TWD193014S - Sealing cover inner cover - Google Patents
Sealing cover inner coverInfo
- Publication number
- TWD193014S TWD193014S TW106307446F TW106307446F TWD193014S TW D193014 S TWD193014 S TW D193014S TW 106307446 F TW106307446 F TW 106307446F TW 106307446 F TW106307446 F TW 106307446F TW D193014 S TWD193014 S TW D193014S
- Authority
- TW
- Taiwan
- Prior art keywords
- cover
- inner cover
- sealing
- sealing cover
- article
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 1
Abstract
【物品用途】;本設計的物品是密封蓋內罩，該內罩是設置成用來遮蓋供封閉半導體製造裝置之處理容器的開口的密封蓋(蓋體)，藉以保護密封蓋不會接觸到處理氣體。為了引導從內罩上面流入的氣體，故而在內罩緣部分，局部性地設有作為引導用的壁部。;【設計說明】;(無)
Description
本設計的物品是密封蓋內罩，該內罩是設置成用來遮蓋供封閉半導體製造裝置之處理容器的開口的密封蓋(蓋體)，藉以保護密封蓋不會接觸到處理氣體。為了引導從內罩上面流入的氣體，故而在內罩緣部分，局部性地設有作為引導用的壁部。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-017193 | 2017-08-09 | ||
| JPD2017-17193F JP1598442S (zh) | 2017-08-09 | 2017-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD193014S true TWD193014S (zh) | 2018-09-21 |
Family
ID=61232739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106307446F TWD193014S (zh) | 2017-08-09 | 2017-12-20 | Sealing cover inner cover |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD872037S1 (zh) |
| JP (1) | JP1598442S (zh) |
| TW (1) | TWD193014S (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1620194S (zh) | 2018-01-22 | 2018-12-10 | ||
| JP1624334S (zh) | 2018-05-18 | 2019-02-12 | ||
| JP1638504S (zh) | 2018-12-06 | 2019-08-05 | ||
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD929198S1 (en) * | 2019-09-16 | 2021-08-31 | David Gysland | Tungsten grinder |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| USD560284S1 (en) * | 2005-03-30 | 2008-01-22 | Tokyo Electron Limited | Cover ring |
| USD616390S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
| USD732480S1 (en) * | 2012-12-20 | 2015-06-23 | Patrick Alan Watson | Snap electrical connector assembly |
| US9028261B2 (en) * | 2013-04-09 | 2015-05-12 | Patrick Alan Watson | Snap electrical connector having a circumferential groove and prong interconnection |
| USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
| JP1579504S (zh) | 2016-07-26 | 2017-06-19 | ||
| USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
-
2017
- 2017-08-09 JP JPD2017-17193F patent/JP1598442S/ja active Active
- 2017-12-20 TW TW106307446F patent/TWD193014S/zh unknown
-
2018
- 2018-01-30 US US29/635,319 patent/USD872037S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD872037S1 (en) | 2020-01-07 |
| JP1598442S (zh) | 2018-02-26 |
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