TWD222514S - 基板處理系統的主要框架 - Google Patents

基板處理系統的主要框架 Download PDF

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Publication number
TWD222514S
TWD222514S TW111300001F TW111300001F TWD222514S TW D222514 S TWD222514 S TW D222514S TW 111300001 F TW111300001 F TW 111300001F TW 111300001 F TW111300001 F TW 111300001F TW D222514 S TWD222514 S TW D222514S
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TW
Taiwan
Prior art keywords
processing system
substrate processing
mainframe
design
dotted line
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Application number
TW111300001F
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English (en)
Inventor
麥可R 萊斯
麥可Ｃ 庫加爾
崔維斯 莫瑞
亞當Ｊ 懷爾特
歐佛 艾莫
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD222514S publication Critical patent/TWD222514S/zh

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Abstract

【物品用途】;本設計請求具有視覺效果之基板處理系統的主要框架。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。

Description

基板處理系統的主要框架
本設計請求具有視覺效果之基板處理系統的主要框架。
圖式所揭露之虛線部分，為本案不主張設計之部分。
TW111300001F 2020-11-17 2021-05-13 基板處理系統的主要框架 TWD222514S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/758,664 2020-11-17
US29/758,664 USD973116S1 (en) 2020-11-17 2020-11-17 Mainframe of substrate processing system

Publications (1)

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TWD222514S true TWD222514S (zh) 2022-12-11

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TW111300001F TWD222514S (zh) 2020-11-17 2021-05-13 基板處理系統的主要框架
TW110302489F TWD218927S (zh) 2020-11-17 2021-05-13 基板處理系統的主要框架

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TW110302489F TWD218927S (zh) 2020-11-17 2021-05-13 基板處理系統的主要框架

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US (2) USD973116S1 (zh)
JP (2) JP1707408S (zh)
TW (2) TWD222514S (zh)

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* Cited by examiner, † Cited by third party
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USD973737S1 (en) * 2020-11-17 2022-12-27 Applied Materials, Inc. Mainframe of substrate processing system
USD973116S1 (en) * 2020-11-17 2022-12-20 Applied Materials, Inc. Mainframe of substrate processing system
USD1029066S1 (en) * 2022-03-11 2024-05-28 Applied Materials, Inc. Mainframe of dual-robot substrate processing system

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Also Published As

Publication number Publication date
JP1707409S (ja) 2022-02-14
USD992611S1 (en) 2023-07-18
JP1707408S (ja) 2022-02-14
TWD218927S (zh) 2022-05-21
USD973116S1 (en) 2022-12-20

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