USD855027S1 - Cover of seal cap for reaction chamber of semiconductor - Google Patents

Cover of seal cap for reaction chamber of semiconductor Download PDF

Info

Publication number
USD855027S1
USD855027S1 US29/649,486 US201829649486F USD855027S US D855027 S1 USD855027 S1 US D855027S1 US 201829649486 F US201829649486 F US 201829649486F US D855027 S USD855027 S US D855027S
Authority
US
United States
Prior art keywords
cover
semiconductor
reaction chamber
seal cap
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/649,486
Other languages
English (en)
Inventor
Yusaku OKAJIMA
Shuhei SAIDO
Hidenari YOSHIDA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU, SAIDO, SHUHEI, YOSHIDA, HIDENARI
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
Application granted granted Critical
Publication of USD855027S1 publication Critical patent/USD855027S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/649,486 2018-01-22 2018-05-30 Cover of seal cap for reaction chamber of semiconductor Active USD855027S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-001070 2018-01-22
JPD2018-1070F JP1620194S (zh) 2018-01-22 2018-01-22

Publications (1)

Publication Number Publication Date
USD855027S1 true USD855027S1 (en) 2019-07-30

Family

ID=64560011

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/649,486 Active USD855027S1 (en) 2018-01-22 2018-05-30 Cover of seal cap for reaction chamber of semiconductor

Country Status (3)

Country Link
US (1) USD855027S1 (zh)
JP (1) JP1620194S (zh)
TW (1) TWD195622S (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD981973S1 (en) * 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1598442S (zh) 2017-08-09 2018-02-26
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1598442S (zh) 2017-08-09 2018-02-26
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD981973S1 (en) * 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus

Also Published As

Publication number Publication date
JP1620194S (zh) 2018-12-10
TWD195622S (zh) 2019-01-21

Similar Documents

Publication Publication Date Title
USD813181S1 (en) Cover of seal cap for reaction chamber of semiconductor
USD906106S1 (en) Cap seal for bottle cap
USD900537S1 (en) Bottle lid
USD878054S1 (en) Sealing lid
USD900536S1 (en) Bottle lid
USD900538S1 (en) Bottle lid
USD855027S1 (en) Cover of seal cap for reaction chamber of semiconductor
USD946345S1 (en) Bottle lid
USD917960S1 (en) Bottle lid
USD917953S1 (en) Bottle lid
USD895352S1 (en) Bottle lid
USD893956S1 (en) Water bottle
USD885120S1 (en) Bottle lid
USD917956S1 (en) Bottle lid
USD917955S1 (en) Bottle lid
USD901307S1 (en) Container for facial mask
USD860793S1 (en) Bottle
USD917954S1 (en) Bottle lid
USD872037S1 (en) Cover of seal cap for reaction chamber for semiconductor manufacturing
USD917959S1 (en) Bottle lid
USD920114S1 (en) Combined spout and cap
USD916037S1 (en) Cover of seal cap for reaction chamber for semiconductor
USD867873S1 (en) Container
USD881576S1 (en) Sealing tote
USD917958S1 (en) Bottle lid

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY