TWD211387S - 用於基板處理腔室的下屏蔽件 - Google Patents

用於基板處理腔室的下屏蔽件 Download PDF

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Publication number
TWD211387S
TWD211387S TW109300802F TW109300802F TWD211387S TW D211387 S TWD211387 S TW D211387S TW 109300802 F TW109300802 F TW 109300802F TW 109300802 F TW109300802 F TW 109300802F TW D211387 S TWD211387 S TW D211387S
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Taiwan
Prior art keywords
processing chamber
substrate processing
lower shield
design
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TW109300802F
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English (en)
Inventor
薩拉斯 巴布
安恩克斯納 朱普迪
岳生 歐
魏俊琪
泰銘 莫
和田優一
康 張
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美商應用材料股份有限公司
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Publication of TWD211387S publication Critical patent/TWD211387S/zh

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Abstract

【物品用途】;本設計係關於用於基板處理腔室的下屏蔽件之外觀設計。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。

Description

用於基板處理腔室的下屏蔽件
本設計係關於用於基板處理腔室的下屏蔽件之外觀設計。
圖式所揭露之虛線部分，為本案不主張設計之部分。
TW109300802F 2019-08-28 2020-02-20 用於基板處理腔室的下屏蔽件 TWD211387S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/703,658 2019-08-28
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Publications (1)

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TWD211387S true TWD211387S (zh) 2021-05-11

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TW109306129F TWD211584S (zh) 2019-08-28 2020-02-20 用於基板處理腔室的下屏蔽件
TW109300802F TWD211387S (zh) 2019-08-28 2020-02-20 用於基板處理腔室的下屏蔽件

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TW109306129F TWD211584S (zh) 2019-08-28 2020-02-20 用於基板處理腔室的下屏蔽件

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US (2) USD931241S1 (zh)
JP (2) JP1683052S (zh)
TW (2) TWD211584S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD227270S (zh) 2022-03-18 2023-09-01 美商應用材料股份有限公司 用於基板處理腔室的互鎖處理套件用的支撐管

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4217299B2 (ja) 1998-03-06 2009-01-28 東京エレクトロン株式会社 処理装置
US6974523B2 (en) 2001-05-16 2005-12-13 Lam Research Corporation Hollow anode plasma reactor and method
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
JP4141234B2 (ja) 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 プラズマ処理装置
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
JP2006060073A (ja) 2004-08-20 2006-03-02 Tokyo Electron Ltd プラズマ処理装置
US7651568B2 (en) 2005-03-28 2010-01-26 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
JP2009088298A (ja) 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
SG178287A1 (en) 2009-08-31 2012-03-29 Lam Res Corp A local plasma confinement and pressure control arrangement and methods thereof
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
CA142624S (en) * 2011-01-20 2012-01-25 Victaulic Co Of America Pipe
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
CN107452592B (zh) 2011-05-31 2019-11-12 应用材料公司 边缘保护板、边缘保护组件以及用于处理基板的设备
US9896769B2 (en) 2012-07-20 2018-02-20 Applied Materials, Inc. Inductively coupled plasma source with multiple dielectric windows and window-supporting structure
US20140124089A1 (en) * 2012-11-07 2014-05-08 Mark C. Schneider Sleeve for loading a dispensing device with bulk viscous material
JP1494712S (zh) 2013-05-15 2017-04-03
TWD169790S (zh) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD801928S1 (en) * 2014-10-17 2017-11-07 Ebara Corporation Rotor for rotary electrical machine
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
JP1546799S (zh) * 2015-06-12 2016-03-28
JP1546800S (zh) * 2015-06-12 2016-03-28
JP1551512S (zh) * 2015-06-12 2016-06-13
JP1546512S (zh) * 2015-09-04 2016-03-22
JP1556433S (zh) 2015-10-06 2016-08-15
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
JP1564934S (zh) * 2016-02-26 2016-12-05
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
KR102390323B1 (ko) 2016-08-26 2022-04-22 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 프로세싱 챔버를 위한 플라즈마 스크린
JP1584906S (zh) * 2017-01-31 2017-08-28
JP1584241S (zh) * 2017-01-31 2017-08-21
JP1584146S (zh) * 2017-01-31 2017-08-21
JP1584784S (zh) * 2017-01-31 2017-08-28
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
JP1591706S (zh) * 2017-02-28 2017-11-27
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode
JP1598442S (zh) * 2017-08-09 2018-02-26
JP1620194S (zh) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD227270S (zh) 2022-03-18 2023-09-01 美商應用材料股份有限公司 用於基板處理腔室的互鎖處理套件用的支撐管

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TWD211584S (zh) 2021-05-11
JP1683052S (zh) 2021-04-12
JP1684624S (zh) 2021-05-10
USD971167S1 (en) 2022-11-29
USD931241S1 (en) 2021-09-21

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