TWD195622S - Sealing cover inner cover - Google Patents

Sealing cover inner cover

Info

Publication number
TWD195622S
TWD195622S TW106307446D01F TW106307446D01F TWD195622S TW D195622 S TWD195622 S TW D195622S TW 106307446D01 F TW106307446D01 F TW 106307446D01F TW 106307446D01 F TW106307446D01 F TW 106307446D01F TW D195622 S TWD195622 S TW D195622S
Authority
TW
Taiwan
Prior art keywords
design
cover
inner cover
original design
sealing cover
Prior art date
Application number
TW106307446D01F
Other languages
English (en)
Inventor
岡嶋優作
西堂周平
吉田秀成
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD195622S publication Critical patent/TWD195622S/zh

Links

Abstract

【物品用途】;本設計的物品是密封蓋內罩，該內罩是設置成用來遮蓋供封閉半導體製造裝置之處理容器的開口的密封蓋(蓋體)，藉以保護密封蓋不會接觸到處理氣體。為了引導從內罩上面流入的氣體，故而在內罩緣部分，局部性地設有作為引導用的壁部。;【設計說明】;本衍生設計與原設計之外觀差異在於：由各立體圖及俯視圖、仰視圖觀之，本案的凹槽及圓孔數量與原設計案略有所不同，故與原設計案之差異些微，不影響原設計與衍生設計之近似。

Description

密封蓋內罩
本設計的物品是密封蓋內罩，該內罩是設置成用來遮蓋供封閉半導體製造裝置之處理容器的開口的密封蓋(蓋體)，藉以保護密封蓋不會接觸到處理氣體。為了引導從內罩上面流入的氣體，故而在內罩緣部分，局部性地設有作為引導用的壁部。
本衍生設計與原設計之外觀差異在於：由各立體圖及俯視圖、仰視圖觀之，本案的凹槽及圓孔數量與原設計案略有所不同，故與原設計案之差異些微，不影響原設計與衍生設計之近似。
TW106307446D01F 2018-01-22 2018-05-03 Sealing cover inner cover TWD195622S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-001070 2018-01-22
JPD2018-1070F JP1620194S (zh) 2018-01-22 2018-01-22

Publications (1)

Publication Number Publication Date
TWD195622S true TWD195622S (zh) 2019-01-21

Family

ID=64560011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106307446D01F TWD195622S (zh) 2018-01-22 2018-05-03 Sealing cover inner cover

Country Status (3)

Country Link
US (1) USD855027S1 (zh)
JP (1) JP1620194S (zh)
TW (1) TWD195622S (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1624334S (zh) * 2018-05-18 2019-02-12
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD981973S1 (en) * 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US10211115B2 (en) * 2014-05-21 2019-02-19 Materion Corporation Method of making a ceramic combo lid with selective and edge metallizations
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD178424S (zh) * 2016-01-08 2016-09-21 ＡＳＭ知識產權私人控股有&#x9 用於半導體製造設備的氣流控制板
US9859185B2 (en) * 2016-01-28 2018-01-02 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1598442S (zh) 2017-08-09 2018-02-26
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay

Also Published As

Publication number Publication date
JP1620194S (zh) 2018-12-10
USD855027S1 (en) 2019-07-30

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