著劑層4為目的的分離片。
該防塵薄膜組件是為了防止遮罩上有異物附著之物,但是也優選在防塵薄膜組件自身沒有異物附著,在防塵薄膜組件的保管或搬送的場合,在防塵薄膜組件容器1將防塵薄膜組件加以收納是通常的做法。圖3表示了防塵薄膜組件被在樹脂製防塵薄膜組件容器1的載置部6上載置的狀態。
但是,近年來,LSI的設計細微至四分之一微米以下,由此,曝光光源的短波長化也在推進中。曝光光源從至今為止為主流的水銀燈那樣的g線(436nm)、i線(365nm),向著KrF準
分子雷射(248nm)、ArF準分子雷射(193nm)等變動。然後,由於曝光光的波長的變短,遮罩的形狀變化帶來的對微影像的形變的影響就成了問題,對遮罩要求的平坦性越來越嚴格了。
作為影響所述遮罩的平坦性原因之一,可以列舉貼附的防塵薄膜組件的平坦度,由此在專利文獻1中,記載了在將防塵薄膜組件貼附於遮罩的場合,為了減少遮罩的變形,防塵薄膜組件框架的黏著劑層的平坦度被規定為15μm以下。
但是,即使提高防塵薄膜組件框架的黏著劑層的平坦度,在短波長曝光時,也會有微影像出現變形的例子。
【現有技術文獻】
【專利文獻】
【專利文獻1】日本專利特開2012-108277號
鑒於上述情況,本發明的目的為提供一種可以抑制遮罩或曝光原版等的變形的微影用防塵薄膜組件容器。
本發明的發明人在進行了深入研究後,認為用射出成型製作的樹脂製防塵薄膜組件容器的防塵薄膜組件載置部的平坦度可能為上述提到的造成變形的原因,對以往的樹脂製防塵薄膜組件容器的防塵薄膜組件載置部的平坦度進行了檢査,得知如圖6所示的那樣,成為最大為約80μm的凹凸狀。然後,發現在將防塵薄膜組件收納在防塵薄膜組件容器的場合,該凹凸形狀與防塵
薄膜組件黏著劑層的表面接觸時,黏著劑層的平坦度變差,由此得到了本發明。
即,本發明為一種用來將由防塵膜、防塵薄膜組件框架以及在該防塵薄膜組件框架塗布的接著劑層構成的防塵薄膜組件收納的微影用防塵薄膜組件容器,其特徵在於:該防塵薄膜組件載置部設置平坦度為10μm以下的平板,並優選設置石英製平板。
根據本發明,將平坦度良好的石英製平板設置於樹脂製的防塵薄膜組件載置部,可以對防塵薄膜組件的黏著劑層面的平坦度的變差進行抑制,由此防止了遮罩等的變形,從而可以進行圖案的高精度的細微加工。
1‧‧‧防塵薄膜組件容器
2‧‧‧防塵膜
3‧‧‧防塵薄膜組件框架
4‧‧‧黏著劑層
5‧‧‧分離片
6‧‧‧防塵薄膜組件載置部
7‧‧‧石英製平板
圖1為載置有防塵薄膜組件的本發明的防塵薄膜組件容器(盤)的概要圖。
圖2為本發明的防塵薄膜組件容器(盤)的平面圖、側面圖以及A-A截面圖。
圖3為載置有防塵薄膜組件的以往的防塵薄膜組件容器(盤)的概要圖。
圖4為以往的防塵薄膜組件容器(盤)的平面圖、側面圖以及A-A截面圖。
圖5為表示本發明的防塵薄膜組件容器(盤)的防塵薄膜組件載置部的凹凸狀況的圖。
圖6為表示以往的防塵薄膜組件容器(盤)的防塵薄膜組件載置部的凹凸狀況的圖。
以下,根據附圖對按照本發明的實施例和比較例進行說明,但是本發明並不限於這些實施例。本發明的特徵為使用平坦度為10μm以下的平板,更好為使用石英製平板7,除了該平板,防塵薄膜組件容器的構成與以往之物相同。
再者,在本發明的實施例中,優選使用了石英製平板7。
石英製的平板硬且耐久性良好,而且只要進行打磨,就可容易地將其表面的平坦度作成10μm以下,同時可以長期保持表面的平坦狀態,所以較佳。
【實施例】
<實施例1>
在實施例1中,如圖2所示的那樣,用射出成型製作外形尺寸200mm見方的聚碳酸酯製防塵薄膜組件容器1。再者,在其中央設置150mm×116mm、厚度6.35mm的石英製平板7,作為防塵薄膜組件載置部6。該石英製平板7的平坦度為7μm。
然後,如圖1所示的那樣,在該石英製平板7上載置貼有分離片5的黏著劑層4,將防塵薄膜組件進行一定期間的保管。其後,從該防塵薄膜組件容器1中將防塵薄膜組件取出,對黏著
劑層4的表面的平坦度的變化進行測定,得知為10μm。再者,將該防塵薄膜組件通過黏著劑層貼於遮罩,幾乎沒有看到遮罩的變形。
<實施例2>
在實施例2中也使用與實施例1同樣的聚碳酸酯製防塵薄膜組件容器,在其中央設置同尺寸且平坦度10μm的石英製平板7,作為防塵薄膜組件載置部6。在該石英製平板7上將貼有分離片5的黏著劑層4載置,將防塵薄膜組件進行一定期間的保管。其後,從該防塵薄膜組件容器1將防塵薄膜組件取出,對黏著劑層4的表面的平坦度的變化進行測定,得知為12μm。再者,將該防塵薄膜組件通過黏著劑層貼附於遮罩,幾乎沒有看到遮罩的變形。
【比較例】
<比較例1>
在比較例1中,如圖4所示的那樣,用射出成型製作外形尺寸為200mm見方的聚碳酸酯製防塵薄膜組件容器1。再者,對其中央的防塵薄膜組件載置部6的凹凸狀進行測定,如圖6所示的那樣,最大為約80μm的凹凸狀,平坦度不好。
然後,如圖3所示的那樣,在該防塵薄膜組件容器1的防塵薄膜組件載置部6上載置貼附有分離片5的黏著劑層4,將防塵薄膜組件進行一定期間的保管。其後,從該防塵薄膜組件容器1將防塵薄膜組件取出,對黏著劑層4的表面的平坦度的變化進行測定,得知為30μm。再者,從該防塵薄膜組件容器1中將防塵薄
膜組件取出,將其貼附於遮罩,可以觀察到遮罩的變形。
1‧‧‧防塵薄膜組件容器
2‧‧‧防塵膜
3‧‧‧防塵薄膜組件框架
4‧‧‧黏著劑層
5‧‧‧分離片
6‧‧‧防塵薄膜組件載置部
7‧‧‧石英製平板
Claims (2)
- 一種用於收納防塵薄膜組件的微影用防塵薄膜組件容器,其收納由防塵薄膜組件框架、所述防塵薄膜組件框架的一個面上繃緊設置的防塵膜、在與所述防塵薄膜組件框架的所述防塵膜繃緊設置面對向的另一個面上塗布的接著劑層構成的防塵薄膜組件,所述微影用防塵薄膜組件容器的特徵在於:具有載置所述防塵薄膜組件的防塵薄膜組件載置部,在所述防塵薄膜組件載置部設置平坦度為10μm以下的平板,並以所述平板載置所述防塵薄膜組件。
- 如申請專利範圍第1項所述的用於收納防塵薄膜組件的微影用防塵薄膜組件容器,其中所述平板為石英製平板。
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JP2014255838A JP6308676B2 (ja) | 2014-12-18 | 2014-12-18 | リソグラフィ用ペリクル容器。 |
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EP (1) | EP3043207B1 (zh) |
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KR102172217B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | 펠리클 수납용기 및 이를 이용한 파티클 제거 방법 |
KR102172221B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | Dlc 코팅층을 구비한 펠리클 수납용기 |
KR102172218B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | 펠리클 수납용기 |
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- 2015-12-10 KR KR1020150175721A patent/KR102619269B1/ko active IP Right Grant
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- 2015-12-15 US US14/969,226 patent/US10634991B2/en not_active Expired - Fee Related
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JP2016114905A (ja) | 2016-06-23 |
EP3043207B1 (en) | 2017-02-15 |
TW201632987A (zh) | 2016-09-16 |
KR102619269B1 (ko) | 2023-12-28 |
EP3043207A1 (en) | 2016-07-13 |
US10634991B2 (en) | 2020-04-28 |
JP6308676B2 (ja) | 2018-04-11 |
US20160178998A1 (en) | 2016-06-23 |
KR20160074402A (ko) | 2016-06-28 |
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