JP1620194S - - Google Patents
Info
- Publication number
- JP1620194S JP1620194S JPD2018-1070F JP2018001070F JP1620194S JP 1620194 S JP1620194 S JP 1620194S JP 2018001070 F JP2018001070 F JP 2018001070F JP 1620194 S JP1620194 S JP 1620194S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-1070F JP1620194S (zh) | 2018-01-22 | 2018-01-22 | |
| TW106307446D01F TWD195622S (zh) | 2018-01-22 | 2018-05-03 | Sealing cover inner cover |
| US29/649,486 USD855027S1 (en) | 2018-01-22 | 2018-05-30 | Cover of seal cap for reaction chamber of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-1070F JP1620194S (zh) | 2018-01-22 | 2018-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1620194S true JP1620194S (zh) | 2018-12-10 |
Family
ID=64560011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-1070F Active JP1620194S (zh) | 2018-01-22 | 2018-01-22 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD855027S1 (zh) |
| JP (1) | JP1620194S (zh) |
| TW (1) | TWD195622S (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1624334S (zh) * | 2018-05-18 | 2019-02-12 | ||
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD981973S1 (en) * | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
| USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
| USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5789810A (en) * | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
| USD642547S1 (en) * | 2010-05-26 | 2011-08-02 | Beat Untersee | Cover plate for electrical devices |
| USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
| US10211115B2 (en) * | 2014-05-21 | 2019-02-19 | Materion Corporation | Method of making a ceramic combo lid with selective and edge metallizations |
| USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TWD178424S (zh) * | 2016-01-08 | 2016-09-21 | ＡＳＭ知識產權私人控股有	 | 用於半導體製造設備的氣流控制板 |
| US9859185B2 (en) * | 2016-01-28 | 2018-01-02 | Kyocera International, Inc. | Semiconductor packaging structure and package having stress release structure |
| USD813181S1 (en) | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
| JP1598442S (zh) | 2017-08-09 | 2018-02-26 | ||
| USD840981S1 (en) * | 2017-10-20 | 2019-02-19 | Avery Dennison Retail Information Services, Llc | RFID inlay |
-
2018
- 2018-01-22 JP JPD2018-1070F patent/JP1620194S/ja active Active
- 2018-05-03 TW TW106307446D01F patent/TWD195622S/zh unknown
- 2018-05-30 US US29/649,486 patent/USD855027S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD855027S1 (en) | 2019-07-30 |
| TWD195622S (zh) | 2019-01-21 |