TWD202102S - 用於物理氣相沉積(pvd)腔室中的準直器 - Google Patents

用於物理氣相沉積(pvd)腔室中的準直器 Download PDF

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Publication number
TWD202102S
TWD202102S TW107305411D01F TW107305411D01F TWD202102S TW D202102 S TWD202102 S TW D202102S TW 107305411D01 F TW107305411D01 F TW 107305411D01F TW 107305411D01 F TW107305411D01 F TW 107305411D01F TW D202102 S TWD202102 S TW D202102S
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Taiwan
Prior art keywords
pvd
collimator
chamber
vapor deposition
physical vapor
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TW107305411D01F
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English (en)
Inventor
馬丁李 萊克
仲蘭蘭
張富宏
征 王
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美商應用材料股份有限公司
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Publication of TWD202102S publication Critical patent/TWD202102S/zh

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Abstract

【物品用途】;本設計所請求係用於物理氣相沉積(PVD)腔室中的準直器。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。

Description

用於物理氣相沉積(PVD)腔室中的準直器
本設計所請求係用於物理氣相沉積(PVD)腔室中的準直器。
圖式所揭露之虛線部分，為本案不主張設計之部分。
TW107305411D01F 2018-03-16 2018-09-13 用於物理氣相沉積(pvd)腔室中的準直器 TWD202102S (zh)

Applications Claiming Priority (2)

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US29/640,787 USD858468S1 (en) 2018-03-16 2018-03-16 Collimator for a physical vapor deposition chamber
US29/640,787 2018-03-16

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TWD202102S true TWD202102S (zh) 2020-01-11

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TW107305411D01F TWD202102S (zh) 2018-03-16 2018-09-13 用於物理氣相沉積(pvd)腔室中的準直器
TW107305411F TWD200242S (zh) 2018-03-16 2018-09-13 用於物理氣相沉積(pvd)腔室中的準直器

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1025935S1 (en) * 2022-11-03 2024-05-07 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1038901S1 (en) * 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
TWD237730S (zh) 2022-02-17 2025-04-21 美商應用材料股份有限公司 (美國) 用於物理氣相沉積（ｐｖｄ）腔室中的準直器
TWD237985S (zh) 2022-02-17 2025-05-01 美商應用材料股份有限公司 (美國) 用於物理氣相沉積（pvd）腔室中的準直器
USD1026054S1 (en) * 2022-04-22 2024-05-07 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1024149S1 (en) 2022-12-16 2024-04-23 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1025936S1 (en) 2022-12-16 2024-05-07 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1026839S1 (en) 2022-12-16 2024-05-14 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1103950S1 (en) 2024-03-21 2025-12-02 Applied Materials, Inc. Process chamber collimator
USD1110979S1 (en) 2024-10-18 2026-02-03 Applied Materials, Inc. Process chamber collimator
USD1110289S1 (en) 2024-10-18 2026-01-27 Applied Materials, Inc. Process chamber collimator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM267462U (en) 2000-07-17 2005-06-11 Dura Tek Inc Collimator for sputtering apparatus
TWM346018U (en) 2008-03-14 2008-12-01 Everlight Electronics Co Ltd Alterable gear collimator
TW200938890A (en) 2008-03-14 2009-09-16 Everlight Electronics Co Ltd Alterable collimator and lightening module thereof
TW201724196A (zh) 2015-10-27 2017-07-01 應用材料股份有限公司 用於pvd濺射腔室的可偏壓通量優化器/準直器

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2061119C (en) * 1991-04-19 1998-02-03 Pei-Ing P. Lee Method of depositing conductors in high aspect ratio apertures
US5958193A (en) * 1994-02-01 1999-09-28 Vlsi Technology, Inc. Sputter deposition with mobile collimator
JPH07335552A (ja) * 1994-06-08 1995-12-22 Tel Varian Ltd 処理装置
US5643428A (en) * 1995-02-01 1997-07-01 Advanced Micro Devices, Inc. Multiple tier collimator system for enhanced step coverage and uniformity
US5702573A (en) * 1996-01-29 1997-12-30 Varian Associates, Inc. Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films
US5705042A (en) * 1996-01-29 1998-01-06 Micron Technology, Inc. Electrically isolated collimator and method
US6362097B1 (en) * 1998-07-14 2002-03-26 Applied Komatsu Technlology, Inc. Collimated sputtering of semiconductor and other films
US20030015421A1 (en) * 2001-07-20 2003-01-23 Applied Materials, Inc. Collimated sputtering of cobalt
US20030029715A1 (en) * 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
WO2003030224A2 (en) * 2001-07-25 2003-04-10 Applied Materials, Inc. Barrier formation using novel sputter-deposition method
EP1710324B1 (en) * 2005-04-08 2008-12-03 STMicroelectronics S.r.l. PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device
US7355192B2 (en) * 2006-03-30 2008-04-08 Intel Corporation Adjustable suspension assembly for a collimating lattice
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US20090308739A1 (en) * 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
KR20180019762A (ko) * 2008-06-17 2018-02-26 어플라이드 머티어리얼스, 인코포레이티드 균일한 증착을 위한 장치 및 방법
USD598717S1 (en) * 2008-09-19 2009-08-25 Dart Industries Inc. Can strainer
CA140095S (en) * 2010-10-29 2011-11-21 Unilever Plc Tea capsule
USD665071S1 (en) 2012-01-25 2012-08-07 Applied Materials, Inc. Deposition chamber liner
US9892890B2 (en) * 2012-04-26 2018-02-13 Intevac, Inc. Narrow source for physical vapor deposition processing
TWD159676S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159674S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159673S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159675S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD166552S (zh) 2013-01-25 2015-03-11 日立國際電氣股份有限公司 基板處理裝置用氣化器
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD722298S1 (en) * 2013-07-17 2015-02-10 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
USD759603S1 (en) * 2013-07-17 2016-06-21 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
US9831074B2 (en) * 2013-10-24 2017-11-28 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
USD746647S1 (en) * 2014-03-13 2016-01-05 Vienar Roaks Strainer
TWD178898S (zh) 2014-11-01 2016-10-11 米歇爾維尼希股份公司 開槽機
US9543126B2 (en) 2014-11-26 2017-01-10 Applied Materials, Inc. Collimator for use in substrate processing chambers
JP1535123S (zh) 2014-12-22 2015-10-13
JP1534915S (zh) 2014-12-22 2015-10-13
JP1534914S (zh) 2014-12-22 2015-10-13
USD753449S1 (en) * 2015-01-06 2016-04-12 WineStor, LLC Strainer for beverage shaker
JP1546799S (zh) 2015-06-12 2016-03-28
JP1546801S (zh) 2015-06-12 2016-03-28
JP1551512S (zh) 2015-06-12 2016-06-13
JP1564934S (zh) 2016-02-26 2016-12-05
USD805700S1 (en) * 2016-06-06 2017-12-19 Joe J. Owens, III Pet food bowl
USD821140S1 (en) * 2016-12-27 2018-06-26 Tristar Products, Inc. Steamer plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM267462U (en) 2000-07-17 2005-06-11 Dura Tek Inc Collimator for sputtering apparatus
TWM346018U (en) 2008-03-14 2008-12-01 Everlight Electronics Co Ltd Alterable gear collimator
TW200938890A (en) 2008-03-14 2009-09-16 Everlight Electronics Co Ltd Alterable collimator and lightening module thereof
TWI356916B (en) 2008-03-14 2012-01-21 Everlight Electronics Co Ltd Alterable collimator and lightening module thereof
TW201724196A (zh) 2015-10-27 2017-07-01 應用材料股份有限公司 用於pvd濺射腔室的可偏壓通量優化器/準直器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1038901S1 (en) * 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1025935S1 (en) * 2022-11-03 2024-05-07 Applied Materials, Inc. Collimator for a physical vapor deposition (PVD) chamber

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TWD200242S (zh) 2019-10-11
USD858468S1 (en) 2019-09-03

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