TWD235071S - 頂板 - Google Patents
頂板 Download PDFInfo
- Publication number
- TWD235071S TWD235071S TW112302754F TW112302754F TWD235071S TW D235071 S TWD235071 S TW D235071S TW 112302754 F TW112302754 F TW 112302754F TW 112302754 F TW112302754 F TW 112302754F TW D235071 S TWD235071 S TW D235071S
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- Taiwan
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Links
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 abstract description 2
Abstract
【物品用途】;本設計物品是一種應用於半導體裝置(熱CVD(化學氣相沉積)裝置)中的圓柱狀腔室的頂板。本設計物品的開口部上接附著氣環(gas ring)。;【設計說明】;後視圖與前視圖相同，故省略後視圖；且右側視圖與左側視圖相同，故省略右側視圖。
Description
本設計物品是一種應用於半導體裝置(熱CVD(化學氣相沉積)裝置)中的圓柱狀腔室的頂板。本設計物品的開口部上接附著氣環(gas ring)。
後視圖與前視圖相同，故省略後視圖；且右側視圖與左側視圖相同，故省略右側視圖。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-026580 | 2020-12-10 | ||
| JPD2020-26580F JP1692954S (zh) | 2020-12-10 | 2020-12-10 | |
| JPD2020-26581F JP1692955S (zh) | 2020-12-10 | 2020-12-10 | |
| JPD2021-11039F JP1702367S (zh) | 2021-05-25 | 2021-05-25 | |
| JP2021-011039 | 2021-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD235071S true TWD235071S (zh) | 2024-12-01 |
Family
ID=90055128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112302754F TWD235071S (zh) | 2020-12-10 | 2021-06-09 | 頂板 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | USD1016761S1 (zh) |
| TW (1) | TWD235071S (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1071886S1 (en) * | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
| USD1096675S1 (en) * | 2022-06-03 | 2025-10-07 | Ap Systems Inc. | Rotor for semiconductor manufacturing device |
| JP1741172S (ja) * | 2022-10-20 | 2023-04-06 | サセプタカバー | |
| JP1741176S (ja) * | 2022-10-20 | 2023-04-06 | サセプタ用カバーベース | |
| JP1745873S (ja) * | 2022-10-20 | 2023-06-08 | サセプタ | |
| JP1741174S (ja) * | 2022-10-20 | 2023-04-06 | サセプタ | |
| JP1746408S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1746407S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1746405S (ja) * | 2023-01-11 | 2023-06-15 | サセプタカバー | |
| JP1746403S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1746406S (ja) * | 2023-01-11 | 2023-06-15 | サセプタユニット | |
| USD1083043S1 (en) * | 2023-03-28 | 2025-07-08 | Mitsubishi Cable Industries, Ltd. | Composite seal member for semiconductor production apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD227251S (zh) | 2022-01-20 | 2023-09-01 | 美商應用材料股份有限公司 | 基板處理腔室用的基板支撐件 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI97730C (fi) * | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Laitteisto ohutkalvojen valmistamiseksi |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US6238513B1 (en) * | 1999-12-28 | 2001-05-29 | International Business Machines Corporation | Wafer lift assembly |
| USD525127S1 (en) * | 2004-03-01 | 2006-07-18 | Kraft Foods Holdings, Inc. | Susceptor ring |
| JP2009270143A (ja) * | 2008-05-02 | 2009-11-19 | Nuflare Technology Inc | サセプタ、半導体製造装置及び半導体製造方法 |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| WO2012142408A2 (en) * | 2011-04-14 | 2012-10-18 | Veeco Instruments Inc. | Substrate holders and methods of substrate mounting |
| USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
| USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
| JP6424726B2 (ja) * | 2015-04-27 | 2018-11-21 | 株式会社Sumco | サセプタ及びエピタキシャル成長装置 |
| JP1584241S (zh) * | 2017-01-31 | 2017-08-21 | ||
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| JP1646504S (zh) * | 2018-12-06 | 2019-11-25 | ||
| JP1646505S (zh) * | 2018-12-07 | 2019-11-25 | ||
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD944946S1 (en) * | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
| TWD208042S (zh) | 2019-08-20 | 2020-11-01 | 南韓商吉佳藍科技股份有限公司 | 等離子體處理裝置用容器 |
| USD930782S1 (en) * | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
| USD949319S1 (en) * | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
| KR102406942B1 (ko) * | 2019-09-16 | 2022-06-10 | 에이피시스템 주식회사 | 엣지 링 및 이를 포함하는 열처리 장치 |
| USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
| USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
-
2021
- 2021-06-09 TW TW112302754F patent/TWD235071S/zh unknown
- 2021-06-10 US US29/794,124 patent/USD1016761S1/en active Active
-
2023
- 2023-02-15 US US29/884,700 patent/USD1052546S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD227251S (zh) | 2022-01-20 | 2023-09-01 | 美商應用材料股份有限公司 | 基板處理腔室用的基板支撐件 |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1052546S1 (en) | 2024-11-26 |
| USD1016761S1 (en) | 2024-03-05 |
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