TWD210892S - 用於基板處理腔室的沉積環 - Google Patents

用於基板處理腔室的沉積環 Download PDF

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Publication number
TWD210892S
TWD210892S TW108304729F TW108304729F TWD210892S TW D210892 S TWD210892 S TW D210892S TW 108304729 F TW108304729 F TW 108304729F TW 108304729 F TW108304729 F TW 108304729F TW D210892 S TWD210892 S TW D210892S
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Taiwan
Prior art keywords
processing chamber
substrate processing
deposition ring
design
cross
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TW108304729F
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English (en)
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曼裘那薩Ｐ 高帕
亞拉文德 卡曼司
振雄 蔡
曼裘納斯 Ｈ 范卡塔斯瓦瑪帕
史蒂芬Ｖ 珊索尼
傳偉 柯
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美商應用材料股份有限公司
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Publication of TWD210892S publication Critical patent/TWD210892S/zh

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Abstract

【物品用途】;本設計請求具有視覺效果之用於基板處理腔室的沉積環。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;8-8剖面視圖為俯視圖中依據8-8之截線所取之剖面圖。

Description

用於基板處理腔室的沉積環
本設計請求具有視覺效果之用於基板處理腔室的沉積環。
圖式所揭露之虛線部分，為本案不主張設計之部分。
8-8剖面視圖為俯視圖中依據8-8之截線所取之剖面圖。
TW108304729F 2019-02-08 2019-08-08 用於基板處理腔室的沉積環 TWD210892S (zh)

Applications Claiming Priority (2)

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US29/679,746 2019-02-08
US29/679,746 USD933725S1 (en) 2019-02-08 2019-02-08 Deposition ring for a substrate processing chamber

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TWD210892S true TWD210892S (zh) 2021-04-11

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TW108304729F TWD210892S (zh) 2019-02-08 2019-08-08 用於基板處理腔室的沉積環
TW108304729D01F TWD210893S (zh) 2019-02-08 2019-08-08 用於基板處理腔室的沉積環

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TWD232850S (zh) 2022-07-14 2024-08-11 美商應用材料股份有限公司 (美國) 用於基板處理腔室的淨化環
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Publication number Priority date Publication date Assignee Title
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
TWD232851S (zh) 2022-07-14 2024-08-11 美商應用材料股份有限公司 (美國) 用於基板處理腔室的淨化環
TWD232850S (zh) 2022-07-14 2024-08-11 美商應用材料股份有限公司 (美國) 用於基板處理腔室的淨化環
TWD235150S (zh) 2022-07-14 2024-12-01 美商應用材料股份有限公司 (美國) 用於基板處理腔室的淨化環
TWD240711S (zh) 2022-07-14 2025-10-01 美商應用材料股份有限公司 (美國) 用於基板處理腔室的淨化環

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