TWD215401S - 基板處理腔室的製程護罩 - Google Patents
基板處理腔室的製程護罩 Download PDFInfo
- Publication number
- TWD215401S TWD215401S TW109305253D01F TW109305253D01F TWD215401S TW D215401 S TWD215401 S TW D215401S TW 109305253D01 F TW109305253D01 F TW 109305253D01F TW 109305253D01 F TW109305253D01 F TW 109305253D01F TW D215401 S TWD215401 S TW D215401S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- processing chamber
- substrate processing
- process shield
- derivative
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本衍生設計所請求之基板處理腔室的製程護罩係用於半導體製程。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。;本衍生設計與原設計不同之處在於以虛線呈現部分的外觀。
Description
本衍生設計所請求之基板處理腔室的製程護罩係用於半導體製程。
圖式所揭露之虛線部分,為本案不主張設計之部分。
本衍生設計與原設計不同之處在於以虛線呈現部分的外觀。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/728,820 | 2020-03-20 | ||
| US29/728,820 USD941371S1 (en) | 2020-03-20 | 2020-03-20 | Process shield for a substrate processing chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD215401S true TWD215401S (zh) | 2021-11-21 |
Family
ID=78000911
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109305253F TWD215400S (zh) | 2020-03-20 | 2020-09-18 | 基板處理腔室的製程護罩 |
| TW109305253D01F TWD215401S (zh) | 2020-03-20 | 2020-09-18 | 基板處理腔室的製程護罩 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109305253F TWD215400S (zh) | 2020-03-20 | 2020-09-18 | 基板處理腔室的製程護罩 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD941371S1 (zh) |
| JP (2) | JP1696763S (zh) |
| TW (2) | TWD215400S (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1042374S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1042373S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| USD1055006S1 (en) | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| US12080522B2 (en) | 2020-04-22 | 2024-09-03 | Applied Materials, Inc. | Preclean chamber upper shield with showerhead |
| USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
| USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TWD235071S (zh) * | 2020-12-10 | 2024-12-01 | 日商紐富來科技股份有限公司 (日本) | 頂板 |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD980887S1 (en) * | 2021-03-18 | 2023-03-14 | Illinois Tool Works Inc. | Chamber |
| USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
| GB2635058A (en) | 2022-07-08 | 2025-04-30 | Tosoh Smd Inc | Dynamic vacuum seal system for physical vapor deposition sputter applications |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| JP1746769S (ja) * | 2023-01-31 | 2023-06-20 | 複合シール材 | |
| USD1109856S1 (en) * | 2023-07-07 | 2026-01-20 | Tosoh Smd, Inc. | Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5320728A (en) * | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
| USD351450S (en) * | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
| USD376744S (en) * | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
| USD381030S (en) * | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
| AU129071S (en) * | 1996-06-07 | 1997-01-14 | Riteflite Pty Ltd | Target |
| USD403337S (en) * | 1997-08-05 | 1998-12-29 | Applied Materials, Inc. | High conductance low wall deposition upper shield |
| USD403002S (en) * | 1998-01-27 | 1998-12-22 | Semiconductor Equipment Technology, Inc. | Shield and cover for target of sputter coating apparatus |
| USD403334S (en) * | 1998-01-27 | 1998-12-29 | Semiconductor Equipment Technology, Inc | Shield and cover for target of sputter coating apparatus |
| USD401252S (en) * | 1998-01-27 | 1998-11-17 | Semiconductor Equipment Technology | Shield and cover for target of sputter coating apparatus |
| USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| USD559066S1 (en) * | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
| US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| US8371904B2 (en) * | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
| USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
| US9834840B2 (en) | 2010-05-14 | 2017-12-05 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| WO2012142408A2 (en) * | 2011-04-14 | 2012-10-18 | Veeco Instruments Inc. | Substrate holders and methods of substrate mounting |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
| USD703162S1 (en) * | 2012-10-17 | 2014-04-22 | Sumitomo Electric Industries, Ltd. | Wafer holder for stepper |
| US9475996B2 (en) * | 2012-10-17 | 2016-10-25 | Richard Max Mandle | Centrifugal fluid ring plasma reactor |
| KR20150101470A (ko) * | 2013-01-04 | 2015-09-03 | 토소우 에스엠디, 인크 | 보강된 표면 프로파일 및 개선된 성능을 갖는 실리콘 스퍼터링 타겟 및 그 제조 방법 |
| TWD169790S (zh) * | 2013-07-10 | 2015-08-11 | 日立國際電氣股份有限公司 | 基板處理裝置用氣化器之部分 |
| USD741921S1 (en) * | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
| USD738451S1 (en) * | 2014-11-11 | 2015-09-08 | Mary Olson | Golf ball target for chipping and putting |
| US10546733B2 (en) | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| KR102709082B1 (ko) | 2015-07-03 | 2024-09-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 높은 증착 링 및 증착 링 클램프를 갖는 프로세스 키트 |
| US10174437B2 (en) * | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
| JP1549882S (zh) * | 2015-08-18 | 2016-05-23 | ||
| US10103012B2 (en) | 2015-09-11 | 2018-10-16 | Applied Materials, Inc. | One-piece process kit shield for reducing the impact of an electric field near the substrate |
| USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| TWD178424S (zh) * | 2016-01-08 | 2016-09-21 | Asm Ip Holding Bv | 用於半導體製造設備的氣流控制板 |
| CN110036136B (zh) | 2016-11-19 | 2022-05-24 | 应用材料公司 | 具有浮动遮蔽环的工艺配件 |
| US11158491B2 (en) * | 2017-06-01 | 2021-10-26 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
| US10998172B2 (en) | 2017-09-22 | 2021-05-04 | Applied Materials, Inc. | Substrate processing chamber having improved process volume sealing |
| JP1605779S (zh) | 2017-12-19 | 2018-06-04 | ||
| USD880437S1 (en) * | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| JP1646366S (zh) | 2019-03-19 | 2019-11-25 | ||
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
-
2020
- 2020-03-20 US US29/728,820 patent/USD941371S1/en active Active
- 2020-09-14 JP JPD2021-4565F patent/JP1696763S/ja active Active
- 2020-09-14 JP JPD2020-19524F patent/JP1696666S/ja active Active
- 2020-09-18 TW TW109305253F patent/TWD215400S/zh unknown
- 2020-09-18 TW TW109305253D01F patent/TWD215401S/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1042374S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1042373S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| USD1055006S1 (en) | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1696763S (zh) | 2021-10-11 |
| JP1696666S (zh) | 2021-10-11 |
| USD941371S1 (en) | 2022-01-18 |
| TWD215400S (zh) | 2021-11-21 |
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