USD855027S1 - Cover of seal cap for reaction chamber of semiconductor - Google Patents
Cover of seal cap for reaction chamber of semiconductor Download PDFInfo
- Publication number
- USD855027S1 USD855027S1 US29/649,486 US201829649486F USD855027S US D855027 S1 USD855027 S1 US D855027S1 US 201829649486 F US201829649486 F US 201829649486F US D855027 S USD855027 S US D855027S
- Authority
- US
- United States
- Prior art keywords
- cover
- semiconductor
- reaction chamber
- seal cap
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-001070 | 2018-01-22 | ||
JPD2018-1070F JP1620194S (zh) | 2018-01-22 | 2018-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD855027S1 true USD855027S1 (en) | 2019-07-30 |
Family
ID=64560011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/649,486 Active USD855027S1 (en) | 2018-01-22 | 2018-05-30 | Cover of seal cap for reaction chamber of semiconductor |
Country Status (3)
Country | Link |
---|---|
US (1) | USD855027S1 (zh) |
JP (1) | JP1620194S (zh) |
TW (1) | TWD195622S (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD916037S1 (en) * | 2018-05-18 | 2021-04-13 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD981973S1 (en) * | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5789810A (en) * | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
USD642547S1 (en) * | 2010-05-26 | 2011-08-02 | Beat Untersee | Cover plate for electrical devices |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
US20170221790A1 (en) * | 2016-01-28 | 2017-08-03 | Kyocera International, Inc. | Semiconductor packaging structure and package having stress release structure |
US20170229360A1 (en) * | 2014-05-21 | 2017-08-10 | Materion Corporation | Ceramic combo lid with selective and edge metallizations |
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
JP1598442S (zh) | 2017-08-09 | 2018-02-26 | ||
USD813181S1 (en) | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
USD840981S1 (en) * | 2017-10-20 | 2019-02-19 | Avery Dennison Retail Information Services, Llc | RFID inlay |
-
2018
- 2018-01-22 JP JPD2018-1070F patent/JP1620194S/ja active Active
- 2018-05-03 TW TW106307446D01F patent/TWD195622S/zh unknown
- 2018-05-30 US US29/649,486 patent/USD855027S1/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5789810A (en) * | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
USD642547S1 (en) * | 2010-05-26 | 2011-08-02 | Beat Untersee | Cover plate for electrical devices |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
US20170229360A1 (en) * | 2014-05-21 | 2017-08-10 | Materion Corporation | Ceramic combo lid with selective and edge metallizations |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
US20170221790A1 (en) * | 2016-01-28 | 2017-08-03 | Kyocera International, Inc. | Semiconductor packaging structure and package having stress release structure |
USD813181S1 (en) | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
JP1598442S (zh) | 2017-08-09 | 2018-02-26 | ||
USD840981S1 (en) * | 2017-10-20 | 2019-02-19 | Avery Dennison Retail Information Services, Llc | RFID inlay |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD916037S1 (en) * | 2018-05-18 | 2021-04-13 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD981973S1 (en) * | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1620194S (zh) | 2018-12-10 |
TWD195622S (zh) | 2019-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |