TWD215717S - 用於處理腔室的具噴頭的上護罩 - Google Patents

用於處理腔室的具噴頭的上護罩 Download PDF

Info

Publication number
TWD215717S
TWD215717S TW109305849D01F TW109305849D01F TWD215717S TW D215717 S TWD215717 S TW D215717S TW 109305849D01 F TW109305849D01 F TW 109305849D01F TW 109305849D01 F TW109305849D01 F TW 109305849D01F TW D215717 S TWD215717 S TW D215717S
Authority
TW
Taiwan
Prior art keywords
design
upper shield
showerhead
process chamber
derivative
Prior art date
Application number
TW109305849D01F
Other languages
English (en)
Inventor
薩拉斯 巴布
安恩克斯納 朱普迪
岳生 歐
魏俊琪
泰銘 莫
康 張
和田優一
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215717S publication Critical patent/TWD215717S/zh

Links

Images

Abstract

【物品用途】;本設計係關於用於處理腔室的具噴頭的上護罩之外觀設計。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;本衍生設計案與原設計(第109305849號申請案)案差異在於，本衍生設計之上護罩的中央圓環的內表面係以虛線表示(即不主張設計之部分)。

Description

用於處理腔室的具噴頭的上護罩
本設計係關於用於處理腔室的具噴頭的上護罩之外觀設計。
圖式所揭露之虛線部分，為本案不主張設計之部分。
本衍生設計案與原設計(第109305849號申請案)案差異在於，本衍生設計之上護罩的中央圓環的內表面係以虛線表示(即不主張設計之部分)。
TW109305849D01F 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩 TWD215717S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/732,229 2020-04-22
US29/732,229 USD973609S1 (en) 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber

Publications (1)

Publication Number Publication Date
TWD215717S true TWD215717S (zh) 2021-12-01

Family

ID=84568644

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305849F TWD215716S (zh) 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩
TW109305849D01F TWD215717S (zh) 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109305849F TWD215716S (zh) 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩

Country Status (2)

Country Link
US (1) USD973609S1 (zh)
TW (2) TWD215716S (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1646504S (zh) * 2018-12-06 2019-11-25
JP1646505S (zh) * 2018-12-07 2019-11-25

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401319A (en) 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
JP4141234B2 (ja) * 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 プラズマ処理装置
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
JP2009088298A (ja) * 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US9245717B2 (en) 2011-05-31 2016-01-26 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
US9121097B2 (en) 2012-08-31 2015-09-01 Novellus Systems, Inc. Variable showerhead flow by varying internal baffle conductance
TWD161688S (zh) * 2012-12-27 2014-07-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1537312S (zh) * 2014-11-20 2015-11-09
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
JP1546799S (zh) * 2015-06-12 2016-03-28
JP1551512S (zh) * 2015-06-12 2016-06-13
WO2018057396A1 (en) 2016-09-23 2018-03-29 Applied Materials, Inc. Sputtering showerhead
JP1584241S (zh) * 2017-01-31 2017-08-21
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1625995S (zh) 2018-04-20 2019-03-04
JP1625994S (zh) 2018-04-20 2019-03-04
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
US20210335581A1 (en) * 2020-04-22 2021-10-28 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20220223367A1 (en) * 2021-01-12 2022-07-14 Applied Materials, Inc. Reduced substrate process chamber cavity volume

Also Published As

Publication number Publication date
USD973609S1 (en) 2022-12-27
TWD215716S (zh) 2021-12-01

Similar Documents

Publication Publication Date Title
TWD215403S (zh) 用於基板處理腔室的沉積環
TWD207742S (zh) 用於基材處理室的處理遮罩件
TWD210178S (zh) 筋膜槍按摩頭
TWD208448S (zh) 筋膜槍按摩頭
TWD214316S (zh) 基板處理腔室的內部護罩
TWD215717S (zh) 用於處理腔室的具噴頭的上護罩
TWD215401S (zh) 基板處理腔室的製程護罩
TWD210892S (zh) 用於基板處理腔室的沉積環
TWD217686S (zh) 用於半導體處理腔室的沉積環
TWD215399S (zh) 基板處理腔室的製程護罩
TWD203316S (zh) 蓮蓬頭
TWD210894S (zh) 用於基材處理室的處理遮罩件
TWD224063S (zh) 噴槍
TWD205603S (zh) 噴頭
TWD217045S (zh) 基座支撐部
TWD211584S (zh) 用於基板處理腔室的下屏蔽件
TWD206011S (zh) 包裝用膜
TWD224062S (zh) 噴槍
TWD215697S (zh) 用於基板處理腔室的限制襯墊
TWD206033S (zh) 蓮蓬頭架
TWD201748S (zh) 首飾之部分
TWD208450S (zh) 筋膜槍按摩頭
TWD223114S (zh) 眼鏡的部分
TWD205927S (zh) 擺飾品之部分
TWD206037S (zh) 蓮蓬頭